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1 Interconnect and Packaging Lecture 7: Distortionless Communication Chung-Kuan Cheng UC San Diego.

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Presentation on theme: "1 Interconnect and Packaging Lecture 7: Distortionless Communication Chung-Kuan Cheng UC San Diego."— Presentation transcript:

1 1 Interconnect and Packaging Lecture 7: Distortionless Communication Chung-Kuan Cheng UC San Diego

2 2 Distortionless Communication 1.Introduction of distortionless interconnect 2.Architecture of Surfliner 3.Implementation 4.Applications

3 3 I. Interconnect Models Voltage drops through serial resistance and inductance Current reduces through shunt capacitance Resistance increases due to skin effect Shunt conductance is caused by loss tangent

4 4 I. Interconnect Models Telegrapher’s equation: Propagation Constant: Wave Propagation: Characteristic Impedance

5 5 I. Introduction of Distortionless Interconnect Distortion: Transfer function H(S) != const. Digital signal contains multiple freqs. Intersymbol interference Usage of limited frequency range Pre-emphasis at transmitter H T (S) Equalization at receiver H R (S) H T (S)H(S)H R (S) ~= const. Surfliner: H Surfliner (S) = const.

6 6 II. Distortion: Frequency Ranges and Equalization Input Signal Frequency Range Trimming Encoding (8B/10B) Data Scrambling Aliasing Equalization H E =a+bZ -1 +cZ -2 Z -1 a b c

7 7 II. Equalization Courtesy of Ed Lee

8 8 III. Distortionless Interconnect On-chip Global Interconnect trend Concerns: Speed, Power, Cost, Reliability

9 9 III. Introduction of distortionless interconnect Speed-of-the-light on-chip communication < 1/5 Delay of Traditional Wires Low Power Consumption < 1/5 Power Consumption Robust against process variations Short Latency Insensitive to Feature Size

10 10 IV. Architecture of Surfliner Differential Lossy Transmission LineSurfliner Current loss through shunt capacitance Frequency dependent phase velocity (speed) and attenuation Add shunt conductance to compensate current loss R/G = L/C Flat from DC Mode to Giga Hz Telegraph Cable: O. Heaviside in 1887.

11 11 IV. Architecture of Surfliner Set R/G=C/L Frequency Independent speed and attenuation: Characteristic impedance: (pure resistive) Phase Velocity (Speed of light in the media) Attenuation:

12 12 IV. Architecture: Signal Response

13 13 IV. Architecture: Eye Diagram Injected 1.0V voltage falls to 365mv over a 2cm wire 120 stage, 2.1ps jitter

14 14 IV. Architecture: Speed, Power, Variations Speed of Light: 5ps/mm or 50ps/cm Power: 10mW at >GHz Conductance variation = 10%, f=10MHz~10GHz Phase velocity variation < 1% Attenuation variation < 5%

15 15 V. Implementation Add shunt conductance between differential wires Resistors realized by serpentine unsilicided poly, diffusion resistors, or high resistive metal

16 16 V. Implementation Configuration of wires Characteristic Impedance (at 10GHz) : 39.915 Ohm Inductance: 0.22nH/mm Capacitance: 141fF/mm Attenuation: 253mv magnitude at receiver’s end (assuming 1V at sender’s end) Using Microstrip (free space above the wires): impedance can be improved to 52.8Ohm

17 17 V. Simulation Agilent ADS Momentum extract 4-port S- parameters HSpice: Transient analysis Assume 1023 bit pseudo random bit sequence (PRBS) 15GHz clock 10% of clock period transition slope for each rising and falling edge

18 18 V. Simulation Results 4 Stages 120 Stages

19 19 V. Simulation Results Jitter and silicon area usage #Stages410204080120160 Jitter (ps)279.55.44.23.92.12.08 Area (um 2 )0.523.2513.052208468832 Power w/ different width and separation (w, s) (um)(3,3)(4,4)(5,4)(10,5) Power (mW)4.983.623.022.13 Attenuation0.3070.4150.4960.60

20 20 VI. Applications of Surfliner 1.Clock distributions 2. Data communications: Buses Between CPUs, DSPs, Memory Banks

21 21 VI. Application of Surfliner 3. High Performance Low Power Wafer Packaging


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