1. Portland, October 20, 2003Vaclav Vrba, Institute of Physics, AS CR 1 Vaclav Vrba* Institute of Physics, AS CR, Prague *for CALICE collaboration Silicon Tungsten Electromagnetic Calorimeter for Experiments on e+e- Linear Colliders

2. Portland, October 20, 2003Vaclav Vrba, Institute of Physics, AS CR 2 Concept of the detector system for the future e+e- linear collider VxDet HCal ECal TPC Image from the TDR ECFA-DESY

3. Portland, October 20, 2003Vaclav Vrba, Institute of Physics, AS CR 3 Concept of the detector system (cont’) +  jet 2 =  ch 2 +   2 +  h0 2 + σ 2 confusion Typical jet event (MOKKA simulation + CALIMERO visualization) E jet = E ch + E γ + E h-neutral Energy composition break down: ≈ 65% 25% 10% σ ch 2 = (2x10 -5 ) 2 x Σ i E 4 ch,i σ γ 2 = (0.11) 2 x E γ = (0.06) 2 x E jet σ h0 2 = (0.40) 2 x E h0 = (0.12) 2 x E jet + ≈ (0.13) 2 x E jet + σ 2 confusion The “confusion” term sources are: imperfect pattern recognition of the deposited energy, wrong track association to the energy cluster(s) in calorimeter, energy double counting, etc. Such term can contribute significantly and often dominates. Adapted from Dean Karlen

4. Portland, October 20, 2003Vaclav Vrba, Institute of Physics, AS CR 4 ECal design consideration a) Use of materials with small Moliere radius  better containment of shower cascade around the impact track and smaller shower overlap: IronTungsten b) Use of materials with small ratio of radiation length/ interaction length to separate el-mag. and hadronic showers: ZAX0/λIX0/λI Fe26560.0133 Cu29640.0136 W741840.0019 Pb822070.0029 U922380.0016 from Steve Magill π+π+ γ γ

5. Portland, October 20, 2003Vaclav Vrba, Institute of Physics, AS CR 5 ECal design consideration – cont’ From a) & b)  Tungsten as a radiator material is a good choice. c) Optimal cell granularity: - Moliere radius r M ≈ 9mm; - track density & photon density in jet, see figure;  granularity of 10x10 mm 2 is adequate or close to that. d) Short radiation length X0 ≈ 3.5 mm makes it possible to keep ECal short in depth. e) Sensing layers should be thin enough not to deteriorate the “effective” Moliere radius;  Silicon pad sensors are adequate choice.

6. Portland, October 20, 2003Vaclav Vrba, Institute of Physics, AS CR 6 Calorimetry performance All the detectors – including hadron calorimeter (not discussed here) - should represent well balanced system. The requirements of significant improvement of energy pattern recognition (and thus jet energy resolution) requires high degree of tracking capability of calorimeters. An improvement of the jet resolution from 60%/√E to 30%/√E for the channels e+e-  ννZZ or ννWW @ 800 GeV represents better quality of data which is equivalent to a gain in luminosity of 40%.

7. Portland, October 20, 2003Vaclav Vrba, Institute of Physics, AS CR 7 CALICE ECal TPC ECal HCa l tungsten coil ModuleModule vertical structure Detector slab }

8. Portland, October 20, 2003Vaclav Vrba, Institute of Physics, AS CR 8 Physics prototype – Detector slab (C / W) structure type H Front End electronics Cooling system Aluminum shielding Silicon sensor array sensor pad 1 x 1 cm 2 Vertical cross section

9. Portland, October 20, 2003Vaclav Vrba, Institute of Physics, AS CR 9 Physics prototype - sensors Wacker 530  m material, ≈ 6 k  cm Topsil 500  m material, 12 k  cm Two Si sensor vendors : ON Semiconductor, Czech Rep. Elma, Russia ON Semiconductor prototype sensors measured and qualified: New design gds file prepared and submitted to ON Semiconductor :

10. Portland, October 20, 2003Vaclav Vrba, Institute of Physics, AS CR 10 Physics prototype – test setup for cosmics Cross-section 1 st X-Y line (scintillating fibers) 2 nd X-Y line (scintillating fibers) 4 silicon wafer tested Detector slab 1 mm - Measurement surface : 128  128 mm - Precision : 0.5 mm

