Presentation is loading. Please wait.

Presentation is loading. Please wait.

Silicon-Organic hybrid Fabrication platform for Integrated circuits 1 Meeting in Turin, 2010.

Similar presentations


Presentation on theme: "Silicon-Organic hybrid Fabrication platform for Integrated circuits 1 Meeting in Turin, 2010."— Presentation transcript:

1 Silicon-Organic hybrid Fabrication platform for Integrated circuits 1 Meeting in Turin, 2010

2 Silicon-Organic hybrid Fabrication platform for Integrated circuits 2 Particpants UKA: Juerg Leuthold, Luca Alloatti SELEX: Alberto Secchi (design) Massiliano Dispenza (not here, head) Luigi (not here) IMEC: Pieter Dumon, (instead of Wim Bogarts) Hui Yu RB: Peter Günter GO: Giulio Cangini, Jörg Wieland, perhaps Raluca Dinu AIT: Ioannis Tomkos Arvind Mishra (not attend) CUDOS: Ben Eggleton

3 Silicon-Organic hybrid Fabrication platform for Integrated circuits 3 AGENDA 9am - 4pm 1.Administrative remarks 2.Partner presentations (activities, publications, expenses) 1.UKA (KIT) 2.Australia-Partner 3.GO 4.IMEC 5.SELEX 6.RB 7.AIT 3.Deadlines 4.Open Issues? 5.Summary and action items

4 Silicon-Organic hybrid Fabrication platform for Integrated circuits Meeting in Turin09/24/2010 Administrative Remarks

5 Silicon-Organic hybrid Fabrication platform for Integrated circuits 5 Short Remarks Practical: Meeting room fees collected? 280€ room (i.4. 40 € per Partner), 25€ lunch per person Who has to leave when today? Adminstrative: Hand in your QMR3 contribution as soon as possible! QMR3 must be send to EC on Thursday next week. Send publications referring to SOFI to coordinator, to be made available online (link). Soon: Brussels concertation meeting 20.10.2010 (G. Cangini, D. Korn) SOFI project will be presented In this context some standard SOFI presentation slides will be created, your input (1-2 slides) might be requested soon

6 Silicon-Organic hybrid Fabrication platform for Integrated circuits 6 Alloatti will write the Protocol Mojca: status of LETI produced chips – promised until September / October (even though not with perfectly covered single crystalline domains) SELEX needs to be doing to do optical packaging. Concept must be handed in. 1) RF-packaging, i.e. how to get the signal from cable onto some electrical lines on the chip, 2) RF-design of the modulator electrodes, i.e. how to get the signal of the lines from 1) to the actual modulator electrodes, and how to design these electrodes. (KIT & Selex) Robert Palmer to visit SELEX soon

7 Silicon-Organic hybrid Fabrication platform for Integrated circuits 7 Giulio (GO ) white paper: Suggest him to come up with a draft CUDOS: Whento start task 4.4 “Deposition of electro-optic chalcogenide glasses” (From DoW); how does this work? (contact person Steve Madden) In WP5 CUDOS will characterize chips with their material; Who is going to follow Christelle Monat (CUDOS), she was the scientific contact for SOFI? CUDOS will be handed out the contract Luca: Ask Pieter about Si-Carbide layer! MMI reflectivities…

8 Silicon-Organic hybrid Fabrication platform for Integrated circuits 8 Next Meetings Leuven / Gent / Karlsruhe / Rome / Zurich, beginning next year (preparation of review) (e.g. January 14, 2011) Brussels review meeting (after submission of annual report) OFC 2011 (March 6-10, 2011), Los Angles ECOC 2011 (September 18-22, 2011), Geneva Vote!

9 Silicon-Organic hybrid Fabrication platform for Integrated circuits Partner Presentations Meeting in Turin09/24/2010

10 Silicon-Organic hybrid Fabrication platform for Integrated circuits 10 Partner Presentations 1.AIT 2.IMEC 3.RB 4.UKA 5.SELEX 6.GO

11 Silicon-Organic hybrid Fabrication platform for Integrated circuits 11 Checklist Have these points been addressed? CUDOS: Deposition possibilities IMEC: SiC layer consequences for poling IMEC & SELEX: CMOS microwave integrated circuit design with respect to metalization SELEX: RF and optical packaging UKA-SELEX meeting at Rome? GO: Whitepaper on “Progress in Silicon Photonics”

