1. Experience in machining precision accelerator components
Looking back and ahead

2. Contents
Company introduction
Looking back and ahead
Cost study
Ambitions for CLIC
Summary

3. VDL Groep Established in 19 countries 85 operating companies
> 10,000 employees, privately owned
Turnover 1.8 billion (2013)
Bus group
touring cars
public transport bus
mini and midi busses
Chassis modules
second hand trade
Finished products
medical equipment
process installations
consumer products
production automation
various products
packaging equipment
Sub contracting
mechatronic systems
module assembly
part and sheet metal
Surface treatments
plastic processing
other specialties
Car assembly
NedCar

4. VDL ETG: our company DNA
COMPETENCES
Positioning
Handling
Vacuum
R&D support
Prototyping
Supply Chain Management support
Volume production
Value Engineering
Sustaining & After sales support
QLTC Management
Complex mechanical parts
Modules
Fully integrated systems
PRODUCTS
PROCESSES

5. VDL ETG Core Technology Markets
Semiconductor Capital Equipment
Turn Key Projects
Led Manufacturing Equipment
Analytical Equipment
Solar Production Equipment
Medical Equipment
Science & Technology
Is a technology driver for our main stream business
Benefits from our expertise in manufacturing and assembly for series manufacturing
Focus of employing core technologies to :
Free Electron lasers and CLIC
Optical modules for instruments.

6. VDL ETG Added Values for S&T
Time to market
Co-development & rapid proto typing
Increased complexity requires higher level outsourcing
CLIC (future): from cell over bonding to (ultimately) complete module
EUV light source : from idea to product in 1 year
Industrialization
Early customer involvement - cost control & risk reduction
Co / Redesign for manufacturability
Mirror base module for ELT : weight reduction of 100 kg per module (1000 modules needed)
Second Harmonic Output Cavity
Redesign for manufacturability, assembly and tuning with a cost optimization by reduction of the nr of parts from 21 to 12 and the nr of brazing steps from 3 to 2

7. Examples of best practices
X-band structures for CLIC
PETS
HP loads ….
BOC Pulse compressor
J-Couplers for SwissFEL
SwissFEL structures
RF Gun
CCL Accelerating Structures
Matisse mirrors for the VLT
RF Hybrid Blocks (163–211GHz) for ALMA Telescopes
Breadboard with optics for TMA nano satellite
Mount for the Sentinel 5 Spectrometer

8. Plans for the future - Strengthening our capabilities
Parts manufacturing
Industrializing machining process
Integrating quality control
Assembly & test
Strengthening our capabilities on
E-beam welding
Etching
Out baking
Building up experience on
H2 bonding
RF testing
Capability reinforcement needs to be done with (international) partners in academia and industry.
Parts manufacturing
HPT machining
UPT machining
Metrology
Assembly & test
Brazing
E-beam welding
Cleaning
Etching
H2 bonding
Out baking
Clean room assembly & test
RF testing

9. Plans for the future - Targeting new markets for X-band
Using X-band normal conducting accelerators opens new perspective on market drivers
Increased field strengths / gradients
Ability to scale down
Cost of ownership
Reliability (using C&S-band frequencies and parts with X-band specifications)
Life Time (using C&S band frequencies and parts with X-band specifications)
Infrastructure (less energy & no cryogenic infrastructure required)
Plan to address the potential markets
Intensifying the relationship with our technology partners and capitalizing our common knowledge and (future) experiences in X-band
Identifying accelerator applications
Building up expertise teams on commercial applications for X-band

10. Applications divided into particle type
Accelerators
Electron
Low energy application
(large market)
Material treatment
(existing / growing market)
E-beam Welding
(growing market)
SEM/ TEM
(existing market)
Fundamental research
(niche market)
Generating radiation
Collision with target to generate X-Ray
(existing and large market)
X-ray imaging
Tumor treatment
Sterilization
Security
(proof of concept)
Free Electron Laser
wide range of wavelengths
Materials and biological research
Light source lithography
(ideas)
Defense (USA)
Proton )
(small but growing market)
Materials Research
(small market)
Proton beam lithography
Other elements
(proof-of-concept)
Potential for compact accelerator
Accelerators
Electron
Low energy application
(large market)
Material treatment
(existing / growing market)
E-beam Welding
(growing market)
SEM/ TEM
(existing market)
Fundamental research
(niche market)
Generating radiation
Collision with target to generate X-Ray
(existing and large market)
X-ray imaging
Tumor treatment
Sterilization
Security
(proof of concept)
Free Electron Laser
wide range of wavelengths
Materials and biological research
Light source lithography
(ideas)
Defense (USA)
Proton )
(small but growing market)
Materials Research
(small market)
Proton beam lithography
Other elements
(proof-of-concept)

11. Applications : Proton therapy
First commercial linear accelerator application for VDL ETG
LIGHT (Linac for Image Guided Hadron Therapy) developed by ADAM
VDL ETG is partner to manufacture., build and test the CCL Accelerating modules
First module delivered for high power test (Low power RF and bead pull test VDL)
VDL ETG was responsible for
Manufacturing redesign
Parts manufacturing
Assembly and brazing

12. Applications : ART*LIGHT
Bones
Synchrotron research for art and archaeology
Varnishes on musical instruments
Courtesy of the Mary Rose Trust.
Painting alterations
Conservation wreck of warship
Glasses decoration

13. Applications : ART*LIGHT
Synchrotrons...
High brilliance
High energy x-rays
Coherent
Variable energy
Accessibility
Beam time
Available space
Beam intensity
BUT:
Elemental, molecular & structural characterization
Imaging with micron resolution
The most powerful non-destructive diagnostic tool

