1. High Speed Interconnect Solutions HIROSE ELECTRIC IT3-32mm SI Report Three-Piece Mezzanine Connector for 20+ Gbps Applications October 29, 2009

2. High Speed Interconnect Solutions 2 10-29-2009 Outline  What is IT3  HFSS simulation models for connector and via  Insertion and return losses, NEXT, FEXT, and impedance profile  Insertion loss to crosstalk ratio (ICR)  Fully populated vs. 50% density  Connector-only vs. full channel  Eye diagrams  Summary  Appendix  Measurement vs. simulation correlation  Measured ICR for IT3-25mm

3. High Speed Interconnect Solutions 3 10-29-2009 What is IT3  Proven 3-piece design for improved electrical performance and mechanical reliability SignalGround Interposer Signal / Ground configuration Mating side Mating / unmating Locking latch Mating receptacle IT3D-***S-BGA(**) Interposer assembly Mounting side Installed and locked Mounting receptacle IT3M-***S-BGA(**)

4. High Speed Interconnect Solutions 4 10-29-2009 HFSS simulation model  A.s60p file was created, and the differential pair’s response was examined. Only a quadrant of model is shown. 5 4 3 2 1 10 98 7 6 Signal pin Ground pin Differential pairs 15 1413 12 11

5. High Speed Interconnect Solutions 5 10-29-2009 Via model  A.s60p Touchstone file was also created to study the effect of via stub and coupling.

6. High Speed Interconnect Solutions 6 10-29-2009 IEEE 802.3ap channel spec.  IEEE 802.3ap defined the channel spec. of insertion- loss-to-crosstalk ratio (ICR) up to 5 GHz for 10 Gbps data rate. We will extrapolate this ICR curve to 10 GHz for 20 Gbps data rate. 10 GHz (for 20 Gbps)

7. High Speed Interconnect Solutions 7 10-29-2009 Connector’s ICR  The connector and via transition’s contribution to ICR is independent of channel length, because the insertion loss and crosstalk attenuate at the same rate. Board A Board B Insertion loss FEXT Board A Board B Insertion loss NEXT ICR wrt. FEXT: ICR wrt. NEXT: Connector and via transition is assumed to be at approximately the middle of channel.

8. High Speed Interconnect Solutions 8 10-29-2009 IT3-32mm connector-only response (Fully populated) Impedance and delay @1 GHz  All insertion and return losses, and NEXT and FEXT are shown.

9. High Speed Interconnect Solutions 9 10-29-2009 IT3-32mm connector-only response (60% density)  Both NEXT and FEXT are reduced, if some pins are skipped (i.e., terminated or assigned to low-speed signals).

10. High Speed Interconnect Solutions 10 High Speed Interconnect Solutions 10-29-2009 IT3-32mm connector-only response (50% density)  Even less NEXT and FEXT with 50% density.

11. High Speed Interconnect Solutions 11 High Speed Interconnect Solutions 10-29-2009 Impedance @60ps rise time (20% to 80%)  IT3’s receptacles were designed to have slightly high impedance to offset the via’s and via stub’s low impedance. Connector onlyConnector + ~60mil via stubs

12. High Speed Interconnect Solutions 12 High Speed Interconnect Solutions 10-29-2009 ICR in a full channel (Fully populated)  ICR with 14-aggressor connector and via FEXT, and ~60 mil stub meets the extrapolated IEEE 802.3ap spec. for 20 Gbps. 6” IT3 120 mil FR408 60 mil stub Via model FEXT for via-connector-via (w/o trace attenuation) ICR with 14 FEXTs 20 Gbps

13. High Speed Interconnect Solutions 13 High Speed Interconnect Solutions 10-29-2009 ICR in a full channel (50% density)  ICR with 6-aggressor connector and via FEXT, and ~60 mil stub gives plenty of margin @20 Gbps, as compared to the extrapolated IEEE 802.3ap spec. 6” IT3 120 mil FR408 60 mil stub Via model ICR with 6 FEXTs 20 Gbps FEXT for via-connector-via (w/o trace attenuation)

14. High Speed Interconnect Solutions 14 High Speed Interconnect Solutions 10-29-2009 Channel simulation @6.25 Gbps (Fully populated)  ADS simulation with 3-tap TX equalization gives good open eyes @6.25 Gbps with ~60mil via stub and 14 FEXT included. Without connector Jitter = 15.06ps Eye Height = 987.57mV With connector and 14 FEXT Jitter = 18.57ps Eye Height = 866.27mV 6” IT3 120 mil FR408 60 mil stub Via model

15. High Speed Interconnect Solutions 15 High Speed Interconnect Solutions 10-29-2009 Channel simulation @12.5 Gbps (50% density)  ADS simulation with 3-tap TX equalization gives good open eyes @12.5 Gbps with ~60mil via stub and 6 FEXT included. Without connector Jitter = 12.44ps Eye Height = 579.12mV With connector and 6 FEXT Jitter = 18.48ps Eye Height = 469.88mV 6” IT3 120 mil FR408 60 mil stub Via model

16. High Speed Interconnect Solutions 16 High Speed Interconnect Solutions 10-29-2009 Channel simulation @20 Gbps (50% density)  ADS simulation with 7-tap TX equalization gives good open eyes @20 Gbps with ~60mil via stub and 6 FEXT included. Without connector Jitter = 12.89ps Eye Height = 320.58mV With connector and 6 FEXT Jitter = 19.39ps* Eye Height = 194.93mV* 6” IT3 120 mil FR408 60 mil stub Via model *Degradation is mainly due to via stubs.

17. High Speed Interconnect Solutions 17 High Speed Interconnect Solutions 10-29-2009 Summary  IT3 meets the extrapolated IEEE802.3ap’s ICR spec. for 20+ Gbps.  Both characterization and demo boards are available for evaluation.

18. High Speed Interconnect Solutions HIROSE ELECTRIC Appendix A Measurement vs. simulation correlation

19. High Speed Interconnect Solutions 19 High Speed Interconnect Solutions 10-29-2009 Measurement Setup  To measure the connector’s performance directly, we pre-characterized and de-embedded the test boards. - = Connector + Test BoardsBottom Test BoardTop Test BoardConnector Only Bottom test board Top test board -

20. High Speed Interconnect Solutions 20 High Speed Interconnect Solutions 10-29-2009 Insertion and return losses  Good correlation in differential insertion and return losses.

21. High Speed Interconnect Solutions 21 High Speed Interconnect Solutions 10-29-2009 NEXT  Good correlation in differential NEXT.

22. High Speed Interconnect Solutions 22 High Speed Interconnect Solutions 10-29-2009 FEXT  Good correlation in differential FEXT.

23. High Speed Interconnect Solutions HIROSE ELECTRIC Appendix B Measured ICR for IT3-25mm

24. High Speed Interconnect Solutions 24 High Speed Interconnect Solutions 10-29-2009 Test board  VNA measurements were taken on 120mil test boards with IT3-25mm connector, 2 via transitions, and 6”+6” PCB traces routed through the middle layers. * The ICR curves in the following slides will also be valid for other trace length.

25. High Speed Interconnect Solutions 25 High Speed Interconnect Solutions 10-29-2009 Optimized 60% density for 20 Gbps  IT3 meets ICR spec. (with FEXT) for 20 Gbps if 40% pins are “skipped”. ICR wrt. NEXT*ICR wrt. FEXT* * These curves include 8 aggressors for one IT3-25mm connector and two via transitions. The skipped pins are terminated in this case. “Skipped” pins Victim pair 13 15 17 W U R N L J G E C A