1. Back-End Bonding H&K 710 bonder Glue Pitch Adaptors Robot I&J2500 Glue Beetle Chip to Hybrid

2. Mike Wormald mpw@liv.ac.uk2 Robot I&J2500 The I&J2500 has a work area of 510 x 510mm. We mount a turn plate to the work holder that allows us to hold the hybrid for accurate dispensing of the glue.

3. Mike Wormald mpw@liv.ac.uk3 Requirements Glue pitch adaptors to LHCB hybrids. Making sure all the bond pads are supported with glue, as bonding is impossible with bounce under the pads. Even spread of glue for planarity. (Bonding jigs vacuum this area down) Ensure no overspill of glue that would hinder the position of the sensors or cover bond pads for the chips Correct location of the pitch adaptors.

4. Mike Wormald mpw@liv.ac.uk4 Process Dispense GluePlace pitch adaptors

5. Mike Wormald mpw@liv.ac.uk5 Process Apply Weights Leave to cure In oven at 40c for 1hour. Visually inspect. Remove any excess or fill unsupported areas. Chips can be mounted at this stage Place back in oven for further two hours

6. Mike Wormald mpw@liv.ac.uk6 Glue chips to Hybrid Requirements Planarity, 710 bonder only has one touchdown per reference system but chips are bonded on all three faces. No overspill of conductive glue that may cause shorts on the hybrid Accurate placement –ease of bonding front end-

7. Mike Wormald mpw@liv.ac.uk7 Dispense Glue

8. Mike Wormald mpw@liv.ac.uk8 Place Chips

9. Mike Wormald mpw@liv.ac.uk9 Accurate Position

10. Mike Wormald mpw@liv.ac.uk10 Back End Bonding

11. Mike Wormald mpw@liv.ac.uk11 Screen shot of bonds with overlay

12. Mike Wormald mpw@liv.ac.uk12 The End