1. IST Workprogramme 2000 Microelectronics Optoelectronics Patrick.Van-hove@cec.eu.int European Commission INFSO E6

2. Organisation & Integration KA4 Essential technologies & infrastructure KA1 Systems & services for the citizen KA2 New methods of work & Electronic Commerce KA3 Multimedia content & tools Research networking Future & emerging technologies Cross Programme Themes

3. KAIV: Strategic Focus & Architecture Software, Systems & Services Microsystems, Subsystems & Peripherals Micro- & Opto-electronics Mobile & Satellite Communications & Systems Computing, Communications & Networking Simulation, Visualisation & Interfaces Nuts and Bolts of the e-Economy

4. KAIV: Main highlights Strengthening infrastructure convergence Strengthening infrastructure convergence – IP/Mobile/fixed – Broadcasting and communications Higher visibility to networked embedded devices, and related architectures Higher visibility to networked embedded devices, and related architectures – Embedded devices, Software, real-time systems Highlighting open source software and open systems Highlighting open source software and open systems Includes a comprehensive range of take-up measures Includes a comprehensive range of take-up measures Two-phase perspective Two-phase perspective – Integration in short to medium term – Higher performance and adaptivity in longer term

5. KAIV Micro- and Optoelectronics ConnectivityMobility + Interactivity + System on Chip Focus: Applications Info appliances Communication Systems (optoE)

6. 2000 Calls 4&5: Micro- and Opto- Microelectronics - Optoelectronics Microelectronics - Optoelectronics – IST 2000 - IV.8.1(R&D)Microelectronics Design and Test – IST 2000 - IV.8.2(R&D)Application-Specific Microelectronics – IST 2000 - IV.8.3(R&D)Industrial µelectronics technologies: processes, equipment and materials – IST 2000 - IV.8.4 (R&D)Opto-electronic technologies – IST 2000 - IV.8.5 (R&D)Advanced micro and opto-electronics – IST 2000 - IV.8.6 (Take-up)µelectronics design and test. – IST 2000 - IV.8.7 (Take-up)Application Specific micro-electronics. – IST 2000 - IV.8.8 (Take-up)Industrial µelectronics technologies – IST 2000 - IV.8.9 (Take-up)Research training in microelectronics: Accompanying Measures Call 4 Call 5

7. AL IV.8.4 Optoelectronic Technologies Focus: Materials, devices and modules for: Focus: Materials, devices and modules for: – High-speed routing – Data processing – Interconnections – Sensing Application Areas: Application Areas: – Photonic networks (low-cost broad-band to-the- home applications) – Information and Communication Terminals

8. Advanced processes, materials and devices Advanced processes, materials and devices – based on compound semiconductors and on SOI – based on compound semiconductors and on SOI – very high frequency and low power communication – high power communication applications. – high power communication applications. – Cost/benefit vs Si and Si/SiGe for industrial use AL IV.8.5 Advanced Micro- and Opto- electronics: RTD (1) E.g. GaAs (and metamorphic compound), SiC, GaN and SOI. large bandwidth or local loop transmission. base stations and power amplifiers

9. Very innovative Very innovative – materials – processes – components for micro- and opto-electronics industries. for micro- and opto-electronics industries. AL IV.8.5 Advanced Micro- and Opto- electronics: RTD (2) new substrates, gate insulators for future devices new device principles for micro-electronics applications

10. WAFER WEB EURACCESS: R&D Enabler CMOS <.1μm LAB SCIENTIFIC ADVISORY BOARD Roadmap Projects stimulation / coordination ORGANIZATION COMMITTEE Labs support organization,.... INDUSTRIAL ADVISORY BOARD Orientation Lighter is better

11. EURACCESS and ITRS Roadmap 98 99 00 01 02 03 04 05 06 07 08 09 10 nm year Isolated lines (MPU gates) Year of 1st product shipment 300mm 450mm 200mm Volume Production Volume Production Volume Production Volume Production Integration Pilot Integration Pilot Integration Pilot Integration Pilot Modules Basic steps Modules Basic steps Modules Basic steps Advanced research Advanced research Integration Pilot Modules Basic steps Advanced research Precompetitive 130 100 70 50 35 Volume Product 300mm EURACCESSEURACCESS

