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Report on INFN activities CHIPIX65 - project L. Demaria - INFN activities of CHIPIX651 L.Demaria on behalf of CHIPIX65 project.

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Presentation on theme: "Report on INFN activities CHIPIX65 - project L. Demaria - INFN activities of CHIPIX651 L.Demaria on behalf of CHIPIX65 project."— Presentation transcript:

1 Report on INFN activities CHIPIX65 - project L. Demaria - INFN activities of CHIPIX651 L.Demaria on behalf of CHIPIX65 project

2 Challenges for CHIPIX65 1. Design of innovative electronics in strategic area of INFN, using the “novel” CMOS 65nm technology, with a large participation of INFN community 2.INFN is one of founding members of RD53, an international collaboration for the R&D phase of an innovative chip for the pixel detector of ATLAS and CMS at HL_LHC, and the goals of RD53 are the main focus of CHIPIX65 milestones: 1.Small pixels: 50x50um 2 (or 25x100um 2 ) 2.Large chips:>2cm x 2cm ( ~1 billion transistors) 3.Hit rates:~2 GHz/cm 2 4.Radiation:1Grad, neu/cm 2 (unprecedented) 5.Trigger: 1MHz, 10us (~100x buffering and readout) 6.Low power - Low mass systems L. Demaria - INFN activities of CHIPIX65 2

3 CHIPIX65 Project L. Demaria - INFN activities of CHIPIX PhD student more (IC-designer analog) 1 staff IC-designer digital Less for Irrad (also in ScalTech28) + IC-designer from DEI Same IC-designers + 2 additions

4 Main work done: First 180 days  Irradiation of basic test structures (Pd)  Design of Very Front End analog electronics (Pv,To)  Work on IP-block  Defining responsibility of IP-block (Ba,Mi,Pd,Pv,Pi,To)  First design of IP-block (Ba,Mi,Pv,Pi)  Digital architecture  Undergoing development of the simulation and verification framework (Pg) DESIGN activities were assuming TSMC/IMEC/CERN contract ready on spring NDA arrived only 1 week ago to all sites  impact on schedule NB: prediction of last year were for October-November 2013 (!) All this will be better shown along this presentation L. Demaria - INFN activities of CHIPIX65 4

5 Main 2014 CHIPIX65 contributions to RD53  Radiation WG (Padova) :  Irradiation campaign at Legnaro with low energy protons (TDD studies)  foreseen also irradiation with x-ray machine (TID)  Analog WG (Pavia, Torino)  Design of Very Front end chain, low power, low threshold (<1000e-) with synchronous and asynchronous comparators  IP-block WG (Bari, Milano, Pavia, Padova, Pisa, Torino)  16 out of 34 IP-block under INFN responsibility  Simulation WG (Perugia)  Main contributor to the development of the simulation and verification framework  Top Level WG :  Activity is at a preliminary stage. Contribution mainly from LBNL (USA)  IO WG :  Activity will start during the second half of New convener being identified now (Roberto Beccherle – Pisa) L. Demaria - INFN activities of CHIPIX65 5

6 RD53 WG1 (Radiation test/qualification): Summary CERN test structures (65nm nMOS & pMOS transistors) CERN: 10-keV X ray (CERN), till 200 Mrad(SiO 2 ) CPPM: 10-keV X ray (CERN), till 1Grad(SiO 2 ), 20 & 100 ºC annealing Padova: 3-MeV proton (Padova), till 1Grad(SiO 2 ), 20 & 100 ºC annealing ( 31-st March, May 2014) TSMC test structures - FNAL layout (65 nm nMOS & pMOS transistors) Fermilab: Co-60 γ ray, -20 ºC irradiation, till 1Grad(SiO 2 ) Results from Padova L. Demaria - INFN activities of CHIPIX65 6

