1. SOME COMMENTS Ulrich Heintz Brown University 7/23/2015Ulrich Heintz - HF plan 1

2. UV glue 7/23/2015Ulrich Heintz - HF plan 2 Applied a dab of UV glue to fix slide during cure

3. Sensor size 7/23/2015Ulrich Heintz - HF plan 3 129.4 49.16 98.74 5.83 We have enough space to make the sensor a little longer to accommodate alignment marks and to apply UV glue to fix the sensor during curing

4. Sensor size Make top sensor wider by  1.1 mm to simplify electronics hybrid 2/25/2015Heintz, Narain, Patterson, Spencer - PS Assembly 4

5. Feedback about Novati wafers The oxide layer that forms the dielectric for the AC coupling capacitors should be less than 200 nm thick. It is 500 nm right now. The ability to reliably make AC coupled strips with a thin oxide without pin holes has to be demonstrated for vendor qualification. This may be difficult to achieve with SiO2 and require Si3N4 (Frank) Can we modify the process to include a thinner dielectric? Can we include some long AC strips to check for pin holes (eg a PS s- sensor)? We need to understand the low breakdown voltage of the strips. The AC strips showed break down at 30 V or so. All strips had a lower breakdown voltage than the diodes, ranging between 100 and 250 V, depending on structure and on wafer. Add a p-stop to surround the entire active area in addition to the p-stops around the individual strips (Martin Printz) 7/23/2015Ulrich Heintz - HF plan 5

6. Some suggestions Add a small strip sensor with identical design as used for other CMS silicon productions to compare performance. Add one or more MaPSA light sensors. Add the new Vienna test structure designs 7/23/2015Ulrich Heintz - HF plan 6

7. Details on new test structure set 7T. Bergauer (HEPHY Vienna) 20 May 2015 Diode MOS Gate Controlled Diode (GCD) Sheet meander Sheet meander

8. Some suggestions We should discuss the CERN market survey with Novati Do they intend to apply? Which of the specifications can we already meet with the SBIR phase 1 run? 7/23/2015Ulrich Heintz - HF plan 8