14. ART*LIGHT will change the way we look at art
Applications : ART*LIGHT A Dutch Tabletop Synchrotron for Conservation Research
Compton Back Scattering source
A compact synchrotron-like light source inside the museum!
4 m
ART*LIGHT will change the way we look at art

15. Looking back
Long standing supplier of CLIC prototype parts (since 1989)
circa 1994
2008
Evolution of requirements
30 mm disks
circular iris
no waveguides
1990’s
2000’s
80 mm disks
elliptical iris
closed waveguides
2010’s
Higher demands on surface finish and flatness due to shift from brazing to bonding
Open waveguides

16. Looking back VDL ETG is involved in CLIC for
Technology push for machining capabilities
Business potential in CLIC and related applications
CLIAPSI
SwissFEL

17. Looking back – and ahead
VDL ETG is involved in CLIC for
Technology push for machining capabilities
Business potential in CLIC and related applications
SwissFEL
and AVO

18. Cost study
Based on the experienced gained in the small series production a study was carried out focused on:
Engineering design: cost driving areas and proposals for a significant saving;
Tolerances, Ra, flatness: identification of the areas where a relaxation of the requirements would lead to a cost saving;
Technologies: final machining is the costly operation; which specification could allow switching from Ultra Precision to High Precision machining.
Pre machining
Sawing
Turning
Pre-milling
Drilling tuning holes
Measurement
Annealing
End machining
Fly cutting
End milling
Turning side waveguides
Turning opposite side
Metrology
Cleaning & inspection
Standard manufacturing flow

19. Cost study – breakdown per manufacturing step
Item
Operation
Cost
Tooling
Turning tool - Turning PT
0.6%
Mill - Milling PT
0.5%
6.9%
Diamond mill - Milling UPT
3.4%
Diamond tool - Turning UPT
2.4%
Stage
Manufacturing step
Pre machining
Work preparation PT / HPT
1.2%
Programming PT / HPT
1.4%
Sawing
Turning PT
2.7%
12.7%
Drilling
1.9%
Milling PT
2.8%
Annealing
Metrology PT - HPT
1.5%
End machining
Work preparation UPT
Programming UPT
2.2%
Flycutting
3.5%
Milling UPT
35.4%
79.7%
Turning UPT
27.3%
Cleaning
1.1%
Metrology UPT
9.0%

20. Cost study – Cost down 2011  2013
Cost level down from 100% to 86% (2011 to 2013)
Actions taken for :
Use of adapted tooling in pre-machining
Pallet machining & 2 different zones for diamond milling
Reduction of end metrology by on machine measurements
Highest cost remain in end machining
Diamond milling (35% of 2013 cost level)
Diamond turning (27% of 2013 cost level)
End metrology (9% of 2013 cost level)

21. Cost study – Cost reductions
Current cost drivers are identified – some changes are already implemented
2 zones (profile accuracy of 4 μm in zone A and 20 μm in zone B)
Reduction of the nr end measurements
Possible cost reductions
Increase of series size as large(r) series will significantly reduce manufacturing costs
Remaining at UPT-machining
Design change from corner radii (rr) from 0.5 mm to 2.5 mm
Relaxation of surface finish on
side walls of wave guide
bonding face(s)
Iris
Dedicated UPT machines
Switch to HPT-machining

22. Cost study – Cost reductions  dedicated UPT-machine
Parts to be machined based upon CLEX-structure
Investigation was started with LT Ultra following 2 different approaches :
Single disk UPT machine
All machining operations done in one setup
Small strokes  high accelerations  short manufacturing times
1 disk per manufacturing step  frequent handling (operator or robot)
Automation possible ?
Multiple disk UPT machine
All machining operations on multiple discs in one setup
Larger moving masses  lower accelerations  longer machining times
Multiple disks per machining step  less handling
Complex machine (multiple C-axes)
Can be based up on current milling machine (already capable of disc machining / part metrology and pallet machining implemented)

23. Cost study – Cost reductions  Switch to HPT-machining
Main differences between UPT and HPT machining are:
Higher feed rates at HPT machining  RPM of milling spindles is currently the limiting factor
Higher power and torque of axes allow higher material removal rates  can introduce stresses and sub surface damages (max 10 % of cutting depth)
Better lubrication using spray lubrication in stead of mist  risk for contamination of parts
HPT machining is an industrial technology with a higher level of automation  can be developed / further optimized for UPT machining
Machine prices are comparable, perhaps even higher for HPT machines
CLIC
Matrix build based upon profile accuracy of RF-zones (iris and waveguides) and surface finish.
 significant tolerance relaxations needed
 Without significant relaxations on both tolerances and RF-specifications HPT-machining will have no advantages to UPT-machining

24. Ambitions : from CLIC Disc to 2 Beam Module for CLIC
O₂-free Copper
Ultra Precision
Accelerator Structure
H₂ - bonding
Ultra Clean
RF-unit
E-beam welding
Testing
2Beam Module
Tenderable TPD
Final Assy & Test
CLIC

25. CERN : We want you to challenge us.
Summary
As VLD ETG we gained a lot of experience over the last decades
Are at a standstill with a risk of expertise loss
Gaps are (partially) filled with CLIC-related projects
Cost reductions are realistic (and identified) but require :
Higher volumes and the related dedicated equipment
A specification relaxation (if possible)
We are ready for volume production and higher level assembly
CERN : We want you to challenge us.