12. Integration of opto- and micro- technologies (homogeneous and heterogeneous) Integration of opto- and micro- technologies (homogeneous and heterogeneous) ultra-compact ICT components ultra-compact ICT components synergy with basic CMOS processes synergy with basic CMOS processes – light emission, – photo-detection, – interconnection. AL IV.8.5 Advanced Micro- and Opto- electronics: RTD (3) Integration of compound semiconductor optical functions (emission, detection) on CMOS circuits Integration of passive optical components, Integration of MUX-DEMUX components; Integration of compound semiconductor optical functions (emission, detection) on CMOS circuits Integration of passive optical components, Integration of MUX-DEMUX components;

13. Evaluation in IST for R&D projects Criteria Weight (1) Threshold (2) Scientific/Technological Quality and innovation4 >= 3 Community Added Value and contribution to EU policy1 >= 2 Contribution to Comm. Social objectives1 - Economic Dev; S&T prospects (range of applications, exploitation, strategic impact, dissemination) 2 >= 3 Resources, Partnership, Management2 >= 2 1) Weight on a scale of 10 (sum 10) 2) Threshold with respect to score 0-5

14. Take-up leading-edge and established methods and technologies time Technology Transfer RTD Commercial Phase T a k e - u p greater efficiency Transfer to User industry Trials Best Practice Assessment

15. Take-up types Trials: Trials: – evaluation of promising, yet not fully established technologies & solutions Best practice actions: Best practice actions: – promote take-up of well established technologies & methods Assessments: Assessments: – evaluation of innovative products User-Supplier Cooperation User-led User-Supplier Cooperation

16. Focus: Focus: a) For tools: All areas of microelectronics design and test AL IV.8.6 Microelectronics design and test - take-up measures b) For methods: 1. collaborative design 2. reuse of Intellectual Property (IP blocks). Action types: Action types:Trials

17. Take-up types Trials: Trials: – evaluation of promising, yet not fully established technologies & solutions Best practice actions: Best practice actions: – promote take-up of well established technologies & methods Assessments: Assessments: – evaluation of innovative products

18. General Explanation of Trials (1) Objective: Objective: To timely pass the barriers to successful exploitation of new technologies – Adaptation and introduction of leading edge technology in industrial/service applications – The technology must be promising, but not yet be established or commercially available (typically: prototype method or tool). – Commitment for dissemination of the experience to other organisations across Europe

19. General Explanation of Trials (2) Participants: At least one (industrial) technology user and one (industrial) supplier The technology is used in a real case within the user organisation The technology is adapted (by the supplier) to users needs, leading to progress beyond the state of the art. User-supplier cooperation for joint evaluation of technological and economic benefits is essential

20. Funding Rules for Trials and Best Practice Up to 100 %: – Personnel, Co-ordination Costs and other Specific Costs Up to 50%: – Subcontracting, Travel and Subsistence, Consumables, Computing and Durable equipment costs. No contribution: – IPR costs and Overheads.

21. Evaluation in IST for Trial proposals Criteria Weight (1) Threshold (2) Scientific/Technological Quality and innovation3 - Community Added Value and contribution to EU policy1 >= 2 Contribution to Comm. Social objectives1 - Economic Dev; S&T prospects (range of applications, exploitation, strategic impact, dissemination) 3 >= 3 Resources, Partnership, Management2 >= 3 1) Weight on a scale of 10 (sum 10) 2) Threshold with respect to score 0-5

22. Objectives: Objectives: – Promote adoption of EXISTING Microelectronics and Optoelectronics Technologies – Improve EXISTING Products or Services Focus: Focus: – New Communication Capabilities – Improved User Interfaces AL IV.8.7 Application-Specific Microelectronics and Optoelectronics ASICs, FPGAs, reconfigurable devices and micro-controllers Enhance Capabilities, Enhance Economy

23. Take-up types Trials: Trials: – evaluation of promising, yet not fully established technologies & solutions Best practice actions: Best practice actions: – promote take-up of well established technologies & methods Assessments: Assessments: – evaluation of innovative products

