1. IT 327 - Schweber Chap 81 I have believed all my life that that which was worth doing was worth doing well, and have considered it as much a part of my religion to do honest, reliable work, such as would endure, for those who employed me, as to attend to the services of God's worship on the Sabbath. - Brigham Young (1876)

2. IT 327 - Schweber Chap 82 The development of our spiritual nature should concern us most. Spirituality is the highest acquisition of the soul, the divine in man, the supreme, crowning gift that makes him king of all created things. It is the consciousness of victory over self and of communion with the infinite. It is spirituality alone which really gives one the best in life. Pres. David O. McKay Conference Report, Oct 1936, p. 103

3. IT 327 - Schweber Chap 83

4. Characteristic Z (Z o ) Assume: R << X L, and G << X C : L = (µ o µ r N²A)/l

5. Line Losses IT 327 - Schweber Chap 85 1.I²R heating 2.Skin effect losses (R now α f) 3.Capacitively coupled to ground 4.Radiation losses 5.Imperfections in materials 6.Dielectric heating

6. Waveguide IT 327 - Schweber Chap 86

7. Microstrip Lines IT 327 - Schweber Chap 87

8. PCB Performance Webinar IT 327 - Schweber Chap 88 Why this Webcast is Important: Breaking the 32 Gb/s barrier for printed circuit board (PCB) channels requires a strong understanding of PCB stack-up design, simulation methods, and measurement techniques. How a PCB fabrication document calls out the materials, such as fiber weave and surface roughness, is critical to high speed performance. Accuracies of channel performance time and frequency domain simulations at the higher data rates require knowledge of as-fabricated material properties and tolerances. Design and measurement of test structures to validate the PCB stack-up performance require custom fixtures and implementation of high frequency calibration techniques, such as fixture removal. Understanding the basic flow and interaction of stack-up design, simulation, and measurement is critical for leverage of existing low cost PCB manufacturing technology for repeatable design performance. This webcast brings together experts in each of these three areas to demonstrate the basic flow of successful stack-up design with robust correlation between measurements and simulations at 32 Gb/s and beyond. Who should view this webcast: Signal Integrity Engineers working with Printed Circuit Board Channels at Multi-Gigabit Data Rates Electronic Design, Jan 22, 2015

9. Line & Load Matching IT 327 - Schweber Chap 89

10. Line & Load Matching IT 327 - Schweber Chap 810

11. Line & Load Matching IT 327 - Schweber Chap 811

12. Line & Load Matching IT 327 - Schweber Chap 812

13. The Smith Chart: loads of fun IT 327 - Schweber Chap 813

14. The Smith Chart: loads of fun IT 327 - Schweber Chap 814

15. Impedance Matching & Data Rates IT 327 - Schweber Chap 815

16. When is a connection not a connection? IT 327 - Schweber Chap 816

17. When is a connection not a connection? IT 327 - Schweber Chap 817