1. Name – June 11, 2010 – 1 UTober_ExCo Call Preparation on PPP – September 1, 2012 Photonics21 research priorities for the ICT work programme 2013 Work Group 6 Design and Manufacturing of Optical Components and Systems Mike Wale 1 st February 2012

2. Name – June 11, 2010 – 2 Background: WG6 vision: major topics for component technology ►Photonic integration, including specifically the development of generic integration platforms and foundry models, supported by integrated design and simulation environments commensurate with the growing complexity of the application circuits ►Technologies for cost-effective design and manufacturing of components and subsystems, including advanced packaging and production tools ►Integration of photonics with microelectronics at the chip, board and system levels ►Semiconductor optical device technology, including semiconductor lasers, with particular reference to performance capabilities and power efficiency ►Exploitation of new materials capabilities, building on ground-breaking research in new semiconductors, nano-photonics and novel fibre technologies ►Task of WG was to focus overall vision to priorities for Work Programme 2013 ►Conducted by workshop with many additional contributions from membership

3. Name – June 11, 2010 – 3 WP 2013 Objectives – 1: Technologies for cost-effective design and manufacturing of packaged components and subsystems, including advanced production tools ►Background ■Europe has world-leading optical device technology and manufacturing ●PICs, semiconductor lasers, integrated optics, … ■Wafer fabs are economically viable in Europe but assembly of the finished product is now mainly conducted in Asia ■Europe has a very strong position with regard to production equipment (epitaxy, lithography, process tools, robotics) and factory automation ►The Challenge ■In order to maximize value added in Europe, existing labour-intensive assembly methods must be superseded by new technologies exploiting European strengths ●Wafer scale processes, robotic tools, advanced materials ■Cost of product development as well as of manufacture must be brought down ■Effective means must be devised to combine optical and electronic technologies ■Special challenges of assembling complex PICs must be addressed ■Build a European ‘eco-system’ of chip manufacture, component assembly, tool development and optical systems manufacturing ■Step towards new innovation objectives in Horizon 2020, e.g. European design/pilot manufacturing centres facilitating access to leading edge production technology

4. Name – June 11, 2010 – 4 WP2013 Objectives – 2: Development of generic photonic integration platforms and foundry models, supported by integrated design and simulation environments commensurate with the growing complexity of the application circuits ►Background ■Photonic Integration is a major European strength ●Helped by long-term support by EC as well as industrial investment ■The development of generic PIC platforms is a European innovation with potential for major economic impact ■Clear European lead at this point but this lead is fragile ●Technology and methodology not yet proven for full-scale deployment ●Other regions are starting to catch up and adopt similar methods ►Challenge ■Ensure that PIC platforms are brought to the point where commercial forces will be able to take over at an acceptable level of risk ●Including design expertise and user experience ●Lower barriers to entry for users and stimulate development of user community ■Increase scope and capability of available platforms ●Electronic-photonic integration; new materials and technologies ■Step towards larger scale actions in Horizon 2020 (e.g. pilot lines)

5. Name – June 11, 2010 – 5 WP2013 Objectives – 3: Semiconductor optical device technology, including semiconductor lasers with new capabilities and higher power efficiency ►Background ■Europe is strong in semiconductor device technology, including R&D, design and production ■European companies are market leaders in many important sectors ●VCSELs to high power lasers ●Consumer goods to lasers in manufacturing tools for auto industry ►Challenge ■Maintain/extend lead by developing and adopting new (risky) technologies ■Facilitate entry to new markets (e.g. healthcare, consumer, cosmetic, IT, …) ■Key challenges: ●Power efficiency and thermal management ●Beam control and delivery, from ultra-precision at micro/nano-scale to macroscopic high power systems ●Availability of new laser wavelengths and functionalities ■Maintain European inventiveness and adoption of new technologies

6. Name – June 11, 2010 – 6 WP2013 Focus – Topic 1 Technologies for cost-effective design and manufacturing of packaged components and subsystems, including advanced production tools ►Priority Action: ■Innovative and disruptive technologies for cost-effective assembly of photonic devices and circuits, including associated microelectronics where needed (STREP/IP) ■Addressing the thermal, mechanical, optical and electrical (signal integrity) challenges in packaging for PICs as well as for discrete devices ■Appropriate solutions could include wafer-scale processes, lithographic alignment, advanced materials and robotic tools ►Context and long-term goals ■Systems for systematic design and rapid prototyping, leading seamlessly into volume production in Europe ■Steps towards pilot design/manufacturing centres in Horizon 2020

7. Name – June 11, 2010 – 7 WP2013 Focus – Topic 2 Development of generic photonic integration platforms and foundry models, supported by integrated design and simulation environments commensurate with the growing complexity of the application circuits ►Priority Actions: ■Development of integration platforms with enhanced capabilities through the introduction of new semiconductor materials and device structures, emerging technologies such as membranes and nanophotonics and the integration of photonics with microelectronics (STREP/IP) ●Including supporting developments in design tools ■Support measures to expedite the introduction of and access to generic integration technologies and methodologies, complementary to the actions taken to support silicon photonics in the present work programme (SSA) ►Context and long-term goals: ■Highly capable, fully integrated design and manufacturing environments based on the generic platform concept ■Steps towards pilot design/manufacturing centres in Horizon 2020

8. Name – June 11, 2010 – 8 WP2013 Focus – Topic 3 Semiconductor optical device technology, including semiconductor lasers with new capabilities and higher power efficiency ►Priority Action: ■Exploitation of new semiconductor materials, nanostructures and associated design concepts in photonic devices and photonic integrated circuits, thereby providing ●Innovative approaches to improved power efficiency and thermal management, and/or ●Improved beam control and delivery (e.g. ultra-precision at micro/nano- scale, high coherence at high power) (STREP) ►Context ■Enabling new applications (e.g. near field microscopy, laser-assisted magnetic recording, materials processing, medical systems …) as well as maintaining global competitiveness in existing markets ►Longer-term goal: ■Introduction of new laser wavelengths and functionalities

9. Name – June 11, 2010 – 9 Expected impacts - 1 ►Economic growth and employment ■The measures proposed here will enable the European optical component industry to achieve market leadership in key areas of high technology and to retain and enhance its competitiveness ■Developments in manufacturing and assembly technology will enable the present flow of production-related jobs to Asia to be reversed ■Availability of photonic integration platforms will allow European companies to innovate in numerous new application fields and thus open up new markets ■The development of a European design and production ecosystem for optical components will stimulate innovation at systems level

10. Name – June 11, 2010 – 10 Expected impacts - 2 ►Impact on societal challenges ■Clear and direct impact for knowledge society through applications in IT ■Focus on energy efficiency in components will translate into larger savings at systems level ■Impact on healthcare, ageing society and environmental concerns will be achieved by enabling the rapid introduction of new medical techniques, sensors and communications devices ►Impact and leverage on other industry ■Photonics is a Key Enabling Technology for a wide range of industries ■Optical component technologies are at the apex of the inverted pyramid and so have huge leverage ■Availability of photonic integration platforms will allow European companies to innovate in numerous new application fields ■Production in Europe will stimulate exploitation in Europe through the evolution of industrial clusters