1. WP3 Meeting 21/05/2015 1 Liverpool Status: Thermo-Mechanical Hybrids Have now received a full complement of 240 Thermo-Mechanical Hybrids from Stevenage Circuits Made up of 16 off initial pilot run (end of March) plus remaining 224 Now awaiting metrology to check all is ok 1 panel to be shipped immediately to Andy at Glasgow to be used for TM module assembly Will come pre-loaded with HCC resistive load and 1K NTC Total hybrid load coming in at 3.6Ω (~0.3Ω/ABC130 location) Expecting ~1.5W hybrid (asic) power dissipation (requires ~2.4V/0.65A PSU) How should we proceed with remaining panels w.r.t. SMD attachment? As a minimum require HCC load resistors plus NTC for functioning TM hybrid These parts are in stock in Liverpool BUT SMD lands exist for asic decoupling capacitors etc. (even though they are not used) Retained to check mechanical clearances for tooling/wire-bonding Should we consider also adding these components? Request for another batch of TM hybrids 12 off panels (96 circuits), have received quote from Stevenage (30 day turn around) Will have 336 TM hybrids available in near future (of new batch) We’re out of Tra-Duct epoxy!!!!

2. WP3 Meeting 21/05/2015 – cont’d 2 Liverpool Status: HCC, DAQ loads and electrical hybrids Further complement of 193 HCCs now received at CERN Will have >220 available for distribution (cf 20+ in UK + 193 at CERN) Plan to use small number attached to FR4 type hybrids as Atlys ITSDAQ load (HCC + ABC130s) To facilitate migration from HSIO to Digilent Atlys board (see next slide) Quotes received for FR4 type hybrids, 12 off of both flavours (left/right-handed) – 24 total How many do we need and what type(s)? Will also need module frames plus hybrid carriers (as used in DESY test beam) – how many? Electrical hybrids: finalising their layouts ABC130 bond pad widths increasing in size from 100µm to 120µm to compensate for over-etching Likewise some on HCC but not all (due to layout constraints, there’s no room....) Will add 50-way 0.05” Samtec connector to hybrid panel to allow hook-up to Atlys VMOD-IB board Allows direct readout of 8 hybrids in parallel Likewise add Samtec connectors for individual powering of hybrids (targeting FEASTMP plug-in) Propose using a single power connector servicing all DCDC converters FEASTMP requires single CMOS control line (1 per FEASTMP) Would like to add this to 50-way Samtec, requires re-spin of VMOD board Will discuss with DAQ colleagues Plus 16-way 0.1” IDC for temperature monitoring of hybrids (via their on-board NTC) To connect up to the Cambridge temperature interlock unit If re-spinning VMOD board consider adding NTCs to 50-way Samtec Will result in a single connector providing control/monitoring to all hybrids Getting close to crate based (single connector) system Was hoping to finish this week to go out for quote but more realistically first week June (due to vacation)

3. WP3 Meeting 21/05/2015 – cont’d 3 Testing of Barrel hybrid with Atlys ITSDAQ First tests done with hybrid loaded with ABC130s with un-bonded front-end Shown to work well with I/P noise comparable to that of HSIO But mini-module readout with Atlys show an increase in the I/P noise for asics bonded out to an ATLAS12 mini-sensor I/P noise shows >800e ENC, with HSIO see <600e Un-bonded channels Atlys HSIO reference measurement Un-bonded channels Un-bonded asics show similar noise performance irrespective of readout board Common-mode pickup via sensor? Propose adding isolation resistor in the sensor Hvret line (currently not present) 5K1 0Ω0Ω 0Ω0Ω 0Ω0Ω 22nF HVin HVret HVsensor HVret To sensor Current filter arrangement Change this resistor to 1K

4. Repeat measurement with single resistor change on filter using Atlys (with Digilent supplied PSU) All other connections and module configuration remain unchanged Results show a dramatic improvement for those channels bonded to the sensor (resistor doing its job) Bonded to sensor ~580e and the un-bonded asics coming in at ~500e (as per HSIO reference measurement) Un-bonded channels Atlys WP3 Meeting 21/05/2015 – cont’d