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22/11/2013 Gerrit Jan Focker, BE/BI/PM 1 BI review on Radiation development and testing. Analogue Electronics for: - L4 Grids, - L4 Scanners, - PS Complex.

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Presentation on theme: "22/11/2013 Gerrit Jan Focker, BE/BI/PM 1 BI review on Radiation development and testing. Analogue Electronics for: - L4 Grids, - L4 Scanners, - PS Complex."— Presentation transcript:

1 22/11/2013 Gerrit Jan Focker, BE/BI/PM 1 BI review on Radiation development and testing. Analogue Electronics for: - L4 Grids, - L4 Scanners, - PS Complex Grids.

2 22/11/2013 Gerrit Jan Focker, BE/BI/PM 2 Linac 4, Technology Choice. u Initial design was for Linac 4. u 21 Wire-grids at 11 positions, u 6 X-Y Wire-scanners. u At the time of designing the radiation levels were unknown, but said to be “high”. u Little time for development, production planned right from the start. u No choice was given about where to place the equipment. u To reach the specifications the electronics should be near the detectors (Initially 1m80, new design would allow ~8m), i.e. in the tunnel. u Therefore we have opted for a system with only the absolutely necessary electronics near the beamline: u Only amplifiers, u No logic, u Remote power supplies.

3 22/11/2013 Gerrit Jan Focker, BE/BI/PM 3 PS Complex (excluding L4). u While designing for L4 it was decided that the system could easily be adapted to be used for integrating amplifiers for the PS Complex as well, with different amplifiers. u Standardisation. u But: as a result the decision was taken to install this new system in the whole PS Complex during LS1. u 45 Wire-Grids at 33 positions. u Very little time for development, the production started before testing with beam.

4 22/11/2013 Gerrit Jan Focker, BE/BI/PM 4 Grid System overview. u Between Grid and Amplifier: two cables with twisted pairs with individual screening. The two cables will be mounted together in large Harting 72-pin connectors. u (Twisted-pairs simply because it is available at CERN…) u At the PS Complex on many grids (existing) LEMO cables will be used. u Between Amplifiers and Controls a single cable will be used (CERN ND100) mounted with Harting 108-pin connectors. u Power and I/O control are handled by the same ND100 cables, no additional cabling is foreseen. u At Linac 4: Bias +120V directly onto measuring wires. u This talk is about the Amplifiers only.

5 22/11/2013 Gerrit Jan Focker, BE/BI/PM 5 Amplifier-boxes. u Up to 32 channels per Motherboard, 2 Motherboards possible in one 2U chassis. u Daughter-boards carrying 4 amplifiers each.

6 22/11/2013 Gerrit Jan Focker, BE/BI/PM 6 Amplifier Design Details. u No electronic switches: miniature reed-relays. u No radiation problems, u Galvanic isolation, u Low contact resistance, u More problems with manufacturing… u The amplifiers cannot consume too much power, u Power: losses over 200m cable. u By reducing heat in chassis we hope to increase lifetime. u Input-protection by small-signal diodes BAV199 and zener-diode(s) BZX84Cxx. u Amplifiers AD8610ARZ, AD8032ARZ and AD8397ARZ, u All from Analog Devices XFCB process, u (Not that many alternatives anyway…) u Report from the European Space Agency and NASA: u “Commercial Components Identification In Naturally Radiation Hardened Technologies” 2002ESASP.507...17M u Chips from this family that were tested were still o.k. after 100kRad(Si) radiation. u It is claimed that these chips appear not to suffer from single event upset. u But a remote control of the Power Supplies is foreseen.

7 22/11/2013 Gerrit Jan Focker, BE/BI/PM 7 Linear Amplifier for Linac’s (1). u Amplifier’s Maximum Electrical Input: 10mA, u Amplifier’s highest sensitivity: 1μA full scale, u The calculated input-related noise-level is ~2nA at 1MHz BW. u Overall BW is mainly defined by the cable-length between grid and electronics, u The newer design allows cables up to 8m. u Isolated input-stage: u Bias of up to +120V on measuring wires (Linac 4). u Isolated input-stage avoids large input-capacitors. u The design includes the use of test-resistances: u At the amplifier-inputs. u Outside the vacuum-chamber at the cable-connection, u At the grid in the vacuum-chamber, u (Only applied at the new L4 grids and Scanners).

8 22/11/2013 Gerrit Jan Focker, BE/BI/PM 8 Linear Amplifier for Linac’s (2)

9 22/11/2013 Gerrit Jan Focker, BE/BI/PM 9 Linear Amplifier for Linac’s(3).

10 22/11/2013 Gerrit Jan Focker, BE/BI/PM 10 Scanner Amplifier (L4). u For the Scanners the same linear amplifiers are used as for the Linac SEM-Grids. u Same 4-channel Amplifier boards. u Grids have many wires: u If a channel dies one will still have a picture. u Redundancy for the scanners: u Two Amplifiers are connected to each wire, u Each channel is doubled from beginning to the end and uses two ADC channels.

11 22/11/2013 Gerrit Jan Focker, BE/BI/PM 11 Scanner Amplifier input.

