1. Sony PlayStation 3 Sony also laid out the technical specs of the device. The PlayStation 3 will feature the much-vaunted Cell processor, which will run at 3.2GHz, giving the whole system 2 teraflops of overall performance. It will sport 256MB XDR main RAM at 3.2GHz, and it will have 256MB of GDDR VRAM at 700MHz. Sony also unveiled the PS3's graphics chip, the RSX "Reality Synthesizer," which is based on Nvidia technology. The GPU will be capable of 128bit pixel precision and 1080p resolution--some of the highest HD resolution around. The RSX also has 512MB of graphics render memory and is capable of 100 billion shader operations and 51 billion dot products per second. It also has more than 300 million transistors, larger than any processor commercially available today. It will be manufactured using the 90nm process, with eight layers of metal. The RSX is more powerful than two GeForce 6800 Ultra video cards, which would cost roughly $1,000 total if purchased today. The PlayStation 3 will also sport some hefty multimedia features, such as video chat, Internet access, digital photo viewing, and digital audio and video. Speaking of video, Sony Computer Entertainment's chief technical officer Masa Chatani was on hand to show off the PS3's panoramic video functions. Since the console has two HD outputs, it is can be hooked up to two side-by-side HDTVs to projecting video in a 32:9 extra- widescreen format (think Cinemascope in your living room). Like a gigantic version of the Nintendo DS, the dual digital outputs also allow for an extended game display, with the action on one screen and either game information or video chat on the second.

2. PLAYSTATION 3 SPECIFICATIONS CPU: Cell Processor IBM PowerPC-base Core @3.2GHz --1 VMX vector unit per core ----7 x SPE @3.2GHz --7 x 128b 128 SIMD GPRs --7 x 256KB SRAM for SPE --*1 of 8 SPEs reserved for redundancy --Total floating point performance: 218 gigaflops GPU NVidia RSX @ 550MHz, 300 million transistors! (NVidia)--1.8 TFLOPS floating point Performance --Full HD (up to 1080p) x 2 channels --Multi-way programmable parallel Floating point shader pipelines --Sound Dolby 5.1ch, DTS, LPCM, etc. (Cell-based processing)

3. PLAYSTATION 3 SPECIFICATIONS MEMORY 256MB XDR Main RAM @3.2GHz 256MB GDDR3 VRAM @700MHz VRAM--22.4GB/s RSX-- 20GB/s (write) + 15GB/s (read) SYSTEM FLOATING POINT PERFORMANCE: 2 teraflops STORAGE --HDD Detachable 2.5" HDD slot x 1

4. XBOX 360 Graphics processing unit: ATI Xenos While the first Xbox's graphics processing unit was produced by NVIDIA, the Xbox 360 uses a chip designed by ATI called Xenos.graphics processing unitNVIDIAATI The R500 designation is innacurate, as it is infact closer in design to ATI's Radeon_R600 Core design for their next PC graphics card, than the R520 core which was used in the X1000 series.Radeon_R600R520 This is because the Xenos contains 48 unified shader units, which are capable of both vertex and pixel shading operations. This is in contrast to older graphics processor designs which utilize separate specialized units for these tasks.pixel shading

5. XBOX 360 Graphics processing unit: ATI Xenos The GPU package contains two separate silicon dies, each on a 90 nm chip with a clock speed of 500 MHz; the GPU proper, manufactured by TSMC and a 10 MiB eDRAM daughter-die, manufactured by NEC. Thanks to the daughter die, the Xenos can do 4x FSAA, z-buffering, and alpha blending with no appreciable performance penalty on the GPU.[50]TSMCMiB eDRAM NECFSAAz-buffering alpha blending[50]

6. XBOX360 CPU The CPU, named Xenon at Microsoft and "Waternoose" at IBM, is a custom triple-core PowerPC-based design by IBM. The CPU emphasizes high floating point performance through multiple FPU and SIMD vector processing units in each core. It has a theoretical peak performance of 115.2 gigaflops and is capable of 9.6 billion dot products per second. Each core of the CPU is simultaneous multithreading capable and clocked at 3.2 gigahertz. The original chip uses a 90 nanometer process, although a 65 nanometer process SOI revision was originally planned for early 2007,[46] but it has been delayed until mid-2007.[47] A 21.6 GB/s front side bus, aggregated 10.8 GB/s upstream and downstream, connects Xenon with the graphics processor/northbridge. Xenon is equipped with a 1 MiB Level 2 cache on-die running at half CPU clock speed. This cache is shared amongst the three CPU cores.[48]PowerPCIBMfloating pointFPUSIMDvector processingdot productssimultaneous multithreadingclockedgigahertz90 nanometer process65 nanometer processSOI[46][47]front side busnorthbridgeMiBLevel 2 cache[48]