1. Power Delivery Challenges for High Performance Low Voltage Microprocessors Tanay Karnik Microprocessor Research Labs Intel Corporation November 9, 2001

2. Extrapolating Moore’s Law

3. Making Moore’s Law Work

4. & power will limit performance

5. Energy Requirement More energy reduction initiatives required in future

6. Ldi/dt getting worse Package L needs to reduce S -3Package L needs to reduce S -3 Various Sources of Resonance Package L – Die CPackage L – Die C Socket L – Package CSocket L – Package C Motherboard L – Socket CMotherboard L – Socket C Parasitic Inductance Unknown Return Paths Simple layouts form loops which inadvertently interact via magnetic fields

7.  Supply currents reduce only linearly with voltage. –Power Density to increase Surpassed hot-plate power density in 0.6u (P6)Surpassed hot-plate power density in 0.6u (P6) Junction Temp need to work with package research)Junction Temp need to work with package research)  Expect parasitics to increase –Capacitance will increase –R may reduce, but not much –L’s will not reduce  Noise will increase –RI drops in power distribution –L(di/dt) noise will increase S/N will reduce Die Power Delivery CHALLENGE: DELIVER 150A AT 0.9V COST EFFECTIVELY

8. Larger temperature gradient requires smaller heat sink and air flow rate for dissipating the same power. Reduction in  ja will increase cooling cost rapidly. Maintaining larger die temperature reduces  ja in an active power dominated technology. In leakage power dominated technologies larger T j will impact P w and hence  ja and cooling cost. Cooling cost

9. Present Data  CPU consumes 55% Platform Power Single 300-watt or 1+1 350-watt redundant power supply configuration for Intel serversSingle 300-watt or 1+1 350-watt redundant power supply configuration for Intel servers  15A/100V industrial server requirement Future Directions  Paradigm Shifting: Move Bulk DC/DC Conversion and Redundancy into the Rack  Increase the Density Of Power Conversion Everywhere  Integrate Power, Mechanical and Thermal Functions  Integrate the Design of Air movers and the System Server/Platform Level Challenges

10. Possible VRM Solutions  Board VRM close to μP load with low impedance interconnect  On-Package Switched DC/DC Convertors  On-Die DC/DC Convertors

11. Power/Thermal Integration Integrated Power Delivery & Thermal

12. Summary  The power challenges for next generation microprocessors require an Integrated Approach  Optimum Power delivery requires VRM as close as possible to the load of the microprocessor  Thorough analysis of entire power interconnect path is a must  High density power delivery => High cost cooling