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Dual Logo Procedures Alex Zamfirescu IEC USNC TA TC93 Convener IEC TC93 WG2 November 2004.

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Presentation on theme: "Dual Logo Procedures Alex Zamfirescu IEC USNC TA TC93 Convener IEC TC93 WG2 November 2004."— Presentation transcript:

1 Dual Logo Procedures Alex Zamfirescu IEC USNC TA TC93 Convener IEC TC93 WG2 November 2004

2 Facts Both VHDL and Verilog® are DL standards Both standards are in maintenance Dual Logo maintenance procedures were approved by IEEE and IEC, but require pragmatic validation Some procedure details have to be filled in

3 Proposed Plan Walk through the information flow – identify and agree on areas for improvement/refinement Discuss the general major topics 1.Actual flow requires that versions of the draft are produced and reviewed -simpler for std in maintenance -editor on duty 2.Harder to understand IEC document circulation rules »DASC should be minimally affected 3.With extra rules IEEE groups might feel unreasonably constrained 4.What are the first time process tune-up procedures »Joint work to write procedure details, approval »Execute maintenance for VHDL and Verilog® »Review and Update DL procedures

4 Submitting Dual Logo Candidates to the IEC Candidate is formally submitted to the IEC Central Office –IEC reviews candidate IEC Central Office sends a Question of Principle (QP) ballot to the SMB –Should this document move forward as an IEC/IEEE dual logo document? If the ballot passes, the document is sent to the appropriate IEC TC for “fast-tracking”

5 Current IEEE DASC Dual Logo Submissions Computer Society/Design Automation Committee: –IEEE Std 1497-2001 – IEEE Standard for Standard Delay Format (SDF) for the Electronic Design Process.. (IEC 61523-3) –IEEE Std 1076-2002 – IEEE Standard VHDL Language Reference Manual …………………………………..(IEC 61691-5) –IEEE Std 1364-2001 – IEEE Standard Verilog® Hardware Description Language ……………………(IEC 61691-4) –IEEE Std 1076.4-2000 – IEEE Standard for VITAL ASIC Modeling Specification……………………………….. (IEC 61691-6) –IEEE Std 1603-2003 – IEEE Standard for Advanced Library Format (ALF) Describing Integrated Circuit (IC) Technology, Cells, and Blocks –IEEE Std 1076.6-2004, Standard for VHDL Register Transfer Level (RTL) Synthesis –IEEE Std 1364.1-2002, IEEE Standard for Verilog® Register Transfer Level Synthesis

6 Dual logo maintenance process see pages 2/3 An IEC-TC/SC needs to revise an IEC-IEEE standard IEEE needs to revise an IEC-IEEE standard MCRPAR IEC and IEEE agree on a common need YES Dual logo maintenance team (DLMT) set up with members from IEC and IEEE and a convenor jointly accepted ( see note 3 ) IEC disagrees see note 1 IEEE disagrees see note 2 INFO Maintenance Procedure

7 Maintenance Procedure The DLMT prepares a draft for comments (CD) IEC National Comments ( 3 months ) IEEE experts internal ballot ( electronic ) The DLMT prepares a common compilation of comments with possible proposals for change IEC-TC/SC takes decision by correspondance or at a TC/SC meeting CDV OK? See note 4 IEEE takes decision for the next step ( possibly a second internal ballot ) INFO Ballot OK See note 4 The DLMT prepares a second draft based on commonly agreed changes IEC votes on CDV (5 months) IEEE sponsor ballot ( 30-45 days ) INFO NO YES See note 5

8 Maintenance Procedure Positiv e results Positiv e results INFO The DLMT prepares a common compilation of comments on the CDV together with proposals to solve them YES See note 6 NO See note 6 NO IEC-TC/SC takes final decisions on the comments by email or at a meeting IEEE takes final decisions on the comments received INFO The DLMT prepares the FDIS based on commonly agreed modifications. Revised IEC-IEEE standard IEEE final ballot. Once approved IEC submits the FDIS for final vote (2 months) See note 7

9 Maintenance Procedure Notes Note 1 – IEC may decide to continue its own route. If any material is used from the IEC/IEEE standard, a separate license agreement will be required. Note 2 – IEEE may decide to continue its own route leading to publish a revised single IEEE logo standard replacing the previous one. If so IEC will withdraw the existing IEC-IEEE standard. Then IEEE may submit to IEC this new standard as a candidate for a possible new IEC-IEEE standard according to the agreement. Note 3 – The organisation which initiates the process, proposes a convenor first. If the proposal is not accepted by the other organisation, another convenor has to be chosen amongst the members of the DLMT by mutual agreement. Note 4 – At this stage, IEC or IEEE are requested to task the DLMT to provide a new draft for comments Note 5 – The 2 ballot processes must be carried out in such a way that the deadlines are the same Note 6 – At this stage, IEC or IEEE may decide either to continue their respective route or to task the DLMT to provide a new draft for vote by both organizations. If IEC decides to continue its own route, then note 1 applies. If IEEE decides to continue its own route then note 2 applies. –Note 7 – The comments made at this stage must be limited to corrections of misspelling or obvious errors which may have been generated during the preparation of the FDIS.

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