1. CS/COE0447 Computer Organization & Assembly Language
Course Intro
and
CHAPTER 1

2. Course Information Welcome to CS/COE0447! Professor Teaching Assistant
Dr. Jan Wiebe
Teaching Assistant
Graduate: Kiyeon Lee
Undergraduate:
Toby Horn, Mike Maksymowych, Jesse Szwedko
Course web page, including syllabus, lectures notes, assignments, labs, schedule, …

3. Computer Systems “Desktop computers” “Servers” “Embedded computers”
E.g. PCs, MACs, …
Includes Notebooks
“Servers”
Web servers
File and compute servers
Supercomputers
“Embedded computers”
Usually NOT directly observable
Very wide range of applications

4. Desktop Computers

5. Servers

6. Embedded Computers

7. A Cell Phone System

8. Computer Organization
Study this part in CS1541!
We study this part in this course!

9. In CS/COE 447 We will study We will do Computer architecture
MIPS architecture
Concepts of assembler, linker, compiler
Computer arithmetic
Signed and unsigned binary numbers
Floating point format
Operations (add/div/…)
Logic design
Basic processor performance analysis
Processor organization
Datapath
Control
We will do
Assembly language programming (in MIPS) BA

10. Computer Architecture?
Computer systems
Underlying hardware
Software running on it
Computer architecture
The hardware/software interface seen by the user
Instruction set architecture (ISA)
Processor microarchitecture
Implementation of a given architecture
May or may not be visible to the user

11. Layered Approach in Computer Design
Computer Architecture or
Instruction Set Architecture
Architecture
Microarchitecture
Logic gates
Transistors

12. Machine Code Example void swap(int v[], int k) { int temp;
temp = v[k];
v[k] = v[k+1];
v[k+1] = temp; }
swap:
muli $t0, $a0, 4
add $t0, $a1, $t0
lw $t1, 0($t0)
lw $t2, 4($t0)
sw $t2, 0($t0)
sw $t1, 4($t0)
jr $ra
compiler … … … … … … …
assembler

13. Components of ISA
In most cases, a “programmer’s reference manual” (PRM) will disclose the ISA of a processor
To understand an ISA, find in PRM
Data types the processor supports
Supported instructions and their definitions
Registers (general-purpose & special purpose)
Processor modes
Exception mechanism

14. Inside a PC Integrated Circuits (ICs)
CPU (Central Processing Unit), companion chipset, memory, peripheral I/O chip (e.g., USB, IDE, IEEE1394, …)
Printed Circuit (PC) boards (next slide)
Substrate for ICs and interconnection
Distribution of clock, power supply
Heat dissipation
Hard disk, CD-RW DVD-RW, (floppy disk)
Power supply
Chassis
Holds boards, power supply, and provides physical interface for user and other systems
Connectors and cables

15. Closeup photo of one side of a motherboard PCB, showing conductive
traces and solder points for through-hole components on the opposite side.

16. Integrated Circuits 1mm~25mm on a side 100 ~ 1000M transistors
25 ~ 250M “logic gates”

17. Technology Trend (Processor Complexity)
2x transistors/chip every 1.5 years!

18. Astounding that it has held for so long!!!
Moore’s Law
The term Moore's Law has been coined by Carver Mead around 1970.[4] Moore's original statement can be found in his publication "Cramming more components onto integrated circuits", Electronics Magazine 19 April 1965:
“The complexity for minimum component costs has increased at a rate of roughly a factor of two per year ... Certainly over the short term this rate can be expected to continue, if not to increase. Over the longer term, the rate of increase is a bit more uncertain, although there is no reason to believe it will not remain nearly constant for at least 10 years. That means by 1975, the number of components per integrated circuit for minimum cost will be 65,000. I believe that such a large circuit can be built on a single wafer.[1]
Astounding that it has held for so long!!!

19. Memory Capacity Trend (DRAM)
1.4x/year or 2x every 2 years
8000x since 1980!

20. Technology Advances (!)
Memory
DRAM capacity: 2x / 2 years (since ’96)
64x size improvement in last decade
Processor
Speed (in terms of clock frequency): 2x / 1.5 years (since ’85)
100x performance improvement in last decade
Disk
Capacity: 2x / 1 year (since ’97)
250x size improvement in last decade

21. Main memory PC/servers use “DRAM” (Dynamic RAM) SDRAM DDR SDRAM
RDRAM (RAMBUS DRAM)
A typical SDRAM “module”

22. Main memory, cont’d
Embedded computers use DRAM or SRAM (or both) depending on applications
SRAM, SDRAM, FLASH all
in a same chip!

23. Storage Secondary storage Non-volatile
Stores programs, user-saved data, etc.
In PC/server domain, magnetic disk (hard-disk) is usually used
In embedded computers, “flash” memory or “ROM” is usually employed

24. Storage, cont’d USB Flash card 256MB 5.25-inch floppy disk 1.2MB

25. Storage, cont’d

26. Computer Networks Local Area Network (LAN) Wide Area Network
Within limited distance (e.g., in a building)
Mostly based on Ethernet
10Mbps, 100Mbps, 1Gbps, 10Gbps, …
Wide Area Network
Connecting networks far apart
Proliferation of wireless LAN (IEEE802.11)
1 ~ 100Mbps

27. (Simple) IC Process Overview
Silicon ingot (silicon cylinder)
(Blank) Wafers
Various steps to build circuits on wafers
Patterns of chemicals placed wafer
“Wafer test” to sort out bad parts
Tested “die” (diced into components – dies, chips)
“Packaging” steps
Wire bonding (connected to the I/O pins of a package)
“Chip test” to sort out bad parts (mistakes happen during packaging)
Products