1. MEMS Hsinchu Taiwan December 5, 2012 Chair: Michael Gaitan (NIST)
Co-Chairs: Robert Tsai (TSMC) and Philippe Robert (LETI)
Work in progress – do not publish

2. MEMS Technology Working Group
Chair: Mike Gaitan (NIST), Chair
Co-Chairs: Robert Tsai (TSMC) and Philippe Robert (LETI)
Akihiro Koga
Arthur Morris
Asif Chowdhury
Brian Jamieson
Buzz Hardy
Chengkuo Lee
Chris Apanius
Chris van Hoof
Christian Rembe
Chuck Richardson
Dave Howard
Dimitrios Peroulis
Dominique Schinabeck
Don DeVoe
Edward Chiu
Erik Jan Lous
Fabio Pasolini
Fabrice Verjus
Fumihiko Nakazawa
Goro Nakatani
Hebert Bennett
Henne van Heeren
Toshiba
Wispry
Analog Devices
SB Microsystems
MEMSCAP
National U of Singapore
Promeus
IMEC
PolyTec
iNEMI
Jazz Semiconductor
Perdue
Acutronic
University of MD
Asian Pacific Micro
NXP
ST Micro
KFM Technology
Fujitsu
Rohm
NIST
enablingMNT
Hiroshi Toshiyoshi
Ingrid De Wolf
Jae Sung Yoon
Jim Spall
Jim Mrvos
Jianmin Miao
John Rychcik
Joost van Beek
Josh Molho
Karen Lightman
Kevin Chau
Koji Fukumoto
Marcie Weinstein
Mark Crockett
Mary Ann Maher
Mervi Paulasto-Kröckel
Michel Brillouet
Monica Takacs
Patric Salomon
Pete Loeppert
Raj Gupta
Raji Baskaran
Rakesh Kumar
University of Tokyo
IMEC
KIMM
Delphi
Lexmark
Nanyang Tech Univ
Acutronic
NXP
Caliper
MEMS Industry Group
MEMStaff
Sony
Akustica
SEMI
SoftMEMS
Aalto University
LETI
4m2c
Knowles Acoustics
Volant Technologies
Intel
Global Foundries
Randall Wagner
Philippe Robert
Robert De Nuccio
Robert Tsai
Rob O’Reilly
Ron Horwath
Ron Lawes
Sacha Revel
Scott Bryant
Shawn Blanton
Stephane Donnay
Stephen Bart
Steve Breit
Steve Greathouse
Steve Walsh
Takashi Mihara
Tetsu Tanaka
Tony Stamper
Veljko Milanovic
Wei-Leun Fang
Wendy Chen
Xiaoming Wu
Yasutaka Nakashiba
NIST
LETI
ST Micro
TSMC
Analog Devices
Glimmerglass Ltd.
Imperial College
Accutronic
MANCEF
Carnegie Mellon University
IMEC
MKS Instruments
Coventor
Plexus
Micromachine Center
Tohoku University
IBM
Mirrorcle Technologies
NTHU
KYEC
Lexmark
Renesas Electronics

3. From Yole Development at the MEMS Industry Group's M2M Workshop, May 2012

4. MEMS in Mobile Devices
Len Sheynblat, Qualcomm, Sensors System Integration Problems, MIG M2M Workshop, Spring 2012

5. MEMS Technology Working Group
MEMS TWG
Systems
Integrators
Device
Manufacturers
Equipment and Materials Suppliers
Design Houses
Foundries
iNEMI

6. ITRS MEMS Chapter Summary
MEMS Device Technologies
Accelerometers
Gyroscopes
Inertial Measurement Units (IMUs)
Microphones
RF MEMS
Emerging MEMS
Technology Requirements
Device Performance
Design and Simulation
Packaging and Integration
Device Testing

7. MEMS Inertial Sensors
MEMS Inertial Sensors continue to incrementally increase in performance and lower in cost.
The integration path of the Inertial Measurement Unit (IMU) has advanced to 9 degrees of freedom (DoF) in the package sooner then forecasted in the 2010 edition.
Driving down the cost of testing of the IMU continues to be a challenge.

9. Example: 9 DoF IMU at Board Level
ST Microelectronics
Feb 12, 2012

10. MEMS Integration Node

11. MEMS Microphones
MEMS microphones are expected to continue to increase in performance and lower in cost.
Testing in the factory environment is an issue as MEMS microphone sensitivity advances to -68 dB.
MEMS microphones will see advances in the ASIC to include digital output and adaptive signal processing (such as noise cancellation).
Testing of MEMS microphones with adaptive signal processing is a challenge.

12. RF MEMS
RF MEMS are intended to lower the power dissipation of the radio.
RF MEMS are sill in the process of increasing their reliability and lowering cost before they can be adopted in mobile devices.
The biggest challenge in RF MEMS is enhancing reliability and lifetime (# of operations)
Some of the future performance requirements have no known solutions, (e.g., signal isolation requirements)

13. Critical Issues
There is little uniformity for reporting performance characteristics in device data sheets.
A new terminology standard is in development and a new iNEMI project is starting to standardize characterization protocols.
MEMS manufacturers seek to lower the rising cost of testing as functionality increases.
The volume of MEMS testing is lower than ICs but the cost of testing per device is much higher. Testing can consume 60% of the manufacturing cost.
Potential solutions include:
Methodologies and validation for Wafer Level Testing.
Methodologies for Design for Test.

14. Plans for 2013
The MEMS Technology Working Group is affiliated with the ITRS and iNEMI.
The iNEMI MEMS Chapter has been expanded to include consumer health and automotive applications. These will be further expanded in the 2013 ITRS MEMS Chapter.
Our TWG discussions are exploring the concept of sensor integration nodes.
We will incorporate magnetometers (electronic compass) and pressure sensors (altimeter) in the roadmap.
A new terminology standard for MEMS Sensors is being developed.
Driven by member companies in The MEMS Industry Group, which include Intel, Qualcomm, ST Microelectronics, Bosch, and Freescale.
An iNEMI project on MEMS Testing Requirements will be starting on defining testing protocols for device performance metrics in data sheets.

15. Conclusions
Systems integrators play a key role in developing cooperation between the device manufacturers.
MEMS Sensor Fusion creates challenges for testing as complexity increases while still lowering cost.
MEMS device performance and testing requirements depend on the application (consumer electronics, automotive, medical, defense and aerospace).
The concept of sensor integration path might facilitate longer term road mapping of MEMS and possibly other More than Moore Technologies.