7 Digital Pixel architecture DUT: behavioral, time-based description of a simple pixel chip with basic functionality (conversion of hits into discriminator outputs, computation of hit time of arrival and amplitude, trigger selection, column arbitration). UVM verification components connected to interfaces defined in DUT: hit generation (different classes of typical detector hits can be generated) monitoring of pixel chip input and output conformity checks and statistics collection. Goal: Simulation and optimization of pixel chip architectures to be implemented in prospective next generation pixel readout chips. VEPIX53: a flexible Verification Environment for PIXel chips in RD53 in SystemVerilog + UVM (collaboration with RD53, ). 7 Perugia

8 Design of Analog Torino Baseline Solution: Single stage front end with CSA + Discriminator (synch discr.)  Low power: 5uW/pixel cell ( or below )  (FEI4~15uW/pix analog, PSI46~6.7uW analog [RH])  Low noise: 90e - for Cd~100 fF (or below)  7 sigma=560e-; threshold max 1000e-  FAST ToT: 30ke- signal max into max 250nsec  others 400ns for 10 or 30ke-  High resolution of Digital information: 8 bits (lower resolution possible)  FEI4: 4 bits to stay in 400ns (40 MHz clock)  NO-threshold trimming via DAC  Hardware solution (corrections stored in capacitors): Never done before in pixel VFE  Dimensions: max area ~25x50 um 2 L. Demaria - INFN activities of CHIPIX65 8 Layout dimensions: 26x35 um 2

9 VFE Performance (Torino) L. Demaria - INFN activities of CHIPIX65 Noise vs Detector Capacitance LINEARITY ot DIGITIZED ToT (here shown up to 8 bits in 250ns 9 ENC e- #ADC counts Cdet fF Q (Ke - ) 10 fF for 250ns ToT 128 MHz 256 MHz 512 MHz

10 L. Demaria - INFN activities of CHIPIX65 10 PAVIA

11 IP Block for RD53 Out of 34 IP-block identified in RD53, INFN has proposed to contribute at ~16 of them: as main organizer (11) as participant (5) In the following few slides on first prototypes ready for submission in fall 2014 (design in 65nm already present): ADC Band-Gap SLVS driver SRAM Serialiser-deserialiser others IP-blocks could be ready for end of year 11 L. Demaria - INFN activities of CHIPIX65

12 Bari IP-block  Progettazione di un convertitore digitale-analogico (DAC) a 10 bit per la polarizzazione dell’elettronica di front-end 1 o prototipo da sottomettere a Ottobre 2014 Collaudo agli inizi del 2015 Implementazione di eventuali modifiche e nuova sottomissione nel 2015 Sottomissione 1 o prototipo: Q Collaudo: Q2-Q Implementazione di eventuali modifiche e nuova sottomissione: Q3/Q  Sviluppo di soft-IP per il controllo remoto del chip, adottando tecniche di ridondanza per aumentare la resistenza ai Single Event Upset: Q – Q  Progettazione di un convertitore analogico-digitale (ADC) a 12 bit per il monitoring dei parametri funzionali del chip L. Demaria - INFN activities of CHIPIX65 12

13 IP-block (Mi) DICE RAM Cell  Interest of Milano (in CHIPIX65, applying for RD53) to develop radiation hard SRAM  array of 256x256 DICE (Dual Interlocked storage Cell) RAM cells almost ready for integration. It comes from a work done in AIDA. Size of about 1.8x3.3 um 2  Other two designs more radiation hard almost ready  This could be used either in the PUC or in the EOC Schematics Layout V.1 L. Demaria - INFN activities of CHIPIX65 13 SEU recovery in ~20ns

14 L. Demaria - INFN activities of CHIPIX65 14 PAVIA

15 PLL/SER/CDR  data IO & clock management L. Demaria - INFN activities of CHIPIX65 15 ORGANIZATION on-going

16 IP-cores for high speed links PISA  Standard Cell based SER/DES in CMOS 65nm  Ready for the CHIPIX65 submission in fall 2014  RTL preliminary synthesis completed  2GHz  Worst 1.4 mW  Best 1.6 mW   Worst 6.0 mW  Best 8.3 mW  Collaboration with UCSB on high speed TX & RX differential PADs  Foreseen for end of year. Needs NDA L. Demaria - INFN activities of CHIPIX65 16