12 Silicon-Organic hybrid Fabrication platform for Integrated circuits 12 Deadlines - Soon UKAD1.10Quarterly Management Report (QMR)Sep 30 '10 UKAD1.5aFirst year annual report. (within 60 days after reporting period) This deliverable is most critical for the subsequent review!!! Dec 31 '10 + 60d UKAD1.5bPublic executive summary of the first year annual report.Dec 31 '10 + 60d UKAD3.1Report on design and fabrication of active waveguides (first device run). Dec 31 '10 IMECD3.2Silicon wafers with active waveguides (first device run).Dec 31 '10 IMECM3.2First-stage process for integrated slot waveguides with contacts...Dec 31 '10 RBM4.1Optimized processes for electro-optic polymers and epitaxial self- assembly with sufficient yield Dec 31 '10 GOD6.1First report on SOFI dissemination and promotion activities.Dec 31 '10 AITD6.2First report on SOFI exploitation activities.Dec 31 '10 GO D6.3Mirror Deliverable of D6.1, which will be available to the public on the website. Dec 31 '10

13 Silicon-Organic hybrid Fabrication platform for Integrated circuits 13 Deadlines – Next Year 1 GO/AITM6.3Identification of possible contributions to the industrial partners for commercialization and standardization. Mar 31 '11 RB,GOD4.1Silicon-organic chips with electro-optic waveguides (first device run).Mar 31 '11 UKAD1.11Quarterly Management Report (QMR)Mar 31 '11 UKAM3.3Decision on QAM modulator designs (for second device run, with modulators modelled to perform better than in M3.1 Apr 30 '11 AITD6.11Intermediate report on recent achievements.Jun 30 '11 UKAM5.1Identification of optimal phase modulator structure promising 100 Gbit/s operation at 1 VJun 30 '11 UKAD5.1Report on electro-optical characterizations of SOH waveguide structures with RF probes (UKA). Jun 30 '11 CUDOSM4.2Processes for chalcogenides.Jun 30 '11 AITM2.4Derivation of the system-level specification of the developed hybrid components.Jun 30 '11 AITM2.3Development of a system and device simulation platform.Jun 30 '11 UKAD1.12Quarterly Management Report (QMR) Jun 30 '11 SELEXM5.2Optimized RF package design with optical and electrical performances suitable for 100 Gbit/s operation Aug 31 '11 RBM4.3Identification of optimal electro-optic materials with respect to optical and electro-optical properties and to thermal stab Aug 31 '11

14 Silicon-Organic hybrid Fabrication platform for Integrated circuits 14 Deadlines – Next Year 2 IMECD3.4Silicon wafers with QAM modulators (second device run).Sep 30 '11 UKAD3.3Report on design and fabrication of QAM modulators (second device run).Sep 30 '11 UKAD1.13Quarterly Management Report (QMR)Sep 30 '11 GOD6.6Mirror Deliverable of D6.4 which will be available to the public on the website.Dec 31 '11 AITD6.5Second report on SOFI exploitation activities.Dec 31 '11 GOD6.4Second report on SOFI dissemination and promotion activities.Dec 31 '11 RBM4.4Identification of optimal electro-optic materials with respect to integration into silicon...Dec 31 '11 RB,GOD4.3Silion-organic QAM modulator chips (second device run).Dec 31 '11 RBD4.2Report on full potential and limitations of the electro-optic materials for hybrid integration.Dec 31 '11 AITD2.2Investigation of system-level specifications.Dec 31 '11 UKAD1.6bPublic executive summary of the second year annual reportDec 31 '11 UKAD1.6aSecond year annual reportDec 31 '11 SELEXD5.2Report on device measurements of RF packaged phase modulators and benchmarking against reference LiNbO3 modulators. Jan 31 '12

15 Silicon-Organic hybrid Fabrication platform for Integrated circuits Open Issues? Meeting in Turin09/24/2010

16 Silicon-Organic hybrid Fabrication platform for Integrated circuits Summary & Action Items Meeting in Turin09/24/2010

17 Silicon-Organic hybrid Fabrication platform for Integrated circuits 17 Summary & Action Items Hand in your QMR3 contribution as soon as possible, including expenses information! Review this deliverable of September (D1.10 QMR3) on Wednesday next week List to be extended during meeting!

18 Silicon-Organic hybrid Fabrication platform for Integrated circuits 18 Eggleton: Collaboration with Saphicon Follow up on IMEC: Implants need to be discussed (p, n and what (P, As, P)) IMEC schedule: Oct. KIT needs to provide Ion Implang masks and metallization


Download ppt "Silicon-Organic hybrid Fabrication platform for Integrated circuits 1 Meeting in Turin, 2010."

Similar presentations


Ads by Google