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Anode Front-End Electronics current status Presented by Nikolay Bondar. Fermilab. 09/08/00.

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Presentation on theme: "Anode Front-End Electronics current status Presented by Nikolay Bondar. Fermilab. 09/08/00."— Presentation transcript:

1 Anode Front-End Electronics current status Presented by Nikolay Bondar. Fermilab. 09/08/00

2 Anode Amplifier Discriminator chip (CMP16_F) specification Used technology-AMI 1.5u BiCMOS Amplifier input noise0.5fC@Cin=0 pF0.7fC@Cin=0 pF 1.7fC@Cin=200 pF1.5fC@Cin=180 pF Shaper peaking time30 ns40 ns Shaped waveform Semi-gaussian with two exponent tail cancellation Transfer function (gain)5 mV/fC9 mV/fC Two threshold discriminator High threshold used as ENABLE. Low threshold zero-crossing discriminator driven by a constant fraction shaped pulse High level thresholdAdjustable 0 - 500 mVAdjustable 0 - 100 fC Output pulse width-Input pulse over the threshold ~ 80 ns (average) Discriminator slewing time<3 ns <3 ns Initial delay-100 ns Dead time-350 ns Minimum stable threshold-5 fC (on bench) Threshold temperature variation--0.5fC/degree C (preliminary) Delay temperature variation-0.2 ns/degree C (preliminary) Operational voltage-4.5 - 5.5 V Power consumption200 mW/channel35 mW/ch PackageQFP 80 - (Plastic Quad Flat Pack) 14 mm x 20 mm, 80 pins, 0.8 mm pin pitch Specified for design Implemented in ACD16_F

3 Anode Amplifier Discriminator chip (CMP16_F) current status CMP16_F chip received in April 11. 90 chips was received in that time and 160 chips more in May. Total - 250 chips. First 90 chips was assembled on AD16 boards and carefully tested with the Test Stand. All results are placed on CMU web pages. Statistic: -initially broken chips - 2 out of 90 -most of chips match specification -the chip parameters are pretty consistent Resume - 1.5 u rules more stable and reliable than previous 1.2 u. These chips used for: - supplied 3 FAST sites with AD16 boards -72 - Rad. test - 10 - broken during test on chamber - 3 - spare - 2 Additional 160 chips - assembled on AD16 board. Just received from company, not tested yet. 100 chips - for steady state test 60 chips spare.

4 CMP16_F chip problem CMS16 Chip corresponds to the initial specification. Only one problem - after switching to the new design rules (1.5u) the chip became slower the output pulse waveform overshooting increased from 5% up to 30%. Dead time increased from 180ns to 350ns. The reason of this changes - increased parasitic capacitance (factor 2) That is an easy correctable problem. According simulation there is possibility to go back to initial waveform.

5 Anode Front-End Board (AFEB) AD-16 specification Board dimension 2.8’ x 3.075” x 0.625” Input connector strip socket, two rows, 34 contacts Inputs DC isolated Input signalNegative current pulse min. detectable charge5 fC max. detectable charge1000 fC max. allowed charge10 uC Output connector 40-pin header with polarized key Outputs current source LVDS compatible (1.5 mA) Threshold control voltage 0 - 1.7 V 0 V- corresponds to maximum threshold Input test pulse: negative, 0 to -2 V 20 ns rise time > 2 us pulse width 0.25 fC/mV transfer function 110 Ohm termination Power supply voltage +5.5 V +6.0 V maximum Current 0.09 A @+5.5~V Power consumption 495 mW total 31 mW per channel Remote power switch TTL level high -on / low -off

6 Anode Front-End Board integration issues AD16 is designed for direct connection to a protection board on the chamber. The board sticks out of the side of chamber via a slot in the CSC side panel. A special bracket is attached to the panel next to the slot to fix the board and provide additional grounding between the board and the chamber. All AD16 boards on the chamber will be covered by an aluminum cover for additional shielding and mechanical protection. All mechanical drawings are made by Vladislav Razmyslovich. The AFEB - ALCT cables (halogen free) are grouped into sets of different lengths to accommodate the different distances between sets of AD16 boards (3 boards per column) and the ALCT. They have strain relief on both ends. Each type of CSC has its own cable layout and individual cable sets. First issue of drawings for the cable assembly is ready thanks of TD help. Galogen free cable have been received. First samples of new cables are ready.

7 CMP16_F chip and AD16 board reliability test. (Proposal) Problem to solve: -estimate burn-in test time duration (Mil. Spec.- 360 hours @ 125°C) -estimate long term reliability for AD16 board (Mil. Spec. - 1000 hour @125°C) Test performance and setup: 100 AD16 boards powered and pulsed and placed in an oven under 100°C for long term running 2000 -7000 (?) hours. Test procedure: Weekly the board must be taken out and tested. A regression curve will be plotted. Test will be finished when we get 50% of dead channels. Equipment: Heavy duty oven Power supply +5.5V 10A Pulse generator

8 Delay chip DEL16 specification Used technologyAMI 0.5u CMOS Input signal level LVDS standard Output signal 3.3 V CMOS Output pulse width 40 ns (adjustable with an external current) Delay minimum 20 ns Delay step  T 2 ns (adjustable with an external current) Number of delay steps N 15 maximum Delay function 20 ns+N*  T Delay nonlinearity  T/2 Delay control interface serial Control interface signal specifications: CLRB Set delay to zero ChSB Select chip to download delay data. Data is fixed inside the chip at the end of the ChSB pulse. CLC Clock pulses D_IN Input data D_OUT Output data pattern Power supply voltage 3.3 V Chip packageQFP 64 10 x 10 (Plastic Quad Flat Pack) 10 mm x10 mm, 64 pins, 0.5 mm pin pitch

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