1. 1 AVPM Annual Meeting October 6, 2009 Peter Garvin RPET Blisters and the impact on Heatseal Technology

2. 2 Technical Review-Heat Seals Components Blister types Adhesive Technologies Current Status

3. 3 Technical Review-Heat Seals Blister Type Traditional PVC – Vast Majority of Market PET & RPET Blisters -Expanding

4. 4 Technical Review-Heat Seals Blister Type – other impacts Blister Flange – need a minimal size to ensure heatsealing operation adherence of the blister to the ink/board stock Mold Release & denesting lubricants – need minimal amounts to preclude disruption of adhesion

5. 5 Technical Review-Heat Seals Heat Seal Coating Printing Ink Clay Coating Chemical Sizing Paperboard Clay Coating Plastic Blister Blister Flange Blister Flange BASE SHEET FINISHED SHEET Visual Carded Packaging Components & Assembly

6. 6 Technical Review-Heat Seals Adhesive Technology The adhesive itself is applied over wax-free inks on the blister board The heatsealing operation allows the molten adhesive to wet out the blister and the ink/board

7. 7 Technical Review-Heat Seals Adhesive Technology The adhesive does not “dive in” to the board as originally thought. (Determined by AVPM technical committee analysis) Thus – the blister itself is vital to a proper and secure structure A proper seal is the result of the bond between blister and ink/board, being strong enough so that the board ruptures in the base sheet (not clay split!!)

8. 8 Technical Review-Heat Seals Adhesive Technology (Solvent Base) Applied off-line in second step on roll-coater over dry inks (may require spray powder) Able to adhere to a wide variety and “quality” of blisters – most forgiving technology – better wets out the flange. EVA and Vinyl Technologies Solvent recovery or incineration required

9. 9 Technical Review-Heat Seals Adhesive Technology (Water – Base) Applied in-line over wet ink on a litho press equipped with an in-line coating unit Lower cost than off-line coating - 1 step process PUR and Acrylic Technologies

10. 10 Technical Review-Heat Seals Current Status “Green” concerns drive the blister package to more environmentally friendly components Board stock is repulpable (Beloit Study) Heatseal Adhesive – Currently water-base, devoid of organic solvents / and in-line which eliminates a second operation which reduces energy and cost

11. 11 Technical Review-Heat Seals Current Status – Blisters PVC Blisters – Issue with environment (Chlorine) Being greatly reduced and eliminated in EU and now in North America Recyclability provides for “better score” on Walmart score card as well as with the consumer/customer – Hence RPET!!!!

12. 12 Technical Review-Heat Seals Current Status – Blisters – RPET RPET Blisters vary in amount of “recycled” components This may vary the surface energy and corresponding effect on the ability of the adhesive to wet the substrate and adhere the blister to the ink/board

13. 13 Technical Review-Heat Seals Current Status – Blisters – RPET Thus to overcome the variation – solvent base systems provide the safest solution (traditional system with the ability to wet out the film when sealed) Solvent base (EVA) in effect “covers the sins” of the variation inherent in typical RPET blister stock

14. 14 Technical Review-Heat Seals Current Status – Blisters – RPET Water base systems (PUR) - are being developed to allow for their benefits (one-pass / no organic solvents) This will take the Blister Package to the “greenest” option Best bet is to test the combination of board /ink / heatseal coating / blister in the laboratory prior to approval

15. 15 Technical Review-Heat Seals Current Status – Blisters - RPET When completed make sure to specify each component!!! With the same board – ink – heatseal / and specified RPET!!! This structure should provide the optimal desired and properly sealed package!!!

16. 16 Technical Review-Heat Seals Questions?? Thank you!!! Peter Garvin Henkel Peter.Garvin@us.henkel.com (513) 417 - 3980 Peter.Garvin@us.henkel.com