1. doc.: IEEE 802.15- 15-06-0003-00-003c Submission January 2006 B. Gaucher IBM ResearchSlide 1 Project: IEEE P802.15 Working Group for Wireless Personal Area Networks (WPANs) Submission Title: [Completely Integrated 60 GHz ISM Band Front End Chip Set and Test Results ] Date Submitted: [9 January, 2006] Source: [Brian Gaucher] Company [IBM Research] Address [1101 Kitchawan Ave Yorktown Heights, NY 10598] Voice:[914-945-2596], FAX: [914-945-4134], E-Mail: [bgaucher@us.ibm.com] Re: [] Abstract:[Overview of Integrated 60 GHz Front End Chip Set and Test Results] Purpose:[Contribution for millimeter-wave study group ] Notice:This document has been prepared to assist the IEEE P802.15. It is offered as a basis for discussion and is not binding on the contributing individual(s) or organization(s). The material in this document is subject to change in form and content after further study. The contributor(s) reserve(s) the right to add, amend or withdraw material contained herein. Release:The contributor acknowledges and accepts that this contribution becomes the property of IEEE and may be made publicly available by P802.15. January, 2006

2. doc.: IEEE 802.15- 15-06-0003-00-003c Submission January 2006 B. Gaucher IBM ResearchSlide 2 Completely Integrated 60 GHz ISM Band Front End Chip Set and Test Results IBM Research mmWave Design Team

3. doc.: IEEE 802.15- 15-06-0003-00-003c Submission January 2006 B. Gaucher IBM ResearchSlide 3 Our Vision for Silicon mmWave ICs Discrete GaAs 60-GHz Radio Integrated SiGe 60-GHz Radio Bring “mmWave to the masses”

4. doc.: IEEE 802.15- 15-06-0003-00-003c Submission January 2006 B. Gaucher IBM ResearchSlide 4 High-Speed Wireless Need Driven by Multiple Markets Consumer electronics –Replacement for 1394 Fire Wire and other cables Potential for 150M consumer electronic devices, such as TVs, home automation camera/camcorder, game consoles, music players etc. by 2009. Streaming High Definition Video Computer & peripherals –Replacement for USB, monitor cable, parallel ports and other cables – Potential for 100M computers and peripherals by 2009. Other application needs outside home –Healthcare, SOHO, industrial control, wireless sensor network, smartphones, last mile access, positioning & measurements (asset management), radar… Consumer electronic applications Computer applications Low power, short range 100-500Mbps link HD Video 1.5 Gbps

5. doc.: IEEE 802.15- 15-06-0003-00-003c Submission January 2006 B. Gaucher IBM ResearchSlide 5 Redefining Home Networks with mmWave BS/CS/Digital Terrestrial Analog Signal Digitally Stored TV Program (Compressed) HD Uncompressed Digital Stream HDD Home Server / Router HD-DVD Player TV Monitor PC Base Station on the ceiling & Backbone Multiple Data Streams Ultra High-Speed Stream No penetration through walls (High Security) Freedom to locate anywhere Digital Media Adaptor Internet PC Internet Access Camcorder

6. doc.: IEEE 802.15- 15-06-0003-00-003c Submission January 2006 B. Gaucher IBM ResearchSlide 6 60-GHz Receiver in SiGe BiCMOS 8HP Integration Level 342 NPNs 1200 FETs 77 transmission lines 15 inductors 715 resistors 189 MIMs 53 pads ÷2÷2 x3 PLL PFDCP LPF ÷ 32 IF Amp IF Mixer BB Amp I (0 - 500MHz) Q (0 - 500MHz) Image-reject LNA 17.6G Input 59-64 GHz Ref. CLK 0.5-0.6 GHz 52.8G 9.2G 8.8G 0.4G 62G Size: 3.4 x 1.6 mm 2  Highest integration level for millimeter-wave circuits  Complexity approaching that seen at 5 GHz.

7. doc.: IEEE 802.15- 15-06-0003-00-003c Submission January 2006 B. Gaucher IBM ResearchSlide 7 60-GHz Receiver: Measured Results TargetMeas. Power Gain (dB)~4035-40 Noise Figure (dB)< 65-6.5 Image Rejection (dB)> 20> 30 Phase Noise (dBc/Hz) -88, 1M < -120 floor -85, 1M < -130 floor iCP1dB (dBm)-31-36 S11, RF (dB)< -15-15 I/Q  Balance (deg) +/- 24.2 I/Q Amp Balance (dB)< 1 Power Diss (mW)--525 Summary  First RF-to-baseband 60G silicon receiver built, to our knowledge.  Receiver hits nearly all performance targets.  Achieves the highest integration level for mmWave.

