1. The Quality Assurance and Reliability Testing (QART) Lab at CERN A. Honma, CERN PH/DT 26 April 2010CMS Upgrade Meeting, A. Honma1  Purpose of Lab  Lab site  Personnel and Equipment  Activities  The DSF and Bonding Lab  Conclusions Outline

2. Purpose of Lab Was created from the White Paper initiative of the DG in 2007, R&D for LHC upgrades Part of WP6: Interconnect Technology and QA (for LHC silicon detector upgrades) Located in the PH Departmental Silicon Facility (DSF) in Bldg 186 Common QA lessons learned from LHC silicon detector construction should be documented. Avoid mistakes in the LHC detector upgrades and provide infrastructure and expertise to apply QA and reliability testing for the upgrade R&D and construction phases. QA  Planning and procedures common to ANY project. Broader scope for lab: any LHC detector, non-LHC detectors, other CERN projects Reliability Testing has become essential owing to lack of accessibility and long expected life times of detectors and electronics 26 April 2010CMS Upgrade Meeting, A. Honma2 CERN DSF QART and Bonding Lab CERN DSF QART and Bonding Lab

3. 26 April 2010CMS Upgrade Meeting, A. Honma3 CERN DSF QART and Bonding Lab CERN DSF QART and Bonding Lab Lab Site CERN DSF QART and Bonding Lab CERN DSF QART and Bonding Lab Location of QART lab is inside B186-R (ground floor) in the Departmental Silicon Facility B186 CMS Tracker Integration Facility Departmental Silicon Facility Bldg 186 High Bay Hall QART Lab CMS Preshower Final Assembly

4. QART Website: http://bondlab-qa.web.cern.ch/bondlab-qa/QA.htmlhttp://bondlab-qa.web.cern.ch/bondlab-qa/QA.html Personnel (2.5 FTE): 1 proj. assoc. (F. Manolescu) – 100% 1 fellow (A. Drozd) – 100% Equipment: Climatic chamber (large volume, fast temp. cycling with humidity control) Thermal cycling chamber (small volume, med. speed, no humidity control) Vibration tester (mono-axial shaker can deliver 10G’s to 10Kg payload) Infra-red thermal imaging video camera High magnification stereo-microscope on probe station with video camera Small aperture permanent magnet with B=0.7T for high mag field studies Die shear tester / bond wire pull tester 26 April 2010CMS Upgrade Meeting, A. Honma4 CERN DSF QART and Bonding Lab CERN DSF QART and Bonding Lab Personnel and Equipment CERN DSF QART and Bonding Lab CERN DSF QART and Bonding Lab 1 physicist (A. Honma) – 30% 1 technician (I. McGill) – 20%

5. +60°C -30°C +20°C 65 min TOTEM hybrid thermal cycle 26 April 2010CMS Upgrade Meeting, A. Honma5 CERN DSF QART and Bonding Lab CERN DSF QART and Bonding Lab Equipment: Climatic Chambers CERN DSF QART and Bonding Lab CERN DSF QART and Bonding Lab Climatic Chamber Temp range: -70°C to +180°C Hum range: 10% to 95%RH Heating speed: 15°C/min Cooling speed: 11°C/min Thermal Cycling Chamber Temp range: -40°C to +180°C Heating speed: 5°C/min Cooling speed: 6°C/min Tests: Thermal cycling Accelerated lifetime Humidity tolerance Cold tolerance Stress screening Environment simulation

6. 26 April 2010CMS Upgrade Meeting, A. Honma6 CERN DSF QART and Bonding Lab CERN DSF QART and Bonding Lab Equipment: Vibration Tester CERN DSF QART and Bonding Lab CERN DSF QART and Bonding Lab Mono-axial shaker with control system and analysis tools for Random, Sine, Shock, and Recorded vibration inputs. Can perform: Destructive testing Stress screening Modal analysis Playback of transport and handling vibrations and shocks 30cm x 30cm head expander allows testing of large objects (ex.: CMS silicon tracker module) Accelerometer on silicon sensor Acceleration frequency spectrum

7. 26 April 2010CMS Upgrade Meeting, A. Honma7 CERN DSF QART and Bonding Lab CERN DSF QART and Bonding Lab Equipment: IR Video Camera CERN DSF QART and Bonding Lab CERN DSF QART and Bonding Lab High sensitivity (0.1°K) thermal imaging IR video camera. Expected uses: Identifying hot spots on silicon sensors, thermal run-away conditions(?), … Heat flow study on front-end PCBs and detector modules Many other possible uses … Example #2: Malfunctioning heating loop was easily located on one of CMS Tracker Endcap panels. Example #1: Motherboard of a PC. Frame capture from the video output. 4: Hottest point in frame 1: and 2: User selectable measurement points (3 max) Temperature measurements

