1. Date of download: 10/5/2017
Copyright © ASME. All rights reserved.
From: Thermal Resistance Analysis of High Power Light Emitting Diode Using Aluminum Nitride Thin Film-Coated Copper Substrates as Heat Sink
J. Electron. Packag. 2014;136(3): doi: /
Figure Legend:
Schematic diagram of four different configurations used

2. Date of download: 10/5/2017
Copyright © ASME. All rights reserved.
From: Thermal Resistance Analysis of High Power Light Emitting Diode Using Aluminum Nitride Thin Film-Coated Copper Substrates as Heat Sink
J. Electron. Packag. 2014;136(3): doi: /
Figure Legend:
Testing LED in still air box (a) and the testing configuration of AlN thin film as thermal interface material in high power LED (b)

3. Date of download: 10/5/2017
Copyright © ASME. All rights reserved.
From: Thermal Resistance Analysis of High Power Light Emitting Diode Using Aluminum Nitride Thin Film-Coated Copper Substrates as Heat Sink
J. Electron. Packag. 2014;136(3): doi: /
Figure Legend:
K-factor calibration curve for given LED

4. Date of download: 10/5/2017
Copyright © ASME. All rights reserved.
From: Thermal Resistance Analysis of High Power Light Emitting Diode Using Aluminum Nitride Thin Film-Coated Copper Substrates as Heat Sink
J. Electron. Packag. 2014;136(3): doi: /
Figure Legend:
Transient cooling curve of 3-W green LED fixed on bare Cu and AlN thin film-coated Cu substrates with and without thermal paste measured at (a) 100 mA, (b) 350 mA, and (c) 700 mA

5. Date of download: 10/5/2017
Copyright © ASME. All rights reserved.
From: Thermal Resistance Analysis of High Power Light Emitting Diode Using Aluminum Nitride Thin Film-Coated Copper Substrates as Heat Sink
J. Electron. Packag. 2014;136(3): doi: /
Figure Legend:
Variation of rise in junction temperature for different boundary condition measured at various driving currents: (a) 100 mA, (b) 350 mA, and (c) 700 mA

6. Date of download: 10/5/2017
Copyright © ASME. All rights reserved.
From: Thermal Resistance Analysis of High Power Light Emitting Diode Using Aluminum Nitride Thin Film-Coated Copper Substrates as Heat Sink
J. Electron. Packag. 2014;136(3): doi: /
Figure Legend:
Cumulative structure function curve of 3-W green LED fixed on bare Cu and AlN thin film-coated Cu substrates with and without thermal paste measured at (a) 100 mA, (b) 350 mA, and (c) 700 mA

7. Date of download: 10/5/2017
Copyright © ASME. All rights reserved.
From: Thermal Resistance Analysis of High Power Light Emitting Diode Using Aluminum Nitride Thin Film-Coated Copper Substrates as Heat Sink
J. Electron. Packag. 2014;136(3): doi: /
Figure Legend:
Variation of LED thermal resistances for different boundary condition measured at various driving currents: (a) 100 mA, (b) 350 mA, and (c) 700 mA

8. Date of download: 10/5/2017
Copyright © ASME. All rights reserved.
From: Thermal Resistance Analysis of High Power Light Emitting Diode Using Aluminum Nitride Thin Film-Coated Copper Substrates as Heat Sink
J. Electron. Packag. 2014;136(3): doi: /
Figure Legend:
Variation of interface resistances for different boundary condition measured at various driving currents: (a) 100 mA, (b) 350 mA, and (c) 700 mA