8. doc.: IEEE 802.15- 15-06-0003-00-003c Submission January 2006 B. Gaucher IBM ResearchSlide 8 60-GHz Transmitter in SiGe BiCMOS 8HP Integration Level 359 NPNs 1040 FETs 157 transmission lines 13 inductors 521 resistors 270 MIMs 60 pads Size: 4 x 1.5 mm 2 ÷2÷2 x3 PLL PFDCP LPF ÷ 32 IF Amp IF Mixer I (0 - 500MHz) Q (0 - 500MHz) Image-reject Driver 17.6G Output 59-64 GHz Ref. CLK 0.5-0.6 GHz 52.8G 9.2G 8.8G 0.4G PA 62G  High integration level is unique for millimeter-wave.  Complexity approaching that seen in early commercial implementation at 5 GHz.

9. doc.: IEEE 802.15- 15-06-0003-00-003c Submission January 2006 B. Gaucher IBM ResearchSlide 9 60-GHz Transmitter Measured Results TargetMeas. 1-dB Compression (dBm) 1010-12 Saturated Pwr. (dBm)1516-18 Conversion Gain (dB)4534-37 3XLO Spur (dBm) (50-55 GHz) < -25 Carrier Suppr. (dB)25-30>21-25 Image Suppr. (dB)>20 ~25 (from cascaded driver-PA) Power Consumption (at low power levels) --800 mW Efficiency of PA10% Summary  First 60-GHz baseband-to-RF 60G silicon transmitter built, to our knowledge.  Transmitter hits nearly all performance targets.  Again, highest integration level for mmWave. oCP1dB = +12 dBm Psat = 16 dBm Gain = 33 dB

10. doc.: IEEE 802.15- 15-06-0003-00-003c Submission January 2006 B. Gaucher IBM ResearchSlide 10 Measured Performance of SiGe Chip Set 60-GHz Receiver Measurements60-GHz Transmitter Measurements Gain35-40 dBGain34-37 dB Noise Figure5-6.7 dBP 1dB (out)10-12 dBm S11, RF in-15 dBP sat 16-17 dBm Image Rejection> 30 dBImage Rejection20-30 dB P 1dB (in)-36 dBmPAE of PA6-10% IIP3-30 dBmCarrier Suppression21-25 dB 3xLO leakage, RF in < -77 dBm at 52-55 GHz3xLO Spur-25 to -20 dBm Phase Noise (1MHz), tripled -85 to -90 dBc/Hz < -130 dBc/Hz floor Phase Noise, (1MHz) tripled -85 to -90 dBc/Hz < -130 dBc/Hz floor I/Q Balance 0-4 degrees <1dB I/Q Balance ±2 deg ±0.5 dB Power Dissipation 195 mA, 2.7 VPower Dissipation 190 mA, 2.7 V 72 mA, 4.0 V

11. doc.: IEEE 802.15- 15-06-0003-00-003c Submission January 2006 B. Gaucher IBM ResearchSlide 11 Chip-on-Board Package for TX/RX Chips *World’s First Functional 60GHz “Chip-on-board” Package! All wire bonds Standard FR4 board Tx or Rx Chip Folded Dipole Antenna ~ 8 mm Reflector Flip-Chip Wire-Bond Tx or Rx Board encapsulate *More detail available under CDA

12. doc.: IEEE 802.15- 15-06-0003-00-003c Submission January 2006 B. Gaucher IBM ResearchSlide 12 60GHz Radio Test System using Software Baseband VGA TxIC ÷2÷2 x3 IF Amp IF Mixer BB Amp I Q Image-reject LNA Input 59-64 GHz Gen1 Receiver IC* ÷2÷2 x3 IF Amp IF Mixer Image-reject Driver Output 59-64 GHz PA Gen1 Transmitter IC* PFDCP LPF ÷ 32 PLL 18G 54G 9G 0G 63G BB Amp I Q 8b A/D Modulation : DQPSK for 1Gb/s Directional Antennas OFDM for 1Gb/s Omni Antennas TxIC PFDCP LPF ÷ 32 PLL 18G Signal Generator 12b D/A 1Gs/s PCI A/D Card PC Memory Buffer PC captures sample buffer and demodulates in non real-time ARB loops Real-time Modulation frame To radio ~500MHz Data/Modulation Source Demodulation/Data Recovery *More detail available under CDA

