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Silicon-Organic hybrid Fabrication platform for Integrated circuits Kick-off Meeting 01/08/2010 Partner Presentations - UKA.

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Presentation on theme: "Silicon-Organic hybrid Fabrication platform for Integrated circuits Kick-off Meeting 01/08/2010 Partner Presentations - UKA."— Presentation transcript:

1 Silicon-Organic hybrid Fabrication platform for Integrated circuits Kick-off Meeting 01/08/2010 Partner Presentations - UKA

2 Silicon-Organic hybrid Fabrication platform for Integrated circuits 2 UKA Contribution Main focus on Design of waveguide (WG) structures Optical properties Electrode design From single WG to complex structures Poling of certain nonlinear materials Characterizing, benchmarking Supporting Search for novel applications Waveguide roughness optimization RF issues …

3 Silicon-Organic hybrid Fabrication platform for Integrated circuits 3 WP 2 – Value Analysis and Emerging Applications Development Task 2.1Contribute to definition of application and device specifications Task 2.2 Contribute to modeling of devices and system for communications applications Focus on Task 2.4Look into possibilities for light amplification and sensor applications -Light emission -Find application of sensors  Technical challenge! 6 person months (PMs)

4 Silicon-Organic hybrid Fabrication platform for Integrated circuits 4 WP 3,Task 3.1 Lead Optical Chip Design and the corresponding deliverables and milestones (18 PMs) M3.1, M3.3, M3.4mark design decisions (months 7, 16, 18) D3.1, D3.3, D3.5lead by UKA, to report on design and fabrication of active waveguides / modulators (months 12, 21, 32)

5 Silicon-Organic hybrid Fabrication platform for Integrated circuits 5 WP3, Synchronization with Task 3.7 Device Fabrication MPW shuttleTechnologySign-in MaskDelivery IMEC6IMEC STD Passive 15 April MayJuly 2010 IMEC7IMEC STD Passive+ 15 October November 2010 Jan-Feb 2011

6 Silicon-Organic hybrid Fabrication platform for Integrated circuits 6 WP3, Task 3.2 – Passive waveguide process optimization Waveguide fabrication determines sidewall roughness  losses (4 PMs) Post-processing using Preferential Wet Etching (anisotopic etching)

7 Silicon-Organic hybrid Fabrication platform for Integrated circuits 7 WP 3 – Silicon Photonic Chips Task 3.3 Provide input for the doping process Task 3.4 Provide input for the contacting process Task 3.5 Electrical design: Perform the theoretical calculations and work on impedance matching designs for the electrical design (3 PMs)

8 Silicon-Organic hybrid Fabrication platform for Integrated circuits 8 WP 4 – Organic Material Task 4.1Design, synthesis, deposition and optimization of electro-optic polymers (1 PM)  perform in-device poling Task 4.4Deposition of electro-optic chalcogenide glasses  contribute to find a way to use electro-optic effect (1 PM) These poling efforts go along with simultaneous optical characterization Task 4.5Characterization of poled and self-assembled materials (2 PMs)

9 Silicon-Organic hybrid Fabrication platform for Integrated circuits 9 WP 5 - Testing, Packaging and Reliability Task 5.1Testing and characterization of the chip lead by UKA (2 PMs)  perform chip level testing  measurement of the power consumption M5.1[6/30/11]Identification of optimal phase modulator structure D5.1[6/30/11]Report on electro-optical characterization of SOH waveguide structures with RF probes D5.4[10/31/12] Report on electro-optical characterization of more complex modulator structures with RF probes Task 5.2 Design and development of the RF package (1 PM)  UKA will perform prototype RF package testing Task 5.4Characterization and benchmarking of packaged devices and integrated circuits against specifications and reference devices, lead by UKA (3 PMs)  UKA will perform electro-optic characterization

10 Silicon-Organic hybrid Fabrication platform for Integrated circuits 10 WP 6 – Dissemination, Exploitation and Promotion Contributions to Task 6.1Dissemination of results Task 6.2 Exploitation of results Task 6.3Promotion of Results In particular M6.1[1/31/10], M6.6[12/31/12] Dissemination of activities on the project’s website M6.2[2/28/10], M6.7 [12/31/12] Press releases on start and finish of the project M6.5[before 10/31/12] Organization of workshop by integrating it into a larger convention on silicon polymer hybrid technology  shared effort (2 PMs)

11 Silicon-Organic hybrid Fabrication platform for Integrated circuits 11 Contacts See contact list on webpage! Coordinator:Juerg Leuthold cc WP1..WP4, WP6:Dietmar Korn WP5:David Hillerkuß Thank you!

12 Silicon-Organic hybrid Fabrication platform for Integrated circuits Kick-off Meeting 01/08/2010 Partner Presentations

13 Silicon-Organic hybrid Fabrication platform for Integrated circuits Kick-off Meeting 01/08/2010 Lunch!

14 Silicon-Organic hybrid Fabrication platform for Integrated circuits Kick-off Meeting 01/08/2010 Work Package Discussion

15 Silicon-Organic hybrid Fabrication platform for Integrated circuits Kick-off Meeting 01/08/2010 Summary & Action Items

16 Silicon-Organic hybrid Fabrication platform for Integrated circuits 16 Action Items Send in Accession Form, Financial Identification Agree on Consortium Agreement Send in logos Complete contact list Keep the Quarterly Management Report in mind Enjoy Zurich!


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