1. AAE450 Spring 2009 Thermal Transport Internal Heat Sources External Insulation COM GL Locomotion Phase Lead [John Dixon] [COM] 1

2. AAE450 Spring 2009 Thermal Considerations  Assumptions: –Solar Panels Reflect Unused Solar Energy Completely –Thermal Blanket keeps Energy Transfer through body to 0 J/s Above includes MLI comprised of Kapton (or Teflon) / Silver Lined Reflective Surface, Kapton Insulation (with scrim separation) –Thermal Heat Sinks radiate to Coldest Possible Surface –Steady State Conduction 2 [John Dixon] [COM]

3. AAE450 Spring 2009 Insulation/Heat Sink  Copper Heat Emission –q/t = 730.432 J/s (from emissivity of Copper) –Cu mass = 6.08 kg One heat vane traveling to each side of the rover @max CPU Operating Temp  Multi-Layer Insulation (MLI) –Insulation mass= 0.898 kg  Total Thermal Control Mass: 6.98 kg 3 [John Dixon] [COM]

4. AAE450 Spring 2009 Thermal Conductivity Graphs 4 Fig. 1 Heat VeinFig. 2 Heat Slab [John Dixon] [COM]

5. AAE450 Spring 2009 Copper Sink Properties  Copper Slab –0.03m thick X 0.065m wide X 0.08m long –Volume: 0.000156 m^3  Copper Vein –0.02m height X 0.065m wide X [0.001:0.372]m thick –Volume(max distance) = 0.000677 m^3 [John Dixon] [COM]

6. AAE450 Spring 2009 Bibliography  Hyder, A.K.; Wiley, R.L.; Halpert, G.; Flood, D.J.; Sabripour, S. Spacecraft Power Technologies. (pp. 415-449). null. Online version available at: http://knovel.com/web/portal/browse/display?_EXT_KNOVEL_DISPLAY_bookid=1310&VerticalID=0 http://knovel.com/web/portal/browse/display?_EXT_KNOVEL_DISPLAY_bookid=1310&VerticalID=0  Watson, Richard D.; Chapman, Kirby S. Radiant Heating and Cooling Handbook. (pp. 5.1-5.13). McGraw-Hill. Online version available at: http://knovel.com/web/portal/browse/display?_EXT_KNOVEL_DISPLAY_bookid=1631&VerticalID=0 http://knovel.com/web/portal/browse/display?_EXT_KNOVEL_DISPLAY_bookid=1631&VerticalID=0  Griffin, Michael D.; French, James R. Space Vehicle Design (2nd Edition). (pp. 9.2 - 9.5). American Institute of Aeronautics and Astronautics. Online version available at: http://knovel.com/web/portal/browse/display?_EXT_KNOVEL_DISPLAY_bookid=1597&VerticalID=0 http://knovel.com/web/portal/browse/display?_EXT_KNOVEL_DISPLAY_bookid=1597&VerticalID=0  Steinberg, Dave S. Cooling Techniques for Electronic Equipment (2nd Edition). John Wiley & Sons. Online version available at: http://knovel.com/web/portal/browse/display?_EXT_KNOVEL_DISPLAY_bookid=2196&VerticalID=0 5 [John Dixon] [COM]