1. Progress on STS CSA chip development E. Atkin Department of Electronics, MEPhI A.Voronin SINP, MSU

2. Feb 28 - Mar 3, 2006 CBM meeting at GSI2 Main research goals Design and production (via MPW) of a test purpose chip for SST prototyping Design and production (via MPW) of a test purpose chip for SST prototyping Lab tests of ICs manufactured. Study of 0.18µ UMC process features Lab tests of ICs manufactured. Study of 0.18µ UMC process features Study of a face-to-face interface to Si strip prototype Study of a face-to-face interface to Si strip prototype IC radiation hardness tests technique development IC radiation hardness tests technique development

3. Feb 28 - Mar 3, 2006 CBM meeting at GSI3 CSA schematic CSA is based on folded cascode architecture CSA is based on folded cascode architecture DC and AC input coupling are available DC and AC input coupling are available Two mirrored versions of CSA has been studied. These are: 1) version with PMOS input transistor and 2) one with NMOS transistor. In accordance to the foundary Design Kit models at reasonable shaping the PMOS version showed a greater noise performance and was selected for the input device of CSA Two mirrored versions of CSA has been studied. These are: 1) version with PMOS input transistor and 2) one with NMOS transistor. In accordance to the foundary Design Kit models at reasonable shaping the PMOS version showed a greater noise performance and was selected for the input device of CSA Input PMOS: 0.5 mA (half power budget), 1.2mm*0.18um Input PMOS: 0.5 mA (half power budget), 1.2mm*0.18um Feedback cap 2pF sets the gain to 0.5 mV/fC. Feedback is optimized for up to 100pF capacitive detectors (pads, strips and so on) Feedback cap 2pF sets the gain to 0.5 mV/fC. Feedback is optimized for up to 100pF capacitive detectors (pads, strips and so on) Noise at CSA output (wide bandwidth) at 100 pF of Cdet: 200 uV rms for CSA core only, 350 uV rms for CSA with active feedback Noise at CSA output (wide bandwidth) at 100 pF of Cdet: 200 uV rms for CSA core only, 350 uV rms for CSA with active feedback Maximal signal at 5% non-linearity – 0.5 V (at ±1V supply and Cdet up to 100 pF) Maximal signal at 5% non-linearity – 0.5 V (at ±1V supply and Cdet up to 100 pF) Supply voltages: 1) 0 and +1.8V or 2) -0.9 and +0.9 V Supply voltages: 1) 0 and +1.8V or 2) -0.9 and +0.9 V 1.0 mW/channel 1.0 mW/channel

4. Feb 28 - Mar 3, 2006 CBM meeting at GSI4 CSA core 1.2mm*0.18µm 0.5 mA

5. Feb 28 - Mar 3, 2006 CBM meeting at GSI5 CSA simplified structure Non-linear active feedback (leakage current compensation) – 1.0 uA max CSA core Biasing block

6. Feb 28 - Mar 3, 2006 CBM meeting at GSI6 Channel pins for CSA Input Input Output Output Monitoring of leakage current Monitoring of leakage current Vdd, Vss + input transistor reference (AGND) Vdd, Vss + input transistor reference (AGND)

7. Feb 28 - Mar 3, 2006 CBM meeting at GSI7 Rail-to-rail Op amp Rail-to-rail Op amp Features:  Universal block for shapers, buffer stages  Fast (few ns rise time) and low power (less than 1 mW)

8. Feb 28 - Mar 3, 2006 CBM meeting at GSI8Layout To be realized in a 0.18 um, single poly, six metal, salicide CMOS process from UMC, Taiwan. That is a mini-ASIC run, scheduled via Europractice 8 CSAs test CSA core opampcomp (Pad restrictive design) 60 pads, 1.5*1.5 sq.mm 2 full-time engineers + 4 diploma students, half a year for design Structure blocks: 8 CSAs, test purpose CSA core, rail-to-rail opamp, clocked comparator

9. Feb 28 - Mar 3, 2006 CBM meeting at GSI9 Development of building blocks for data-driven architecture, according to UMC CMOS 0.18 µm. These blocks are:  Preamp  Amplitude (slow) antialiasing and dynamic range saving shaper  Timing (fast), hit defining shaper  Low offset high-speed comparator both for hit finder and ADC. Studying both clocked and non-clocked options  Threshold DAC (6-8 bit)  Fast low-bit (4…6 or 8 bit ?) ADC  Analog Derandomizer (deadtime free analog unit with n-inputs and m-outputs, n>m)  Rail-to-rail op amp (high speed buffer) Common issues are: low power consumption, reasonable speed & chip area This talk covers partially the efforts on …

10. Feb 28 - Mar 3, 2006 CBM meeting at GSI10

11. Feb 28 - Mar 3, 2006 CBM meeting at GSI11Remarks This prototype ASIC blocks focus on study of possibilities and merits of UMC 0.18um process This prototype ASIC blocks focus on study of possibilities and merits of UMC 0.18um process All 8 CSAs are different each other. It is needed to optimize the structure and biasing of CSA All 8 CSAs are different each other. It is needed to optimize the structure and biasing of CSA Additional information is in: CBM-STS-note-internal-2006-001 of 10 Jan 2006 The metadata URL is http://www.gsi.de/documents/DOC-2006-Jan- 20_e.html Additional information is in: CBM-STS-note-internal-2006-001 of 10 Jan 2006 The metadata URL is http://www.gsi.de/documents/DOC-2006-Jan- 20_e.html http://www.gsi.de/documents/DOC-2006-Jan- 20_e.html http://www.gsi.de/documents/DOC-2006-Jan- 20_e.html

12. Feb 28 - Mar 3, 2006 CBM meeting at GSI12 Participants: MSU – schematics, board designs, test stations, testing MEPhI – schematics, layout, verification, GDSII files, ASIC test station, ASIC testing

13. Feb 28 - Mar 3, 2006 CBM meeting at GSI13 Test board

14. Feb 28 - Mar 3, 2006 CBM meeting at GSI14 Test board features Adjustable voltage regulators 0.9V and 3.3V Calibration capacitors Detector capacitor equivalents Line driver C in = 2 pF Voltage and current bias components Offset regulators Output loads Low level clock drivers All components are installed onto sockets

15. Feb 28 - Mar 3, 2006 CBM meeting at GSI15 Powerless DC tests for shorts, openings and passive resistivity  OK Powerless DC tests for shorts, openings and passive resistivity  OK DC tests at nominal bias conditions  not passed DC tests at nominal bias conditions  not passed Dynamic tests  not performed Dynamic tests  not performed Test status (the main CSAs in one chip have been checked only!)

16. Feb 28 - Mar 3, 2006 CBM meeting at GSI16 Chip interconnection Full height is 1.6 mm Microconnector pitch 0.3 mm Chip VA-1, 128 channels, 50 µm input pitch, 6*4 mm Flexible interconnection PCB, 70 µm Chip connection type – bonding

17. Feb 28 - Mar 3, 2006 CBM meeting at GSI17 Summary Presented are the main simulation results of CSA chip design, given as a part of the CBM MPW join run (UMC 0.18 um CMOS, June 2005, mini- ASIC conditions) Tests for 8-ch CSA appear to be more negative than positive, but should be continued with more than one chip sample Tests of the rest blocks in chip (ver.2 CSA, opamp, comp) should be performed too