1. MicroTCA.0 to MicroTCA.4: A standard and it's evolution

2. xTCA Specification landscape
Defense
Industrial,
Test & Measurement,
Transportation
Telecom
Data Center
AdvancedTCA
Including dot-specifications PICMG 3.1 – 3.6
MicroTCA
MTCA.1
Air Cooled Rugged
MicroTCA
ATCA 300
MTCA.3
Hardened Conduction Cooled
MicroTCA
Abandoned
MTCA.4
Enhancements for Rear I/O
and Precision Timing
MTCA.2 *
Hardened Air Cooled
MicroTCA
xTCA
for Physics*
ATCA
Extensions *
standardized Zone 3 connector
Timeline
* Work in process

3. Advanced Mezzanine Card the base for MicroTCA
Carrier Blade in an
AdvancedTCA chassis
AdvancedMC Modules
Carrier Blade
The AdvancedMC Modules are defined as Mezzanine Cards for the use on special AdvancedTCA Blades, called AdvancedMC Carrier, within the AdvancedTCA System.

4. MicroTCA (MTCA.0) „Micro Telecommunications Computing Architecture Base Specification“
AdvancedMC in MicroTCA Systems
AdvancedMC Modules
MicroTCA Subrack
The Advanced Mezzanine Card is plugged directly into the MicroTCA Subrack or System. The AdvancedMC is converting from a hook-on module to a functional board

5. MicroTCA = standalone solution of AdvancedMC
New standard platform
Backplane directly accepts AdvancedMC modules
AdvancedMC interchangeable between AdvancedTCA and MicroTCA
Subracks fits into 300mm deep ETSI racks
No rear I/O, power input and all moduls will be inserted from the front side
New dimensions (not 3U / 6U anymore), card depth 180mm (instead of 160 / 220 / 280 mm)

6. AdvancedMC Module dimensions
6 different Module sizes:
„Height“: Compact, Mid-size, Full-size
„Width“: Single and Double
Mid-size
= 4 HP
Single
= 73.8 mm
Double
= mm
Compact
= 3 HP
Full-size
= 6 HP

7. Management: List of standards
MicroTCA Specification
AdvancedMC Specification
AdvancedTCA Specification
IPMI Specification
I2C-bus Specification

8. Physical Management Controllers
MCMC
MicroTCA Carrier Management Controller
Resides on the MCH
MMC
Module Management Controller
Resides on the AdvancesMC Module
EMMC
Enhanced Module Management Controller
Resides on the PMs and CUs
MicroTCA Shelf
MicroTCA Carrier
MCH
MCMC
Backplane
MMC
MMC
MMC
EMMC
EMMC
AMC 1
AMC 2
AMC 12
Cooling Unit
Power Module

9. Management Buses IPMB-L
Connects the MCMC on the MCH to the MMC on the AdcanvecMC Modules
Radial architecture
IPMB-0
Connects the MCMC on the MCH to the EMMC on the PM and CU
Bused architecture
I2C-bus
Connects the MCMC on the MCH to the Carrier FRU EEPROM on the backplane
MicroTCA Shelf
MicroTCA Carrier
MCH
MCMC
IPMB-L
I2C-bus
IPMB-0
Backplane
Carrier-FRU SEEPROM
MMC
MMC
MMC
EMMC
EMMC
AMC 1
AMC 2
AMC 12
Cooling Unit
Power Module

10. MicroTCA Management Structure
Shelf Manager
System Manager
Carrier Manager
Resides on the MCH
Enables power to the AdvancedMCs via the PM
E-keying
Shelf Manager
Resides either on the MCH or external to the shelf
Maintains SEL (System Event Log)
Fan control
System Manager
Highest level management function
Manages one or more MicroTCA Systems
Each FRU’s (Field Replaceable Unit) equipped with a management controller
All FRU’s connected via IPMI (Intelligent Platform Management Interface)
MicroTCA Carrier
MCH
Carrier Manager
MCMC
IPMB-L
I2C-bus
IPMB-0
Backplane
Carrier-FRU SEEPROM
MMC
MMC
MMC
EMMC
EMMC
AMC 1
AMC 2
AMC 12
Cooling Unit
Power Module

11. MicroTCA Power Module (PM) and Cooling Unit (CU)
The MTCA Power Module is involved into the Carrier Management
Enables Management and Payload power to each slot individually
Decision for enabling / disabling power is done by the MCH (Carrier Manager)
The MTCA Cooling Unit is controlled by the MCH (Shelf Manager) too
Sets different fan speed levels on the request of the MCH (AMC: temperature event -> MCH -> MCH command to CU to increase fan speed)
Cooling Unit
Power Module

12. ♥ Powering up a MicroTCA Shelf ♥ Autonomous mode Booting OperationalCU ♥ ♥ MP PP
Pres.
IPMB-0
Enable
IPMB-0
Booting
Operational
Autonomous mode
Booting
Operational
MCH PM
-48V X