8. 26 April 2010CMS Upgrade Meeting, A. Honma8 CERN DSF QART and Bonding Lab CERN DSF QART and Bonding Lab Equipment: High Magnification Zoom Stereo-microscope CERN DSF QART and Bonding Lab CERN DSF QART and Bonding Lab High magnification (up to 320x) needed for silicon sensors (pixel or strips) and for (bare) read-out chips. Stereo needed for 3-D structure identification. Video camera useful if object’s visual aspect has time dependence and for documentation. Possibility to probe the observed object. Example: Poor wire bonding quality can often be spotted from surface details and form of welded bond “foot”. Below: right-most bond foot is heavily over-deformed (flattened). 50μm acceptablemarginal rejected Leica MZ16

9. 26 April 2010CMS Upgrade Meeting, A. Honma9 CERN DSF QART and Bonding Lab CERN DSF QART and Bonding Lab Equipment: High Field Magnet CERN DSF QART and Bonding Lab CERN DSF QART and Bonding Lab Motivation: CDF silicon strip detector had broken bond wires from vibration owing to AC current at resonant frequency of wires (10-30KHz) in high B field (1.4T). 0.7 T dipole field using neodymium magnets. Plan to get a small electromagnet with up to 2T Resonant oscillation on bond wire of 3.5mm length found at 6.8KHz. Both ATLAS and CMS have determined the risk of existing bonds to be minimal but have taken precautions to avoid fixed frequency triggers. ATLAS has published an analysis for at-risk bonds in ATLAS silicon detectors. But no known systematic study of effects of wire loop properties and bonding quality on breakage risk. Try to quantify more generally these risks. In agreement with FEA calculations

10. Activities, Past/Planned All equipment is ready for use by the user community. Although priority is given to the LHC experiments silicon detector upgrade projects, other upgrade projects, other experiments, and other CERN projects can use the lab. Examples of tests done or planned: Thermal cycling done on front-end electronics (CMS, TOTEM, ALICE), sensors/chips (Medipix), standard PCBs (LHC quench protection system, CMS Preshower), small mechanical structures. Tests can be passive or active (users provide control and powering electronics). Accelerated aging (timed heat soak) performed for corrosion (with humidity), metal migration (bond wire pads), oxidation. The IR video camera used for hot spot detection on silicon sensors. We plan to do transport and handling vibration damage studies for silicon detector modules and components. This will include real recordings of transport examples (plane, truck, train) for playback. Continue wire vibration damage studies in magnetic field. 26 April 2010CMS Upgrade Meeting, A. Honma10 CERN DSF QART and Bonding Lab CERN DSF QART and Bonding Lab

11. The Departmental Silicon Facility (DSF) The QART lab shares clean room space and personnel with the bond lab. The QART lab also uses space in the non-clean DSF areas. 26 April 2010CMS Upgrade Meeting, A. Honma11 CERN DSF QART and Bonding Lab CERN DSF QART and Bonding Lab Bond and QART Lab ATLAS RD50 Technical Rooms and Airlocks Non-Clean Areas Departmental Silicon Facility (2010) RD50 ALICE LHCb and Medipix DSF Clean Room (~270m 2 usable) LHCb CMS ~30m  ~85m  ~65m  Access Way PEG PEPE PG PEG PE PEG P PPE P P=power, E=Ethernet, G=gas lines (N2) Clean room boundary

12. The Bonding Lab The Bonding Lab is a CERN shared facility which is dedicated to: Ultrasonic wedge wire bonding with aluminium wire. Pull testing of wires (destructive and non-destructive). Die attach (chip and small detector gluing). Encapsulation of wire bonds (new). 26 April 2010CMS Upgrade Meeting, A. Honma12 CERN DSF QART and Bonding Lab CERN DSF QART and Bonding Lab 2 Delvotec 6400 ultrasonic wedge wire bonding machines IJ Fisnar 7300-LF Glue (Encapsulation) dispenser Cammax DB600 die bonder with heated chuck Dage 4000 bond wire pull tester and die shear tester CERN Bond lab did about 20% of CMS Tracker bonding + 100% of Preshower. Now doing sensor, chip and radmon R&D for CMS.

13. Conclusions Quality Assurance and Reliability Testing (QART) Lab is now equipped with all foreseen major test apparatus. Lab personnel are trained or in training for test equipment. We are able to provide test services (for smaller jobs) or advice and assistance (for larger jobs) to the LHC experiments upgrade projects. We have a resource library and experience concerning quality assurance for detector projects. We are always interested in learning from others experience as concerns quality issues. Reliability testing is a critical step in assuring that the components and the systems that cannot be easily repaired or replaced will be able to function over the required lifetime. Please feel free to contact us for questions, discussions, planning and requests for QA, reliability testing, equipment usage, wire bonding and chip gluing. 26 April 2010CMS Upgrade Meeting, A. Honma13 CERN DSF QART and Bonding Lab CERN DSF QART and Bonding Lab http://bondlab-qa.web.cern.ch/bondlab-qa/QA.html