17 Padova IP-Block L. Demaria - INFN activities of CHIPIX65 17 PLL VCO : specs to be better defined.

18 CHIPIX submissions  IP-block submission (2 blocks of 2x2 mm 2 )- October 2014 :  SLVDS (Pavia)  Band-Gap (Pavia, Milano)  SRAM(Milano)  DAC (Bari)  Serialiser/deserialiser (Pi)  Analog Very Front End submission (1 block of 2x2 mm 2 ) - October 2014  Synchronous, Auto-zeroing, FAST ToT analog front end (Torino)  Asynchronous analog front end (Pavia) Analog readout: max (12x12) pixels + Matrix: (12x32) pixel  In the pipeline  Next IP blocks to be ready :  ADC (Bari), TX-RX (Pisa), Digital Logic RAdHard (Milano), PLL (?)  Pixel-Matrix with complex synthetized digital logic (pixel and readout) [Torino, Pisa, Pavia, Milano] L. Demaria - INFN activities of CHIPIX65 18

19 October submission: IP-block L. Demaria - INFN activities of CHIPIX65 19 Esercizio di floorplanning che Indica che far stare tutto su di un solo IP-block, e’ difficile e presenta svantaggi. Bandgap: includere versioni CERN, CPPM per confronto DAC: Includere anche disegno DAC in tensione di Praga SRAM: Milano abbisogna di piu’ spazio se possibile (256x256 invece di 128x256 celle)

20 October submission – VFE block L. Demaria - INFN activities of CHIPIX ) One core AREA with ANALOG testing for ASYNC design(PAVIA) 2) One core AREA with ANALOG testing of SYNC design (Torino) 3) One core AREA with simple digital readout and measurement of ToT (slow and fast ToT) 1 2 3

21 Simulazione, 5 eventi singolo pixel in vari casi, si vede bene il clock del ToT e il caso di timeout nel conteggio del ToT 21 CHIPIX65 L. Demaria - INFN activities of CHIPIX65

22  1) I/O: Evaluation and definition of I/O protocols supporting 2Gbps or higher serial links, command based triggering up to 1MHz rate and minimum dead-time.  - 80Mbps or higher serial input, with command decoder to configure and operate the chip. Evaluation of a slow control protocol.  Command and Clock should be encoded on a single line.  - 2Gbps Serial Output links will require to evaluate different output data formats and compression alternatives.  - A duplex solution where all I/O takes place on a single serial connection should be considered. Investigation of link redundancy schemes to be eventually used on less data demanding layers.  2) Interfaces: Evaluation of compatibility with defined interfaces such as LPGBT.  3) IP blocks related to I/O: interface driver, clock recovery, clock multiplier methods, LVDS driver and receivers. [Work to be shared with the IP group]  4) Off chip connectivity: Calculation, Simulation and Test of transmission performance with realistic interconnects. I/O should not stop at the chip pads but extend to the system immediately outside the chip. High speed cables and protocols and even test interfaces. Therefore we should develop a specification for the system around it and a test setup. L. Demaria - INFN activities of CHIPIX65 I/O group Responsabile R. Beccherle 22

23 Main Milestones for 2015  Test of first IP-blocks  Measurement of SEU rate with SRAM  Test of small pixel array  Definition of Very Front End analog architectures  Test of all IP-block prototypes L. Demaria - INFN activities of CHIPIX65 23

24 Conclusions L. Demaria - INFN activities of CHIPIX65 24 Good starting of the CHIPIX65 project Layout in TSMC 65nm in 5 out of 6 sites. With CERN/TSMC contract approved, from September all groups will be capable of working with TSMC 65nm Work on IP-block and VFE-analog going very well For 2015 INFN will focus more on adding complex digital architecture in a small pixel array / matrix of about 3x4 mm 2


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