1. Manufacturers Profile Prototype, small to medium, quick turn production in Taiwan High volume production in China available Certificates : ISO/TS 16949 : 2002 ISO 9001 : 2000 ISO 14001

2. Capability PCB Type : Rigid, Rigid-Flex, Flex, Multi-Flex, Metal Core, Heavy Copper Layer Count : Single Sided, Double Sided, Multilayer up to 30 layers Material : CEM, FR4 (Tg 135 ℃ to 175 ℃ ), Kapton, Rogers, Teflon Min / Max PCB Thickness : 0.25mm / 6.50mm Max Copper Weight : 10 oz (finished) Min Track / Spacing : 0.1mm Smallest Hole Size Mechanical / Laser : 0.13mm / 0.09mm

3. Capability Aspect Ration : 8 to 1 Finish : immersion gold, hard gold, soft gold, lead free HAL, Entek (OSP), RoHS Compliant Optional Finish : peelable solder mask, carbon ink Control Impedance : Single or Differential HDI (High Density Interconnection) PCB Sequential Lamination (BVH / IVH) Blind Via, Buried Via, Via in Pad

4. Application Industrial Control Telecommunication : Backplane, Wireless, RF Optical Device Thermal Conductivity / Enhanced Consumer Electronics PC and Peripheral High Current Power Device Chip on Board Emboss Circuit Interposer Connection

5. Advantage Sourcing from a number of fully accredited professional PCB manufacturers 5 to 10 days quick turn prototype and small pilot run 2 to 3 weeks fast delivery for production order Low NRE / MOQ and fast time to market Competitive price from Asian manufacturers Consistent technology innovation Reliable quality with product warranty Continuous Quality Improvement Climate control local stocking facility 24 hours communication and engineering support Frequent on-site inspection by our employee

6. Quality Specification Design Rule Check for Manufacturability Hole Wall Roughness Control Chemical Analysis with SPC / SQC Control Plan Electrical testing Cross-section analysis Optical and Visual inspection Solderability and thermal stress analysis IPC-A-600G, IPC-6012B IPC Class II, Class III or customer specifications