13. ♥ Powering up a MicroTCA Shelf ♥ Operational CU FRU-ID FRU-ID AMCMP PP
Pres.
IPMB-0
IPMB-L
Enable
IPMB-0
Operational
Operational
MMC
operational
Operational
MCH PM
-48V X

14. MicroTCA Connector and Backplane
Data transport is based on switched fabrics (serial data transfer)
Connector: 170 pin Card Edge
Component side 1 is left!!
Supported protocols: GbE, 10GbE, SRIO, PCIe, S-ATA, SAS

15. “low cost” MicroTCA Chassis with direct interconnects
Backplane Topologies (Connection Schemes)
MicroTCA Specification defines a Star and a Dual Star Backplane,
other topologies often requested by customers
Examples
“low cost” MicroTCA Chassis with direct interconnects
Dual star MicroTCA Chassis with direct interconnects on port 2 &3 and in the fat pipe

16. MicroTCA Backplane Technology
Aggregated Bandwidth per link: 4 * data rate per lane
Near Future “speeds” per lane
PCIe II ,0 Gbps, PCIe III 8,0 Gbps
10GigE 10Gbps (IEEE802.3ap, -KR)
SRIO  5 - 6Gbps
Bandwidth: shall support up to 12,5Gbps, today’s “speeds” per lane
PCIe I 2,5Gbps
GbE ,25Gbps (“-KX”)
10GigE 3,125Gbps (“-KX4”)
SRIO ,25; 2,5 & 3,125Gbps

17. MicroTCA Carrier Hub (MCH)
Tongue 1: Common Options interface, IPMB connections
Tongue 2: Common Options, Clocks
Tongue 3, 4: Fat Pipe and Extented Fat Pipe connections

18. Thermal requirements for a MicroTCA System
Different Power losses defined:
MTCA.0 R1.0  Single Compact = 20 W Double Compact = 40 W
Single Full-size = 40 W Double Full-size = 80 W
AMC.0 R2.0  Single Compact = 24 W Double Compact = 48 W
Single Mid-size = 30 W Double Mid-size = 60 W
Single Full-size = 48 W Double Full-size = 80 W
The maximum ambient temperature is defined at 55°C
The allowed temperature increase within a slot is ΔT = 10 Kelvin
One slot can be a several AMC modules in a row
(1) + (2) + (3) = one slot
Double FS + Single FS + Single FS
80 W + 48 W + 48 W = 176 W 3 2 1

19. Rugged MicroTCA
The Rugged Micro Telecommunications Computing Architecture specifications define the requirements for a System that meets more stringent levels and cycles of temperature, shock, vibration, and humidity than those defined in MicroTCA.0.
MTCA.1 (Air Cooled Rugged MicroTCA): this first sub-specification of MicroTCA describes rugged air-cooled systems for industrial applications.
MTCA.2 (Hardened Air Cooled MicroTCA): the second sub-specification of MicroTCA; it describes rugged air-cooled systems for military applications.
MTCA.3 (Hardened Conduction Cooled MicroTCA): the third sub-specification of MicroTCA; it describes rugged conduction-cooled systems for military applications

20. MTCA.1 Shock & Vibration requirements
Specification
MicroTCA.0
0.5g 7g
IEC DL1
MicroTCA.1
3g sinusodial
8g random
25g
IEC DL3
ANSI/VITA 47 V2
Thermal requirements :
3 different Levels: Ambient (MicroTCA.0) and 2 Extended Temperature ranges XT1 & XT1L
MicroTCA.0: - 5°C to + 55°C
XT1L: - 40°C to + 55°C
XT1: - 40°C to + 70°C
Additional requirements: Drop test, RoHS, Acoustic, Surface temperature are defined as application specific
For other requirements like Earthquake, Flammability, Atmospheric, Module insertion cycles, ESD, EMC, Safety MTCA.1 refers to the MTCA.0 base specification

21. additional retention screw front panel with flange
Solution
AdvancedMC front panel has to be fastened (screwed) to the subrack
additional retention screw
front panel with flange
MTCA.1 front panel ( XR2 )
AdvancedMC.0 front panel

22. Issues using a normal screw
Face plate deflection
When the Rugged MicroTCA Module is screwed to the subrack… F
… the face plate will be deflected…
… and the force will be applied to the connector. The module bare board and the connector bottom side will be stressed. F
Conclusion:
A locking method is needed, that fixes the module in the chassis in position without applying force into direction of the connector. F

23. Solution Gap 0.0 mm Maximum gap ( 1.60 mm )* Collet Welded sleeve
MTCA chassis
Front panel flange
Sleeve welded onto front panel
1.60
Collet
Welded sleeve
* Based on 185,85 subrack depth
Screw M3

24. MicroTCA Evolution (Rugged MicroTCA)
MicroTCA.2 (work in process) - Hardened air Cooled MicroTCA
For Telecommunication outdoor and military air, land and sea applications
Clamshell System similar to MicroTCA.3, similar shock & vibration demands
Conduction Cooling, Heat path: From the hot spots though thermal paste to clamshell and through Card-LOK to the chassis
Wedge-LOK is blocking the air flow
Special retainer solution is needed allowing forced air flow through heat sinks

