1. Glasgow Report W. H. Bell, A. Cheplakov, F. Doherty, M. Horn, J. Melone, V. O’Shea UK-V Meeting 03/03/04 -Glasgow

2. Glasgow Status  Have 5 bonded production modules.  54 – Failed mechanically at Manchester  81 – Passes all tests after chip tuning  82 – Initially failed due to bonding damage  Chip has been replaced.  Will rebond and complete tests asap.  83 – Has detector charge problems and one chip with a dead front end.  Suspect ESD but no visual confirmation. (Also had bonding trouble with this module.)  Chip will be changed.  85 – Has bad IV.  Suspect scratch.

3. Module 85 – IV

4. Slow Down  Bonding problems  Chips at different heights wrt hybrid.  Causing differences in bond strength and reworks.  Understand how to solve these problems  Single Aero  Can’t train or test other DAQ components  Debugging single module – bottle neck

5. Other Activities  Expansion of testing equipment  1, 4, and 6 box testing capacity  Correction of Jig and duplication  New jig for H&K 710

6. Getting Up to Speed  Working with Liverpool  Bonded module 85  Pre-acceptance tests at Paderborn  Tested out a range of settings and all parts of the module.  Assisting Liverpool

7. Outlook  With varying chip heights and other bonder instabilities: no confidence in K&S.  Help with bonding at Liverpool  New bonder  Arrival 08/03/04  Installation and training complete 12/03/04