24. Example: FUSE, FUSE ABC 130 Replications 471 AEs 1973 Proposals 2,299 workplans 3,215 Company visits 8,489 Attendees at Events 14,629 Contacts and Mailings Training 220 Demonstrators

25. FUSE Demonstrator Example

26. Example: FUSE, FUSE ABC

27. Targeted Actions: Focus Targeted Actions: Focus – Functionality – Technology – Industry Sector AL IV.8.7 Application-Specific Microelectronics and Optoelectronics Projects with 5-20 Users Projects with 5-20 Users – Quality of Proposals – European Dimension

28. Take-Up Proposal Dissemination Replication Expertise Centres Users AL IV.8.7 Application-Specific Microelectronics and Optoelectronics

29. Evaluation in IST for Best-Practice proposals Criteria Weight (1) Threshold (2) Scientific/Technological Quality and innovation2 >= 3 Community Added Value and contribution to EU policy1 >= 2 Contribution to Comm. Social objectives2 - Economic Dev; S&T prospects (range of applications, exploitation, strategic impact, dissemination) 3 >= 3 Resources, Partnership, Management2 >= 3 1) Weight on a scale of 10 (sum 10) 2) Threshold with respect to score 0-5

30. IV.8.8 Ind. microelectronics technologies: Assessment Actions Semiconductor Equipment Assessment (SEA): Stimulate rapid take-up of advanced prototype equipment by the semiconductor industry. Semiconductor Equipment Assessment (SEA): Stimulate rapid take-up of advanced prototype equipment by the semiconductor industry. User driven assessment of advanced prototype equipment, related OEM components and materials for semiconductor manufacture. User driven assessment of advanced prototype equipment, related OEM components and materials for semiconductor manufacture. Facility level equipment is not included. Facility level equipment is not included. Bridges the gap: R&D to manufacturing requirements (reliability, repeatability, cleanliness, productivity, process parameters). Market analysis, initial and final specs At least 2 industrial assessors.

31. Take-up types Trials: Trials: – evaluation of promising, yet not fully established technologies & solutions Best practice actions: Best practice actions: – promote take-up of well established technologies & methods Assessments: Assessments: – evaluation of innovative products

32. IV.8.8 Ind. microelectronics technologies: Assessment Actions (i,ii) (i) Assess beta type equipment (i) Assess beta type equipment – close to production conditions – create reference centres at user sites. Prototype equipment, materials for novel processes, architectures plus support (e.g cleaning, metrology). No design or assembly work under SEA! (ii) Early proof of innovative process concepts (PoC) (ii) Early proof of innovative process concepts (PoC) – adapting state-of-the-art equipment New processes tested on state-of-the-art equipment At least 1 industrial user must be involved ; E&M suppliers access to capabilities of Res. and Indus. Equipment costs are not supported.

33. IV.8.8 Ind. microelectronics technologies: Assessment Actions (iii) (iii) Early proof of concept (PoC) for alpha type 300 mm equipment. (iii) Early proof of concept (PoC) for alpha type 300 mm equipment. Early tests of 300mm alpha types At least 1 industrial user involved; Equipment cost not supported. Early tests of 300mm alpha types At least 1 industrial user involved; Equipment cost not supported. For PoC (ii,iii) wafer, analytical, metrology services available SEA for Display Manufacturing called in IV.6.3 SEA for Subsystems, Micro-Systems called in IV.7.5 and IV.7.6 For PoC (ii,iii) wafer, analytical, metrology services available SEA for Display Manufacturing called in IV.6.3 SEA for Subsystems, Micro-Systems called in IV.7.5 and IV.7.6

34. Evaluation in IST for Assessment proposals Criteria Weight (1) Threshold (2) Scientific/Technological Quality and innovation4 - Community Added Value and contribution to EU policy1 >= 2 Contribution to Comm. Social objectives1 - Economic Dev; S&T prospects (range of applications, exploitation, strategic impact, dissemination) 2 >= 3 Resources, Partnership, Management2 >= 4 1) Weight on a scale of 10 (sum 10) 2) Threshold with respect to score 0-5