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Valencia Report 5 Pre-qualification (2 mechanical + 3 electrical) All inside mechanical specification in XY after assembled. However, Pre3-Pre5 bad planarity.

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Presentation on theme: "Valencia Report 5 Pre-qualification (2 mechanical + 3 electrical) All inside mechanical specification in XY after assembled. However, Pre3-Pre5 bad planarity."— Presentation transcript:

1 Valencia Report 5 Pre-qualification (2 mechanical + 3 electrical) All inside mechanical specification in XY after assembled. However, Pre3-Pre5 bad planarity (> 115  m). Thermal cycling now understand (Tmax, module holding). Still some 4-8  m variation in some parameters ( mainly in the hole). IV all OK (before and after thermal cycling). Bonding height and envelope measure done. 2-4 unbonded channels per module. Have to be improved Electrical performance: GND has been improved, noise well under control, but still s-curve distortions observed (also in the Liverpool set- up). The VLN set-up is now working with 3 modules. Valencia will start production with middle modules, then the qualification has to be done with middles. Carmen García RAL Cluster Meeting 15/7/2003

2 Correlation spine-module bowing Pre-4 ~75  m ~160  m~150  m ~125  m  Same effect observed in a dummy module.  More studies will be done with new spines Carmen García RAL Cluster Meeting 15/7/2003

3 Metrology: Liverpool-VLA crosscheck ValenciaLiverpool Pre-2 Z reference plane = 227  m Carmen García RAL Cluster Meeting 15/7/2003

4 Metrology: Liverpool-VLA crosscheck ValenciaLiverpool Pre-5 Z reference plane = 227  m Carmen García RAL Cluster Meeting 15/7/2003

5 Metrology: Liverpool-VLA crosscheck Both modules show a difference on midx (Per2 & Pre5). The fiducial on one detector corner missing, that could explain the difference on a3 (Pre2). The difference on mhx (Pre2) not understand. Very good agreement with: Geneva module MPI (old middle module) Carmen García RAL Cluster Meeting 15/7/2003

6 Envelope and bond height Point # Nominal Max Pre-1 Pre-2 100 1477 1893 1342 1464 103 1477 1893 1348 1383 110 933 1249 975 951 113 933 1249 984 865 101 1302 1751 1262 1349 104 1302 1751 1286 1271 111 758 1057 823 856 114 758 1057 864 792 112 758 857 830 862 115 758 857 840 847 Edge chip F Edge chip B Out Fan-in F Out Fan-in B Cent. Fan-in B Bond Height Pre-1 Pre-2 (mm) D-D loop high: 0.737 (0.026) 0.755 (< 1 above D) D-D loop low: 0.576 (0.013) 0.566 (> 0.5 above D) D-F loop high: 0.376 (0.017) 0.437 (< 0.5 above F) D-F loop low: 0.625 (0.11) 0.675 (> 0.5 above D) C-F loop high: 0.467 (0.021) 0.480 (< 0.5 above C) C-F loop low: 0.218 (0.023) 0.322 (> 0.1 above C) Carmen García RAL Cluster Meeting 15/7/2003

7 Electrical performance The 3 modules built are within specs, as far as performance is concerned Gain ~50 mV/fC Noise ≤ 1500 e - ENC @ T~10 o C Noise occupancy « 5x10 -4 @ 1fC GND and set-up tuning to measure the 3 modules simultaneously. However all show distortions in the noise occupancy s-curves at t ≤ 0.3 fC. Not strong dependence on the GND configuration or noise level. One module (Pre5) measured in Liverpool, same effect observed (may be reduce). The effect is reduced when running hot. Carmen García RAL Cluster Meeting 15/7/2003

8 Measurements @ 10ºC Pre3: Old connectors Pre4: Scratch fan-in and detector Not variation in the effect after the scratch Pre5: Measured at Liverpool Carmen García RAL Cluster Meeting 15/7/2003

9 Measurements @ 30ºC S-curve distortion less evident Structure around the cooling block less pronounce Carmen García RAL Cluster Meeting 15/7/2003

10 Preparation for Midwdle modules production XY metrology under control. Z survey : Bonding program under test Set of Jigs 1Set of Jigs 2  Transfer back has been reworked  Transfers have been recalibrated Carmen García RAL Cluster Meeting 15/7/2003


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