12 22/11/2013 Gerrit Jan Focker, BE/BI/PM 12 Integrating Amplifier for circular machines (1). u Amplifier’s Maximum Electrical Input: 250nC, u Amplifier’s highest sensitivity: 2,5pC full scale, u The sensitivity appears to be limited mainly due to instabilities from the Power Supply (quite variable, 25fC ???). u Cable-length between grid and electronics defines noise and speed of the Amplifiers, u Some cables up to 20m, u For reliable measurement of the short pulses at TT2: length should be < 3m. u Test-resistances: u Only at the amplifier-inputs. u Grids and cabling would have to be rebuilt for others tests. u Two input circuits: u Active integrator for charges up to 2,5nC, u Passive integrator for higher charges. u The active integrator should be able to withstand a pulse of at least 250nC !

13 22/11/2013 Gerrit Jan Focker, BE/BI/PM 13 Integrating Amplifier (2)

14 22/11/2013 Gerrit Jan Focker, BE/BI/PM 14 Integrating Amplifier (3)

15 22/11/2013 Gerrit Jan Focker, BE/BI/PM 15 Integrating Amplifier (4)

16 22/11/2013 Gerrit Jan Focker, BE/BI/PM 16 Integrating Amplifier (5)

17 22/11/2013 Gerrit Jan Focker, BE/BI/PM 17 Placement of the electronics in the tunnels. u L3, PS inflection zone, Booster BTM, LEIR, TT2 and most of the L4: u Underneath or close to the Beamlines. u Help from the Radiation-to-Electronics Team (Joao), u L4: Define a position close to the Dump for a small Rack and protection. u PS and Inflection zone, u PS position 42 to 56: use the gap next to the support girder like Jeroen does. u Inflection zone: just move some electronics out of the way. u Cable-lengths: u Linac’s linear amplifiers: up to 8m. u Integrating amplifiers (not TT2): more than 8m degrades signal. u TT2: shorter than 3m.

18 22/11/2013 Gerrit Jan Focker, Jean Tassan-Viol, BE/BI/PM 18 Place in the Linac 4 tunnel (1) EmplacementType de montageType de capteurPosition LEBTMontage sur la poutreSEM grid 2 x 24 wiresL4L.BSGH.1151 L4L.BSGV.1151 Chopper lineMontage sur la poutre2 Wire scannersL4L.BWS.3312 L4L.BWS.3712 DTLRien CCDTLAu solSEM grid 2 x 24 wiresL4C.BSGH.0121 L4C.BSGV.0121 CCDTLAu solWire scannerL4C.BWS.02112 CCDTLAu solSEM grid 2 x 24 wiresL4C.BSGH.0421 L4C.BSGV.0421 CCDTLAu solWire scannerL4C.BWS.0622 PIMSAu solSEM grid 2 x 24 wiresL4P.BSGH.0121 L4P.BSGV.0121 PIMSAu mur, on a 75cmWire scannerL4P.BWS.0402 PIMSAu mur, on a 75cmSEM grid 2 x 24 wiresL4P.BSGH.0601 L4P.BSGV.0601 PIMSAu mur, on a 75cmWire scannerL4P.BWS.1002 Au solSEM grid 2 x 24 wiresL4T.BSGH.0223 L4T.BSGV.0223 Juste avant ligne dumpRienBSM RackSEM grid 2 x 24 wiresL4T.BSGH.0243 L4T.BSGV.0243 Ligne dumpRackSEM grid 2 x 24 wiresL4Z.BSGH.0273 L4Z.BSGV.0273 Ligne dumpRackSEM grid 2 x 24 wiresL4Z.BSGH.0287 L4Z.BSGV.0287 VirageRackSEM grid 2 x 24 wiresL4T.BSGH.0523 L4T.BSGV.0523 L4TAu solSEM grid 2 x 24 wiresL4T.BSGH.1247 L4T.BSGV.1247

19 22/11/2013 Joao Pedro De Carvalho Saraiva, Jean Tassan-Viol, Gerrit Jan Focker, BE/BI/PM 19 Place in the Linac 4 tunnel (2)

20 CPS Radiation levels 22/11/2013 Original slides from Joao Pedro De Carvalho Saraiva, EN/STI/EET 20

21 CPS Radiation levels 22/11/2013 Original slides from Joao Pedro De Carvalho Saraiva, EN/STI/EET 21

22 CPS Radiation levels 22/11/2013 Original slides from Joao Pedro De Carvalho Saraiva, EN/STI/EET 22

23 CPS Radiation levels 22/11/2013 Original slides from Joao Pedro De Carvalho Saraiva, EN/STI/EET 23

24 CPS Radiation levels 22/11/2013 Original slides from Joao Pedro De Carvalho Saraiva, EN/STI/EET 24

25 22/11/2013 Gerrit Jan Focker, BE/BI/PM 25 Conclusions. u Little choice of chips suiting our requirements, u From the chips we found at least the family characteristics seem to allow to use them in a somewhat radioactive environment. u No radiation tests done. If done, they would always have been afterwards… u Thanks to R2E for the great job finding reasonable positions in the tunnels!


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