11. Portland, October 20, 2003Vaclav Vrba, Institute of Physics, AS CR 11 Physics prototype – test beam setup ECAL general view 3 rd structure (3×1.4mm of W plates) 370 mm 180 mm Silicon wafer 2 nd structure (2×1.4mm of W plates) VME/… HCAL VFE Movable table ECAL Beam monitoring BEAM 1 st structure (1.4mm of W plates) Detector slab 370 mm

12. Portland, October 20, 2003Vaclav Vrba, Institute of Physics, AS CR 12 Critical issues  Integration of mechanics and electronics, particularly question of cooling.  Beginning of 2004 assambly for tests with cosmics Outlook and plans  Summer-Autumn of 2004 Physics prototype for e- beam (@DESY)  Summer of 2005 common irradiation with HCal, hadron (π,p) beam

13. Portland, October 20, 2003Vaclav Vrba, Institute of Physics, AS CR 13 CALICE Calorimeter W/Si EM Cal. 2 W thick: 2.8, 8.4 mm; 20 layers; 1700 m 2 total; 10x10 mm 2 segmentation; 0.5 mm thick Si ; ≈16 (128) chan per readout chip; HCal – 2 options: 1.Digital 1x1 cm 2 seg. RPCs a possible detector 2.Scint. Tiles 5x5 cm 2 seg.

14. Portland, October 20, 2003Vaclav Vrba, Institute of Physics, AS CR 14 Motivation

15. Portland, October 20, 2003Vaclav Vrba, Institute of Physics, AS CR 15 Geometrical Conception of the Calorimetry e + e -  W + W - @  s=800 GeV Simulation SLAC-Gismo Simulation MOKKA-GEANT4 Visualisation FANAL CALICE CALICE Simulation MOKKA-GEANT4 e + e -  Z  jets @  s=91 GeV

16. Portland, October 20, 2003Vaclav Vrba, Institute of Physics, AS CR 16 Motivation Front End electronics (Cfi / W) structure type H Silicon wafer Shielding PCB Al. Shielding PCB (multi-layers) (  2.4 mm ) Silicon wafer (0.525 mm) Tungsten (1.4 mm, 2×1.4 or 3×1.4 mm) 8.5 mm Composite structure (0.15 mm / layer) Transverse view Detector slab PCB : - 14 layers - Thickness 2.4 mm

17. Portland, October 20, 2003Vaclav Vrba, Institute of Physics, AS CR 17 Motivation PCB and Front End electronics details : Silicon wafer Composite Tungsten PCB Front End electronics Flexible circuit max 4.5 mm Possible thickness for Front End electronics in this case : 4.5 mm Physics prototype – detector slab

18. Portland, October 20, 2003Vaclav Vrba, Institute of Physics, AS CR 18 CALICE ECal design W/Si EM Cal. 2 W thick: 2.8, 8.4 mm; 20 layers; 1700 m 2 total; 10x10 mm 2 segmentation; 0.5 mm thick Si ; ≈16 (128) chan per readout chip; HCal – 2 options: 1.Digital 1x1 cm 2 seg. RPCs a possible detector 2.Scint. Tiles 5x5 cm 2 seg.

19. Portland, October 20, 2003Vaclav Vrba, Institute of Physics, AS CR 19 Sensors for Physics Prototype One wafer is a Matrix of 6 x 6 pixel of 1 cm 2. Important point : manufacturing must be as simple as possible to be near of what could be the real production for full scale detector in order to : Keep lower price (a minimum of step during processing) Keep lower price (a minimum of step during processing) Low rate of rejected processed wafer Low rate of rejected processed wafer good reliability and large robustness good reliability and large robustness Number of active Wafer needed for the physic prototype : 270. 150 will be produce by Institute of Nuclear Physics - Moscow State University 150 will be produce by Institute of Nuclear Physics - Moscow State University 150 will be produce by Institute of Physics, Academy of Sciences of the Czech Republic - Prague 150 will be produce by Institute of Physics, Academy of Sciences of the Czech Republic - Prague

20. Portland, October 20, 2003Vaclav Vrba, Institute of Physics, AS CR 20 Motivation ECAL prototype ECAL prototype silicon wafer description Dead zone width is only 1mm 4” High resistive wafer : 5 K  cm Thickness : 525 microns  3 % Tile side : Guard ring In Silicone ~80 e-h pairs / micron  42000 e - /MiP Capacitance : ~25 pF Leakage current : 1 – 5 nA Full depletion bias : ~150 V Nominal operating bias : 200 V

21. Portland, October 20, 2003Vaclav Vrba, Institute of Physics, AS CR 21 Motivation Gluing of Si wafer A automatic device is use to deposit the conductive glue : X-Y-Z table (400×400×150 mm 3 ) with glue dispensing tool (conductive glue) 270 Gluing and placement (  0.1 mm) of 270 wafers with 6×6 pads 10 000 About 10 000 points of glue.

