1. NeSSI*: Activities Update CPAC - Seattle, WA - May 5, 2003 NeSSI End-Users Group “the best way to predict the future is to create it” *New Sampling/Sensor Initiative

2. Agenda NeSSI Activities Update – Focus Group - 15 NeSSI II Commercialization - 10 – John Mosher DoE Update - 10 –Ulrich Bonne Open Device Vendor Association and Intrinsically Safe Special Interest Group (ODVA + IS + SIG) –Rick Ales – 20 to 30 Rest of the Week - 5

3. “Everyone needs a vision of success…”

4. NeSSI Vision of Success We are able to… –Design... –Assemble... –Configure......an analytical system on our workbench. Lego  Like Assembly –No special skills to assemble –plug and play/self-documenting Fully Automated

5. Time (years) 03 04 NeSSI Roadmap 02 Mechanical Component Availability e.g. filters, valves, etc. Mechanical Field Installations ANSI/ISA SP76 Standard Approved NeSSI/CPAC Vision & Roadmap 2000 Design /Prototype - Gen II Smart/Heating/SAM Smart Field Installations Mechanical Gen. I Smart/”Electrified” Gen. II  Analytical & Wireless Gen. III 01 06 05 Dow Rev. 2, July 2002 uAnalytical Field Installations Simple Analyzers (H2O, O2, pH, UV/VIS, etc.)

6. NeSSI Generation Segmentation Gen III Gen II Gen I Mechanical Components (mostly) Electrical Transducers/IS CANbus Wireless, Advanced Gas & Liq. Sensors & Platform for microAnalytical Value

7. Source: PAI Report7 Industry Segmentation & Market - Worldwide, it is almost a $5-6 B/yr enterprise. - Approx. $2.5B/yr is spend on care and maintenance of an installed base valued at $20-25B.

8. Programmable Substrate Heater NeSSI “Sandwich” concept Ethernet LAN Analyzer Controller V A P F SAM CANbus PDA Auxiliary Heating/Cooling Substrate T T Standard Sampling Interface dcs o&m user Standard Connectivity Interface Development Focus can be on Sensors !

9. Recent Presentations IFPAC 2003 ISA Analytical Division (Calgary) –Bac Vu (Dow) submitted a paper –Jim Tatera (Tatera & Assoc.) brief update

10. IFPAC 2003: Wed PM-II Session "NeSSI: A Sampling Platform for Micro Physical and Micro Analytical Sensors" Session Chair: Peter van Vuuren ExxonMobil Chemical Company Engineering Baytown, Texas January 22, 2003 Scottsdale, AZ

11. 1:10 NeSSI: The Good, the Bad and the Ugly - Early Implementations and Directions NeSSI: The Good, the Bad and the Ugly - Early Implementations and DirectionsNeSSI: The Good, the Bad and the Ugly - Early Implementations and Directions Rob Dubois - Dow Chemical Canada Inc., Fort Saskatchewan, AB, Canada; John Cumbus, ExxonMobil Chemical 1:35NeSSI Generation I - A Solid Foundation NeSSI Generation I - A Solid FoundationNeSSI Generation I - A Solid Foundation Douglas A. Nordstrom, David M. Simko, John J. Wawrowski, Swagelok Co., Solon, Ohio 2:00 Between SAM and the Substrate - A Smart Valve for NeSSI Between SAM and the Substrate - A Smart Valve for NeSSIBetween SAM and the Substrate - A Smart Valve for NeSSI Richard A. Ales, David M. Simko, Swagelok Co., Ohio 2:25Networked Sampling System (NeSSI-Generation II) Development and Field Test Networked Sampling System (NeSSI-Generation II) Development and Field TestNetworked Sampling System (NeSSI-Generation II) Development and Field Test J.Mosher, R.Nickels and U.Bonne, Honeywell International - ACS 2:50 - 4:00 : 2:50 - 4:00 : Break - Allow attendees to participate in the Grand Opening of the Exhibition IFPAC 2003 January 22, 2003 Scottsdale, AZAGENDA "NeSSI: A Sampling Platform for Micro Physical and Micro Analytical Sensors” Announcement: NeSSI Special Session