13. doc.: IEEE 802.15- 15-06-0003-00-003c Submission January 2006 B. Gaucher IBM ResearchSlide 13 OFDM Link Demonstration using 60G Rx/Tx with Antennas Rx/Tx modules used with software radio with 700Ms/s ADC. QPSK-OFDM modulation used. Error-free operation demonstrated at 630Mbps at 10m. Link budget corroborated, with 7dB NF, 10dBm output power, 2dB package loss in Rx/Tx, 7dBi antenna gain and 88dB path loss for 10m. PC A/D ARB 630Mbps QPSK-OFDM 7dBi pk. gain 10m reference separation 630Mbps Received constellation 60GHz Tx Module60GHz Rx Module Tx Pkg loss (-2dB) Antenna Gain (7dBi) Channel Loss 10m (-88dB) kTBF = -80dBm (500MHz BW)  C/N = 11dB IQIQ IQ Level -15dBm +9dBm +7dBm +14dBm -74dBm -67dBm -69dBm Antenna Gain (7dBi) Pkg loss (-2dB) 630Mbps 60-GHz OFDM Link Rx-Gain +35dB NF = 7dB

14. doc.: IEEE 802.15- 15-06-0003-00-003c Submission January 2006 B. Gaucher IBM ResearchSlide 14 ASK Link Demonstration using 60G Rx/Tx with Antennas On-off keying (OOK) used to enable a simple modulation to be used without A/D converters. Same 60G Rx/Tx modules used, demonstrating good data eyes to 1Gbps. Rough setup with ARB and scope. Moving towards PRBS generator to drive bipolar encoder on Tx side, then will add clock and data recovery on the Rx side. This will allow true BER measurements to be made., This scheme addresses Multi Gb/s point to point links. 8dBi antennas suitable for proto-typing, but >10m coverage will require waveguide- launch modules with directional antennas. 60 GHz Rx with Antenna I+I+ I-I- Q+Q+ Q-Q- Detector Σ Amp Measured eye-diagram of rectified I and Q at 1Gbps, across 1m wireless link 60 GHz Tx with Antenna I+I+ I-I- Q+Q+ Q-Q- diff bipolar data ARB Gen. 1m reference sep. 1Gbps 60-GHz ASK Link

15. doc.: IEEE 802.15- 15-06-0003-00-003c Submission January 2006 B. Gaucher IBM ResearchSlide 15 60-GHz Chipset Road Map Eval Boards Integration Functionality 2004 2005 First Gen Aug, 2005 Bare Die Transmitter Receiver Second Gen 2006 Sept 2005 Eval Board Third Gen Bare Die Transmitter Receiver Aug, 2006 Building Blocks Feb. 2004 Individual Comp’ts LNA PA Eval Boards Packaged Die Transceiver Mar, 2006 2007 CMOS Building Blocks 2006-2008 Individual Comp’ts LNA PA Addresses: AM-OOK, FM-FSK Mod and Demod

16. doc.: IEEE 802.15- 15-06-0003-00-003c Submission January 2006 B. Gaucher IBM ResearchSlide 16 Summary Fully integrated, “baseband-to-millimeter wave” Gbps SiGe radio chip sets are a reality SiGe integration also makes possible the use of standard IC package solutions Our Gen1 chipset consists of a complete I/Q receiver and transmitter –Baseband to/from 60GHz VCO/PLL, Filters, Mixers… –Capable of analog Up/Dn conversion or high-speed I/Q modulation Gen1 chips are currently: –Packaged on a PCB eval board and includes an integral 7 dBi antenna, capable of Gbps rates over 10M, when drive by appropriate baseband. –For directional links, we also have a waveguide interface for the chips to be available in 2Q06. Gen2 chips are in test with eval boards expected in 2Q06. They will have both a PCB with integral antenna and waveguide interface. Low cost package 2Q06 Chip on board-Today Waveguide Interface 2Q06 We gratefully acknowledge partial funding for this effort under DARPA contract N66001-05-C-8013