1. CONFIDENTIAL Pressure Cure Oven (PCO)

2. CONFIDENTIAL System Overview  Pressure Cure Oven (PCO) or Autoclave is used to minimize voiding and increase adhesion strength for bonding processes typically used in die attach and underfill applications  PCO pressurizes air into a rigid vessel and heats & cools with forced convection ¬ Heaters, heat exchangers and blowers are internal to the pressure vessel  When the curing process is complete, the pressure oven automatically relieves its pressure to 1atm and cools

3. CONFIDENTIAL Pressure Cure Applications Underfill Curing Die Attach Curing Wafer Lamination Film & Tape Bonding PCO

4. CONFIDENTIAL Process Specification Process time: Generally 120 min or User’s spec Operating temp:60 o C ~ 200 o C Maximum temp: 220 o C Operating pressure: 1 bar – 10 bar Capacity:24 Magazines (typical) Cooling method:PCW (17 o C - 23 o C) Cooling water pressure: 25 – 40 psi 200 ℃ 60 ℃ 0 Temp. 30min90min120minTime 10 bar 0 20min90min110minTime Cooling process Curing process Rising process Pressure. Representative Pressure/Temp Profiles (User Configurable)

5. CONFIDENTIAL PCO System Dimensions 1700mm 2200mm

6. CONFIDENTIAL PCO System Chamber

7. CONFIDENTIAL Chamber Dimensions 7 440mm 189mm 199.5mm 608mm 716.5mm

8. CONFIDENTIAL Chamber with Shelves Extended

9. CONFIDENTIAL System Air Flow 9 Door inside cover Return air assistance damper Heater module radiator Fan motor & mechanical seal

10. CONFIDENTIAL Vacuum Module Option Vacuum Module (Optional) Vacuum pump GaugeVacuum in/out line