22. Portland, October 20, 2003Vaclav Vrba, Institute of Physics, AS CR 22 Motivation Gluing of Si wafer Choice of the Glue : –Good conductivity –Polymerization at low temperature (Typ. ~ 40° C) –Time of polymerization Some test : –First : PCB on PCB : started –Second : with real Si wafer : to be done ! EPO-TEK® EE129-4 : Room temp/16 hr cure: 0.0096 ohm-cm Room temp/20 hr cure: 0.0090 ohm-cm Room temp/72 hr cure: 0.003 ohm-cm

23. Portland, October 20, 2003Vaclav Vrba, Institute of Physics, AS CR 23 Motivation Cosmic test bench: general view

24. Portland, October 20, 2003Vaclav Vrba, Institute of Physics, AS CR 24 Motivation Toward physique prototype :

25. Portland, October 20, 2003Vaclav Vrba, Institute of Physics, AS CR 25 Motivation ECAL general view 3 rd structure (3×1.4mm of W plates) 370 mm 180 mm Silicon wafer 2 nd structure (2×1.4mm of W plates) VME/… HCAL VFE Movable table ECAL Beam monitoring Global view of the test beam setup Prototypes overview Prototypes overview BEAM 1 st structure (1.4mm of W plates) Detector slab 370 mm

26. Portland, October 20, 2003Vaclav Vrba, Institute of Physics, AS CR 26 Motivation Gluing of Si wafer An automatic device is use to deposit the conductive glue : X-Y-Z table (400×400×150 mm 3 ) with glue dispensing tool (conductive glue) 270 Gluing and placement (  0.1 mm) of 270 wafers with 6×6 pads 10 000 About 10 000 points of glue.

27. Portland, October 20, 2003Vaclav Vrba, Institute of Physics, AS CR 27 Motivation Cosmic test bench: general view

28. Portland, October 20, 2003Vaclav Vrba, Institute of Physics, AS CR 28 Motivation Physic prototype  program is well advances First test beam with electrons  mi 2004 First hadronic test beam  2005 Prototype in beam ~ summer 2004 –R&D (thermal et electronic) –Some part not so well covered Collaboration welcome

29. Portland, October 20, 2003Vaclav Vrba, Institute of Physics, AS CR 29 Motivation

30. Portland, October 20, 2003Vaclav Vrba, Institute of Physics, AS CR 30 Motivation

31. Portland, October 20, 2003Vaclav Vrba, Institute of Physics, AS CR 31 Motivation

32. Portland, October 20, 2003Vaclav Vrba, Institute of Physics, AS CR 32 Motivation

33. Portland, October 20, 2003Vaclav Vrba, Institute of Physics, AS CR 33 Motivation

34. Portland, October 20, 2003Vaclav Vrba, Institute of Physics, AS CR 34 Detector Slab Dimensions 8,3 mm Aluminum foil : ~0.1 mm PCB : 2.4 mm Si wafer : 0.525 mm Carbon fiber : 0.15 mm W plate : 1.4 mm

35. Portland, October 20, 2003Vaclav Vrba, Institute of Physics, AS CR 35 Physiccs Prototype – vertical structure " Cross section : Shielding (thickness according to tests) PCB (8-10 layers) (  2 mm) Silicon wafer (0.565 mm) 1 st composite Layer (0.15 mm) Tungsten (1.4 mm, 2×1.4 or 3×1.4 mm) 2 nd composite Layer (0.15 mm) 3 rd composite layer (0.15 mm) 7.2 mm - “ type H ” structure : moulding of tungsten and carbon/epoxy composite easy integration of PCB/Si - 0.7 mm thick tungsten plates not needed easy plates production - PCB solution technology skills " New design :

36. Portland, October 20, 2003Vaclav Vrba, Institute of Physics, AS CR 36 Pad Silicon wafer PCB Aluminium Cooling tube VFE chip 1.1 mm 1.0 mm 0.5 mm Thermal contact if needed Conductive glue for electrical contact AC coupling elements if needed powerline command line signal out Budget (mm) 0.3 Al(sup) 0.1 Glue 1.0 VFE  2-3 cm Transverse view - New design of the detector slab - ECAL 0.3 mm