12. 4:00Microelectromechanical Systems for Process Analytics Microelectromechanical Systems for Process AnalyticsMicroelectromechanical Systems for Process Analytics Berthold Andres, ABB Automation Products, Germany 4: 25PHASED, a Faster, Smarter and More Affordable Gas Analysis Device - Update PHASED, a Faster, Smarter and More Affordable Gas Analysis Device - UpdatePHASED, a Faster, Smarter and More Affordable Gas Analysis Device - Update U.Bonne, J.Detry, R.Higashi, K.Newstrom-Peitso, H.Pham, T.Rezacheck and S.Swanson Honeywell Labs, Plymouth, MN and S.Swanson Honeywell Labs, Plymouth, MN 4:50Low Water levels in various solvents: on-line monitoring by a Miniature MIR Spectrometer Low Water levels in various solvents: on-line monitoring by a Miniature MIR SpectrometerLow Water levels in various solvents: on-line monitoring by a Miniature MIR Spectrometer Joseph P Sung and Jim Tatum, Rohm & Haas, Houston, TX, Yael Barshad and Yoav Barshad, Applied Analytics, Inc., Chestnut Hill, MA 5:15Computational Fluid Dynamic(CFD) Analysis of Gas and Liquid Flow Through a Modular Sample System Computational Fluid Dynamic(CFD) Analysis of Gas and Liquid Flow Through a Modular Sample SystemComputational Fluid Dynamic(CFD) Analysis of Gas and Liquid Flow Through a Modular Sample System Tanios Y. Bougebrayel, John J. Wawrowski, Swagelok Co., Solon, Ohio 5:40Surface Mount Technology Update - 2003 Surface Mount Technology Update - 2003Surface Mount Technology Update - 2003 Steve Doe, Parker Hannifin Corp., Jacksonville, AL 6:05Adjourn IFPAC 2003 January 22, 2003 Scottsdale, AZ AGENDA (cnt’d) "NeSSI: A Sampling Platform for Micro Physical and Micro Analytical Sensors”

13. Some Activities Modular Substrate Orientation –4 systems being evaluated –Substrate Attribute List Generated Surface Mount Component Evaluation/Gap –(Plan is to identify and secure missing comp.) The NeSSI-box Gen III activities in Europe

14. Substrate Attributes (Gen I) Spec, Function, Cost, Design Config. Flexibility Parts count Unit price Materials of const. Weight Heating capability Configurator tool Integration capability Passivation Internet ordering Size constraints P, T specifications ANSI/ISA SP76 Orientation Backplate mounting Assembly tools Flow path marking Tagging/traceability Supplier attributes

15. Surface Mount Component Evaluation (Gen I) List of surface mount components tabulated Gaps identified & plan to fill Experimental test plan developed –Certain lab tests required –NeSSI-box platform for field tests Dow has a platform to evaluate components

16. SP76 Component Wish List (Gen I) Permeation drier Swirling filter Cartridge filter Membrane Filter Atmospheric Ref. Double Block & Bleed Aspirator & Pump Pump (D1&2) Gauge On-substrate cal –function of T, F Mass flow (D1&2) Coriollis flow (D1&2) Sample Loop valve 3-way valve –purge & switch Chiller (vortex) Rotameter

17. Gen II Specification Copyright transfer of the spec from ExxonMobil and Dow to CPAC Draft Revision “6” will be mounted on the CPAC/NeSSI web site (by June 1) Evergreen vehicle to collect specs for SAM, microClimate enclosure, sensor transducers, valve transducers, applets for SAM Eventually segue into Gen III

18. Programmable Substrate Heater Honeywell POCA Project - Dow, EMCC V P A F Ethernet LAN Analyzer Controller SAM CANbus PDA Auxiliary Heating/Cooling Substrate T T dcs o&m user

19. POCA*1 (complete) First interpretation of NeSSI Gen II (alpha) Technical Hi-Lites & Possibilities –First “binary” Mini-Sensors (P/T; F/T) –Introducing Absolute Pressure Transmitter GC sample loop compensation, BP control –First “combi-valves” (Enabler for PID control) –Enclosure and Substrate Heater –Early SAM hardware & SAM software –First IS CANbus communication * On display

20. Introducing POCA2 An extension of POCA1 (still alpha) Collect the weaknesses of POCA1 - correct Add the remaining Gen II features Minisensors –Miniaturize, make more robust, lower power Industrial X-proof SAM, add heat control Add PDA, node count

21. Gen II Commercialization and POCA John Mosher

22. DOE Submitted April 16 by Honeywell/U. Bonne on behalf of a user/supplier team assembled at CPAC If contract is awarded this will infuse considerable capital into the purchase of modular, miniature systems An omnibus “design” has been generated Covers NeSSI Gen II/III products Ulrich Bonne

23. Who in the *#! is ODVA?? ODVA = Open Devicenet Vendors Assoc. A means to provide an “open” platform for connecting transducers –analagous to SP76 on the mechanical side It is hugely important to get this Intrinsically Safe (IS) SIG to provide entry to 3rd party entries

24. Focus and topics this week Plan for ODVA for DeviceNet IS SIG (AM) –Rick Ales SwagelokRick Ales Swagelok SAM hardware and software (this PM) –John Mosher Honeywell

25. Focus and topics this week NeSSI Focus Groups –combiValve <2 mA/unit Vm = modulating & Vo = on/off –X-proof substrate heating techniques –intrinsic safety issues –surface mount (GenI) component list –generation III analytical product wish list –Gen II specification feedback