Presentation on theme: "MEMS Hsinchu Taiwan December 5, 2012 Chair: Michael Gaitan (NIST)"— Presentation transcript:
1 MEMS Hsinchu Taiwan December 5, 2012 Chair: Michael Gaitan (NIST) Co-Chairs: Robert Tsai (TSMC) and Philippe Robert (LETI)Work in progress – do not publish
2 MEMS Technology Working Group Chair: Mike Gaitan (NIST), ChairCo-Chairs: Robert Tsai (TSMC) and Philippe Robert (LETI)Akihiro KogaArthur MorrisAsif ChowdhuryBrian JamiesonBuzz HardyChengkuo LeeChris ApaniusChris van HoofChristian RembeChuck RichardsonDave HowardDimitrios PeroulisDominique SchinabeckDon DeVoeEdward ChiuErik Jan LousFabio PasoliniFabrice VerjusFumihiko NakazawaGoro NakataniHebert BennettHenne van HeerenToshibaWispryAnalog DevicesSB MicrosystemsMEMSCAPNational U of SingaporePromeusIMECPolyTeciNEMIJazz SemiconductorPerdueAcutronicUniversity of MDAsian Pacific MicroNXPST MicroKFM TechnologyFujitsuRohmNISTenablingMNTHiroshi ToshiyoshiIngrid De WolfJae Sung YoonJim SpallJim MrvosJianmin MiaoJohn RychcikJoost van BeekJosh MolhoKaren LightmanKevin ChauKoji FukumotoMarcie WeinsteinMark CrockettMary Ann MaherMervi Paulasto-KröckelMichel BrillouetMonica TakacsPatric SalomonPete LoeppertRaj GuptaRaji BaskaranRakesh KumarUniversity of TokyoIMECKIMMDelphiLexmarkNanyang Tech UnivAcutronicNXPCaliperMEMS Industry GroupMEMStaffSonyAkusticaSEMISoftMEMSAalto UniversityLETI4m2cKnowles AcousticsVolant TechnologiesIntelGlobal FoundriesRandall WagnerPhilippe RobertRobert De NuccioRobert TsaiRob O’ReillyRon HorwathRon LawesSacha RevelScott BryantShawn BlantonStephane DonnayStephen BartSteve BreitSteve GreathouseSteve WalshTakashi MiharaTetsu TanakaTony StamperVeljko MilanovicWei-Leun FangWendy ChenXiaoming WuYasutaka NakashibaNISTLETIST MicroTSMCAnalog DevicesGlimmerglass Ltd.Imperial CollegeAccutronicMANCEFCarnegie Mellon UniversityIMECMKS InstrumentsCoventorPlexusMicromachine CenterTohoku UniversityIBMMirrorcle TechnologiesNTHUKYECLexmarkRenesas Electronics
3 From Yole Development at the MEMS Industry Group's M2M Workshop, May 2012
4 MEMS in Mobile DevicesLen Sheynblat, Qualcomm, Sensors System Integration Problems, MIG M2M Workshop, Spring 2012
5 MEMS Technology Working Group MEMS TWGSystemsIntegratorsDeviceManufacturersEquipment and Materials SuppliersDesign HousesFoundriesiNEMI
6 ITRS MEMS Chapter Summary MEMS Device TechnologiesAccelerometersGyroscopesInertial Measurement Units (IMUs)MicrophonesRF MEMSEmerging MEMSTechnology RequirementsDevice PerformanceDesign and SimulationPackaging and IntegrationDevice Testing
7 MEMS Inertial SensorsMEMS Inertial Sensors continue to incrementally increase in performance and lower in cost.The integration path of the Inertial Measurement Unit (IMU) has advanced to 9 degrees of freedom (DoF) in the package sooner then forecasted in the 2010 edition.Driving down the cost of testing of the IMU continues to be a challenge.
11 MEMS MicrophonesMEMS microphones are expected to continue to increase in performance and lower in cost.Testing in the factory environment is an issue as MEMS microphone sensitivity advances to -68 dB.MEMS microphones will see advances in the ASIC to include digital output and adaptive signal processing (such as noise cancellation).Testing of MEMS microphones with adaptive signal processing is a challenge.
12 RF MEMSRF MEMS are intended to lower the power dissipation of the radio.RF MEMS are sill in the process of increasing their reliability and lowering cost before they can be adopted in mobile devices.The biggest challenge in RF MEMS is enhancing reliability and lifetime (# of operations)Some of the future performance requirements have no known solutions, (e.g., signal isolation requirements)
13 Critical IssuesThere is little uniformity for reporting performance characteristics in device data sheets.A new terminology standard is in development and a new iNEMI project is starting to standardize characterization protocols.MEMS manufacturers seek to lower the rising cost of testing as functionality increases.The volume of MEMS testing is lower than ICs but the cost of testing per device is much higher. Testing can consume 60% of the manufacturing cost.Potential solutions include:Methodologies and validation for Wafer Level Testing.Methodologies for Design for Test.
14 Plans for 2013The MEMS Technology Working Group is affiliated with the ITRS and iNEMI.The iNEMI MEMS Chapter has been expanded to include consumer health and automotive applications. These will be further expanded in the 2013 ITRS MEMS Chapter.Our TWG discussions are exploring the concept of sensor integration nodes.We will incorporate magnetometers (electronic compass) and pressure sensors (altimeter) in the roadmap.A new terminology standard for MEMS Sensors is being developed.Driven by member companies in The MEMS Industry Group, which include Intel, Qualcomm, ST Microelectronics, Bosch, and Freescale.An iNEMI project on MEMS Testing Requirements will be starting on defining testing protocols for device performance metrics in data sheets.
15 ConclusionsSystems integrators play a key role in developing cooperation between the device manufacturers.MEMS Sensor Fusion creates challenges for testing as complexity increases while still lowering cost.MEMS device performance and testing requirements depend on the application (consumer electronics, automotive, medical, defense and aerospace).The concept of sensor integration path might facilitate longer term road mapping of MEMS and possibly other More than Moore Technologies.