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Present Assembly Status Three important milestones completed: – We tried the entire assembly procedure on real modules and it worked – The construction.

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Presentation on theme: "Present Assembly Status Three important milestones completed: – We tried the entire assembly procedure on real modules and it worked – The construction."— Presentation transcript:

1 Present Assembly Status Three important milestones completed: – We tried the entire assembly procedure on real modules and it worked – The construction of 4/4 Type 1 modules finished successfully (2 spares will be assembled next week) – The bonding is now well under control The test setups (2) provide fast tests The database: – all module/hybrid configurations are stored in database – the present status of the assembly is documented for each part – all calibration test data are available in the database (source test still to come)

2 Status of Spectrometer Status of silicon (Gerrit 15min) Status and Plans for Assembly (Heinz 15min) Outline of the test procedure (Pradeep 15min) Test results with Type 1 modules (Carla 15min) Status and Plans for Flex cables (Bernie 15min)

3 Things we learned during the assembly... The hybrid assembly works fine and is fast: – assembly and bonding of 2 hybrids/day is possible) – 12/13 hybrids worked without any problem The biggest improvement since the last collaboration meeting is the bonding: – the hybrid-chip bonding is fast – the sensor bonding works fine but is still a delicate task! The gluing procedure needed some changes: – the sensor alignment is not easy – we added a crossbar for modules with two hybrid which gives additional strength (not in the active area!) – the backplane contact is now done with a thin wire rather than the glass piece metallization

4 The next module: Module 5 T5 The module: – 1 MS3L hybrid with channel chips – 3 Type 5 sensors – 1arm = 14 modules + 4 spares Module 1 + Module 5T5 = 45 % of the spectrometer (18/43 modules) Started about 1week delayed (due to subplate/chip delivery delays) The main components: – 18 assembled MS3L hybrids (hyb. at MIT, subplates next week) – channel chips (96 at MIT) – 54 glass pieces (at BNL, on the way to MIT) – 54 Type 5 sensors (17sensors at MIT) – 18 transport boxes (currently at work shop ready by next week)

5 Some comments to the chips We received sofar: – channel chips, worked according to specs (105 at UIC, about 5 remaining at MIT) – channel chips: received test results from IDE and need somebody to have a look at the data to confirm specs – will evaluate 6 64-channel chips next week as a check We are about to receive: – 150/260 tested 128-channel chips (tested and work according to specs) – for remaining channel chips: need to lower other pedestal constraints by or start new production – 64-channel chips: according to Lars within specs, they finished testing of about 100 additional chips and will ship the “OK” chips next week

6 The schedule: for August: will focus on hybrids to get more Type 5 sensors tested plan to assemble 4 spare modules first (“training and debugging”) September: start with assembly of “to-be-installed” modules plan to finish Module 5T5 during November

7 Steve’s and my interest in a dE/dx MEASUREMENT with Phobos Modules Phobos is THE “dE/dx-in silicon- experiment” – we use it for nearly any physics measurement in Phobos – we mainly focus on low momentum ,K,p in our analysis – there are nearly NO MEASUREMENTS on low momentum dE/dx in “modern” silicon detectors available. What do we know sofar: – we have NOW the final modules available for tests – we tested them in the 1MIP range and they are optimized for this measurement

8 What do we want to measure? We want to learn how silicon works at low momenta: –We want to measure the signal response and test the PID for low momentum stopping particles –Obtain measurements of dE/dx below minimum ionizing for pions and kaons to test mid-range PID What can we learn in addition by making this measurement? – we can develop code for hit reconstruction with REAL data NOW – we can test, if we can associate hits by dE/dx, which is important for the pattern recognition – find any potential problem in the module before we built test rest BUT: where can we get low momentum , K beams?

9 The beam line AGS E913 TOF start TOF stop (963cm) 1.9m TOF stop Energy degrader (Cu 4 inch) Some beam information inital momentum spread  p/p =+-4% E913 will provid us with TOF signals to improve p-measrement momentum can be varied pion beam 200 MeV/c MeV/c (inital beam) weekly run with degrader for stopping pions K- beam: K-/pion mix with >= 400MeV/c (inital beam, use degrader for lower momentum) 4 Type 1 modules

10 Support for this measurement: We already have a lot of support from the Institute of High Energy Physics/Vienna –they are providing the whole readout system and all necessary electronics for it – they will participate with 1 physicist, 1 electronic engineer and 1-2 students during setup and data taking – we are hoping to get 1 student from Vienna to MIT for 2 months to work full-time on data analysis We are looking for people who are interested and want to participate (and have time for it) – bring your ideas – give a helping hand at BNL – work on data analysis


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