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Design Engineers: Matthew Den Herder Jason Fullen Daniel Martinez James Sparks Kellyne Winchester Gustavo Barrios Adrian Cedeno Eduardo Ceja German Ontiveros.

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Presentation on theme: "Design Engineers: Matthew Den Herder Jason Fullen Daniel Martinez James Sparks Kellyne Winchester Gustavo Barrios Adrian Cedeno Eduardo Ceja German Ontiveros."— Presentation transcript:

1 Design Engineers: Matthew Den Herder Jason Fullen Daniel Martinez James Sparks Kellyne Winchester Gustavo Barrios Adrian Cedeno Eduardo Ceja German Ontiveros Michael Rueda Dale Steen

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3  Insert content

4  What is ANT? ◦ Wireless Networking Protocol ◦ Collection and tracking of Sensor Data  Why ANT? ◦ Engineered for Efficiency ◦ Reliable Data Communications ◦ Low Power and low cost

5 ADK (Seeed Studios ATMega2560 with integrated Host Shield) Example Iridium Connector Shield RS-232

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9 Thermoset polymer, three layer capacitor construction Integrated Resistive Temperature Detection for Temperature Correction Condensation-Resistant Hydrophobic Filter Honeywell

10  3-Axis, 8-bit Digital Accelerometer (I2C)  ±2g/±4g/±8g dynamically selectable full-scale  Output Data Rates (ODR) from 1.56 Hz to 800 Hz  Two programmable interrupt pins for seven interrupt sources  Automatic ODR change for Auto- WAKE and return to SLEEP 16 PIN QFN 3 mm x 3 mm x 1 mm

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12  I2C communication  Simple barometer with digital output and high performance  Accurate to ±1 kPa over the 50 kPa to 115 kPa pressure range  Write Mode ◦ Start sequence->7bit slave address | slave ACK then writes  Read Mode ◦ Starts with Start sequence -> Stop Condition

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14 Pcomp = a0+(b1+c11*Padc+c12*Tadc)*Padc+(b2+c22*Tadc)*Tadc Where: Padc is the 10-bit pressure output of the MPL115A ADC, Tadc is the 10-bit temperature output of the MPL115A ADC, a0 is the pressure offset coefficient, b1 is the pressure sensitivity coefficient, c11 is the pressure linearity (2nd order) coefficient, c12 is the coefficient for temperature sensitivity coefficient (TCS), b2 is the 1st order temperature offset coefficient (TCO), c22 is the 2nd order temperature offset coefficient.

15 Vishay/Semiconductors TEMD6010FX01 Anode Cathode o Ambient Light Sensor Miniflat SMD o Dimensions (L x W x H in mm): 4 x 2 x 1.05 o PIN photodiode type o High speed and high photo sensitivity in a clear, surface mount plastic package. o Peak sensitivity wavelength at 540 nm. o Conversion will be done using the internal A/D Converter of the MSP430. o Light will be measured in different levels: Detecting Low level, Medium level, and High level light.

16 MSP 430 Moisture Sensor Three Options of Sensor: o Two Rods o Two Copper Tracks on PCB o Wires between paper sheets o The conversion will be done using the internal Comparator of the MSP430 MCU. o Sensor dimensions may vary and are dependent on the required conditions.

17  Placement  Functionality ◦ Connection ◦ How it works ◦ What it tests ◦ What it reports

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19 ItemTeamCost Xperia arcMaster$495.64 ADKMaster$119.27 IridiumMaster$664.95 GSM PlanMaster$70.00 MISCMaster$106.51 Subtotal 1Master$1456.37 Light SensorSensor$14.45 Pressure SensorSensor$76.21 AccelerometerSensor$150.00 Hall Effect SensorSensor$13.00 Humidity SensorSensor$40.84 Subtotal 2Sensor$294.50 TotalSPARTA$1750.87 Budget$3475.00 !! UNDER BUDGET !!$1724.13

20 Master Node Team Progress Update ◦ Software for ANT communication between phone and ANT USB device ◦ Software for Socket communication between phone and SMC ◦ Software for Phone communication with ADK Board Sensors Node Team Progress Update ◦ Sensor Node Sensor Board Schematics ◦ Software for I2C communications between I2C sensor and MSP430 ◦ Software for Sensor node MSP430 sleep/interrupt timing ◦ Sensor Node Power budgets and battery life calculations (Battery Selection) ◦ Software for ADC on MSP430 working with Light/Moisture Sensor ◦ Software for Comparator on MSP430 working with Moisture Sensor ◦ SPI communication working on MSP430

21 Master Node Team ◦ Master Node Schematics and Power Supply Testing ◦ Software for data display for user ◦ Software for Iridium communication with ADK board Sensors Node Team Progress Update ◦ Microcontroller Board ◦ All Sensors Boards and Microcontroller boards working together. ◦ Microcontroller sending measurement data to Radio ◦ Microcontroller receiving threshold data from Radio ◦ Sensor Nodes Assembled with Cases ◦ Sensor Node sending/receiving measurements and thresholds to and from the sensor management center

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