1. SiD General Meeting Welcome & News 14/April/2014 14/April/2014 Andy White & Marcel Stanitzki

2. Welcome Everybody ● This is the second SiD General Meeting ● Purpose: – Updates and News for everybody between workshops ● Agenda – Some brief updates – ongoing R&D – News from Japan (Harry Weerts) – ILC Parameters Working Group (Jim Brau) – Kitakami Site News (Tom Markiewicz) – Spokeperson's question time ** AWLC 2014 Meeting at Fermilab, May12-16,2014 **

3. SiD/ILC  It has been a long road to realizing the ILC !  We have seen major developments in Japan.  There have been ongoing multi-lateral conversations on the ILC in the context of the global HEP program.  We are at a major branch point – P5 ! SID provided input at the BNL P5 meeting.  We hope for a favorable result from P5 …but a positive result will come with issues of timescales and budget profiles  ~One month until we know the P5 outcome ! >>> Now let’s catch up on recent developments.

4. The LCC structure ICFA Linear Collider BoardProgram Advisory Committee Directorate Lyn Evans Deputy (Physics) Hitoshi Murayama ILC Mike Harrison Physics & Detectors Hitoshi Yamamoto CLIC Steinar Stapnes Regional Directors Brian Foster Harry Weerts FALC Marcel Stanitzki and Jim Brau

5. SiD Detector R&D The last year has been a very difficult time for detector work related to the ILC in the U.S. There has been very limited support while we wait for the outcome of the P5 deliberations Requests have been made to DoE for support for both ILC accelerator and detector work – follow-up after P5 result is known (May 22 HEPAP Meeting) Nevertheless there has been activity in several areas…

6. SiD Detector R&D Ongoing areas of R&D: - Vertex detector development - Chronopixel* - 3-D* - Electromagnetic calorimeter - mechanical design* - prototype testing – test beam results* - new design for improved shielding* - Hadron calorimeter – continued activity in CALICE - Forward calorimeter (FCal/T506) - Rate calculations* - Magnetic Field calculations* Just some brief examples today – much more at AWLC 2014 !

7. Chronopixel progress Sarnoff is going to submit prototype3 design for fabrication by the end of April ( I just got information that they are submitting it today, April 14). They did a lot of improvements in power supplies to decrease crosstalk from digital to analog part. And the main thing – new sensor. On the right the recent layout is shown. There will be few pixel options differing by sensor design (see next slide). Different pixel options will be implemented on the same chip in fractions of total pixels. One of the options will be prototype 2 type sensor – just for comparison. U. Oregon

8. Proto3 vs proto2 sensor At the top is shown prototype 2 sensor, and problem with it – it sits inside very highly doped p++ implant. On the right – top is what we hoped Sarnoff can do, using “Natural diode” element, which allows blocking p++ well. However, on the bottom right is what is only allowed – “natural transistor”. Here the problem may be with the size of n+ diffusions (no control on it), and with capacitance between gate and n+ diffusions. We will have 2 options – 1 with gates connected to source and drain and so forming sensor, and another – with gate connected to external bias, while sensor is formed only by source and drain diodes. They will try to sneak with upper right option also, but it violates design rules and may be rejected.

9. SiD - 3D Electronics R&D Final 3D wafers were delivered July 2013. DBI bonded wafers have good yield and high quality. VIPIC (x-ray) and VICTR (CMS) chips tested and work well VIP (ILC) testing just started due to lack of funding and manpower Initial tests are encouraging – see token pass through all 36864 pixels, correct pixel addresses in read all mode Analog testing will begin next week R. Lipton 9 DBI = Direct Bond Interconnect

10. In March, 2014 we received the first 3D chips oxide (DBI) bonded to sensors – 3 tiers of bonded devices. Chips are 25 microns thick DBI bonded to the sensor on the bottom and contacted through top TSVs. Testing will start soon R. Lipton10 VICTRVIP VIPIC We are now processing a variant which utilizes wafer- to-wafer bonds and a non-TSV scheme to build large area tiled arrays with SOI-based active edge sensors and DBI bonded interconnects. Wafers are complete. Handle wafer sensor trenches Buried oxide readout IC and pads 200 micron

11. SiD Electromagnetic Calorimeter

12. Single electron eventTwo electron event - Unphysical “monster events”: Likely cause some non-current limited elements in KPiX; fix has been identified but not implemented -In-time crosstalk due to parasitic coupling on sensor: New design where metal layer 1 shield metal layer 2 is being developed - Working on analysis of test beam data: focus on 2-electron separation - Developing new mechanical layout for SiD using rectangular sensors

13. Basic change is with metal 1. Metal 1 covering of implant is reduced to small contact. A shield trace runs from near this contact to near the connection pad array on metal 2. The shield traces do not connect to the implant contact or the connection pads. The shield traces are tied together, and a connection pad is brought out through metal 2 so that the potential of the shields can be fixed. 13 Concept for SiD EMCal shielded sensor SLAC, University of Oregon, University of California Davis

14. 14 Metal 1 connection of implant to metal 2 trace to pad. Shield trace running under Metal 2 signal trace. All shield traces are tied together, and brought to a metal 2 pad.

15. 15 Metal 1 Shield Traces Terraced View Au pads

16. Packing issue- 31 layers of detector panels increase in width by small amounts- First 20 layers each increase in width by 12.99mm Next 10 layers each increase in width by 21.65mm Originally proposed hexagonal silicon detectors do not lend themselves well to the small, incremental increase in width- Many fractional detectors and complicated circuits would be needed to gain good coverage SiD Electromagnetic Calorimeter design

17. Possible packing solution- Make detectors rectangular detectors- Divide small side of trapezoid by an integer – this is one side of the rectangle X Make another size of rectangle X + increment Add an extra large detector for each successive layer This works until all in a row are replaced – -Then add another rectangle and re-adjust the number of large detectors Manipulating exact sizes could make this work Flex circuits which join the detectors are simply rectangular strips Flex circuit with silicon SiD Electromagnetic Calorimeter design

18. Have generated one train’s worth of pairs resulting from beam-beam interactions at 500GeV 1325 bunches Represent nominal ILC luminosity “high-luminosity” running would be x2 Successfully processed ~1000 of these bunches through sidloi3 SiD Ecal Occupancy Study Norman Graff, SLAC Probably OK at this luminosity, will need to study Bhabhas Looks OK for pairs, as expected in barrel region Not OK

19. RECENT CHANGES Previous modelling did not have sufficient convergence for tracking simulations. It was good for magnet design. A totally new ANSYS mesh was completed. Now 17 million nodes Recently discovered reason for convergence difficulties. PackMan has a very low field at the end. Error in BH curve discovered at 50 gauss range. Will be corrected and rerun. Will give results to Norm Graff in the tracking region. SiD Brief Magnet Update SLAC January 14, 2014 Wes Craddock

20. SiD Magnetic Field B(z) B(x), B(y)

21. Bz Through the center horizontal plane of the tracking regions

23. SiD – Moving Forward  The ILC will be a major component of the global HEP program for the next 10-20 years.  SiD is an excellent detector to address the full range of physics for the ILC.  BUT: - much work to be done!  Detector R&D to complete  Detector optimization to be carried out  Technology choices to be made  Site specific issues to settle  TDR to write  Expand the SiD Consortium  Obtain support on a rising profile at the required level

24. SiD General Meeting Agenda – News from Japan (Harry Weerts) – ILC Parameters Working Group (Jim Brau) – Kitakami Site News (Tom Markiewicz) – Spokepersons’ question time