25. MTCA.3 Hardened Conduction Cooled MicroTCA
Specification approved Febr 2011
For Telecommunication outdoor and military air, land and sea applications
5 ruggedization levels with up to 15g vibration and up to 40g shock
Standard AMC board in a clamshell
it hardens the Boards
protects the active circuits of the PCB from ESD damage, supports Two Level Maintenance / 15KV ESD Protection
provides a thermal conduction path to the Thermal Interface Surfaces of the Chassis Sidewall

26. MTCA.3 (Hardened Conduction Cooled MicroTCA)
Demands other kind of chassis
The chassis must have slots to hold the boards with wedge-loks
The chassis must be able to emit the heat to the surrounding air

27. Karlsruher Tritium Neutrino experiment KATRIN
MicroTCA.4 - Enhancements for Rear I/O and Precision Timing
The advanced Physics community has made the decision to use AdvancedTCA and MicroTCA in their next generation of systems
Today their platform is VME
Main Reason for the change:
Remote management, failure detection of FRU’s (fans, PSU’s, Blades)
The AdvancedTCA & MicroTCA Specification need some adoption to fit the needs of the community
This was the reason for starting the working group “xTCA for Physics” inside the PICMG
The Large Hadron Collider, Cern
Karlsruher Tritium Neutrino experiment KATRIN

28. MicroTCA.4 Why are enhancements needed to the existing MicroTCA
specification?
No Rear Transition Module (RTM) for MicroTCA defined
Physics applications typically require a large number of I/O cables. It makes sense to connect them to the rear of the chassis.
Special clock and trigger topology
MicroTCA.0 specifies 3 Clocks and AMC.0 R2.0 specifies 4 Telecom and 1 Fabric Clock on the AMC Module. Physics / measurement applications typically need additional Clocks and Triggers

29. MicroTCA.4 AMC µRTM Requirements for mechanics and sizes
AMC Module size: Double Mid-size
Allows for the max number of 12
AMCs in a 19” wide shelf
Large µRTM real estate
µRTM size approximately the size of the AMC (doubles depth of existing MicroTCA chassis)
Use front panel mechanics based on Rugged MicroTCA
Use Rugged MicroTCA retention device
Reuse existing AMC front panels for the µRTM
Optional zone 3 backplane

30. Features of a MicroTCA shelf with RTM, side view
xTCA for Physics
Features of a MicroTCA shelf with RTM, side view
Rear
3-pair ZD connector (2 x 30 diff. pairs)
Safety keying,
8 positions
Retention device (defined in Rugged MicroTCA spec.)
µRTM handle, is at the top of the µRTM (µRTM front panel appears up side down)
Space for mounting mezzanine boards
Could be used for clock and trigger distribution
AMC
µRTM
AMC card edge connector
Front

31. MicroTCA.4 Management extensions required for Physics I2C-bus
Connects the AMC to the µRTM
The µRTM is treated as managed FRU of the AMC
µRTM fans can be independently managed
MCMC
MMC
IPMB-L
AMC 2
AMC 12
Power Module
Cooling Unit
MCH
MicroTCA Shelf
Backplane
MicroTCA Carrier
IPMB-0
EMMC
µRTM 1
AMC 1
µRTM 2
µRTM 12
µRTM Cooling
I2C-bus

32. Differences MTCA.0 / MTCA.4 backplane topology
Direct S-ATA slot interconnects (used in most MTCA.0 systems too)
Special slot to slot interconnects (star & daisy chain routing) on user defined ports 12 to 15
Parallel bus structure on user defined ports 17 to 20
Backplane Topology, Slot Dual Star
Common Options
MCH1 Fabric [A] to AMC Port 0
Common Options
MCH2 Fabric [A] to AMC Port 1
AMC Port 2
AMC Port 3
Fat Pipe
MCH1 Fabric [D:G] to AMC Port [4:7] 4 4 4 4 4 4 4 4 4 4 4 4 4
Extend. Fat Pipe
MCH2 Fabric [D:G] to AMC Port [8:11] 4 4 4 4 4 4 4 4 4 4 4
AMC Port 12
AMC Port 13
AMC Port 14
AMC Port 15
AMC Port 17
AMC Port 18
AMC Port 19
AMC Port 20
Clocks
MCH1 CLK1 to AMC TCLKA
Clocks
MCH2 CLK1 to AMC TCLKC
Clocks
AMC TCLKB to MCH1 CLK2
Clocks
AMC TCLKD to MCH2 CLK2
Clocks
MCH1 CLK3 to AMC FCLKA
PM01
PM02
MCH01
AMC01
AMC02
AMC03
AMC04
AMC05
AMC06
AMC07
AMC08
AMC09
AMC10
AMC11
AMC12
MCH02
PM03
PM04