1. SMART Piezoelectric&MEMS-based Devices/Applications
An NGUYEN-DINH

2. MEMs-based imaging device for the diagnostic of arthritic diseases.
All of you have certainly heard about the « GOUT » disease historically known as «Rich man’s disease » owing to overindulgence in certain foodstuffs (meat & alcohol) this is in fact caused by kidney inability to excrete uric acid so this crystallizes in joints and causing an onset of inflammatory arthritis.
Arthritis is a complex condition that covers a wide range of disorders and the only common feature is joint inflammation characterized by stiffness, swelling and redness of the affected area.
Traditionally this is regarded as a disease of the elderly, arthritis can affect a range of age groups and the mechanism that induce it can just be as varied.
In Iacobus project we aim at developing multimodal diagnostic tool that will combine NIR Hyperspectral, Ultrasonic and Photoacoustic imaging.
MEMs-based imaging device for the diagnostic of arthritic diseases.
This work is funded under FP7 programme « IACOBUS », EC Grant Agreement / HEALTH
Contact: Nicolas SENEGOND

3. (project coordinator : Fraunhofer IBMT)
Outlook
IACOBUS project (European FP7 funding program) : Diagnosis and monitoring of Inflammatory and Arthritic diseases using a COmbined approach Based on Ultrasound, optoacoustic and hyperSpectral imaging
(project coordinator : Fraunhofer IBMT)
Objective: improvement of the diagnosis of arthritis
Development of a 3D imaging system combining photoacoustics & echographic for finger joint imaging.
Development of the ultrasound system, laser sources & reconstruction algorithm (Fraunhofer IBMT)
Development of the smart multi-modality ultrasonic probe (VERMON)

4. Specifications Geometry Transducer 4 Tile portions :
2 « Grand Tiles » of 30mm RoC including 256 trx channels
2 « Small Tiles » of 15mm RoC including 128 trx channels
TRX maximum thickness = 6 mm
Translation of the 4 arcs for 3D reconstruction
Transducer
Central frequency MHz
Inter-element pitch 150 µm
Elevation H = 3 mm
Transverse focus = 12 mm

5. Mechanical design General view Translation axes
Probes are entirely immersed in a water tank
Material used for housing : anodised aluminum
Maximum thickness of each Tile: 6 mm
Water tank
Laser sources
Finger holder
Finger spacer

6. Mechanical design (1/2) “Grand Tiles” Preamp boards
8 x 32 (256) element array cMUT
4 x 64 (256) channels pre-amp PCBs per Tile
Coax cable for 256 channel driving + cable for pre- amp supplying and bias voltage for cMUTs
32 element cMUT array

7. Mechanical design (2/2) “Small Tiles” 4 x 32 (256) element array cMUT
2 x 64 (256) channels pre-amp PCBs per Tile
Both Tiles are connected together with a single 256 coax cables
32 element cMUT array
Pre-amp PCB

8. capacitive Micromachined Ultrasonic Transducer (cMUT)
Features
A Multiscale Device :
Reversible Operations:
40 mm
CMUT device
CMUT element
CMUT cell
300 µm
20 µm
Transmit mode
Vdc+Vac
Movable electrode
Vacuum gap
Ultrasonic wave
Receive mode
Vdc ∆u ∆c

9. cMUT design
Batch of simulations (FDM taking into account mechanical, electrostatic & acoustic)
Layout design of the masks of photolithography
Process used : sacrificial layer process
Wafers processed by specialised MEMS foundries
BW & central frequency simulation
Directory simulation
CAD design
Wafer fabrication

10. Characterization Dimensioning control Z-Profile measurement
Impedance measurement

11. Pre-amp circuitry design
Top view
Bottom view
8 channel preamplifier chipset
Passive components
Connectors to cable
Connection with flex
Preamp-board
1 board = preamplification of 64 channels
Sizes 12,5 mm*153 mm
Thickness of the board 0,8 mm
Thickness with electronic components = 2,65 mm
Power supply box
3 channels power supply box
Provide DC voltages for preamplifier and bias voltages for cMUTs
Connection with probes : LEMO 14 points

12. Integration Singulation of the 32 elts cMUT chips from wafer
Test of devices : pulse echo measurement in oil
BW, central frequency are characterized
Interconnection : wirebonded on flexible board
Packaging of cMUT chips: silicone rubber (<500µm) compatible with ultrasonic propagation
Direct assembly on to pre-amp PCBs (pad/pitch: 75µm/75µm)

13. Current statement
Ultrasound Probe with optical mounting available for end 2014.
First imaging prototype system available early 2015
Preclinical test on 60 patients planned to start mid 2015

14. Low frequency vibrational Piezoelectric Energy Harvesters (PEH)
Contact: Guillaume FERIN

15. Energy Piezo-Harvester
Main piezoelectric harvesting technics
Vibrations are everywhere and free
Direct Stress/Strain energy harvesting
Indirect external Vibrational harvesting using inertial forces
D31 mode
D33 mode
DuraAct Patch Transducer - PI

16. State-of-the-art
Topologies for Vibrational Energy Piezoelectric Harvesters.
13.9KHz
Common flexural architectures
D31 oriented unimorph, Multilayered serial or parallel bimorph
D33 interleaved unimorph & bimorph
Common topologies
Cantilever (clamped/free) beams
Bridges (clamped/clamped)
Spirals
Others
Possible integration forms
MEMS
Macro device
204Hz
Marzecki 2005 : d31 AlN Cant.
Jeong 2005 : d33 PZT Cant.
608Hz
1.3KHz
FANG 2006 : d31 PZT Cant.
Marzecki 2007 : d31 AlN Cant.
200Hz
200Hz
Renaud 2007 : d31 PZT Cant.
Dong 2008 : Spiral d31 PZT

17. Fabrication X50 Bulk PZT Metallic shim material
Surface roughness (PZT)
Optical Thickness control
Poling and electrode plating
Bulk PZT
Metallic shim material
Advanced Polymer bonding
CONFIDENTIAL

18. Performance (88.0Hz, 1.57MΩ) (85.8Hz, 23kΩ)
Test bench for electrical impedance measurement and harmonic mechanical solicitation
W/WO Tip mass
Clamping pressure monitored to avoid softening effects
Free circulating air (no softening recorded)
Polycrystalline PZT ceramic
PMN-PT [011] Single Crystal
(With no Tip Mass)
1 G max uniaxial acceleration (gravity direction)
Electrical load 100kOhms

19. Medical Implants.. Heart as a mechanical source Power output
Direct conversuin (external patchs)
Hear wall vibrational (external or internal capsules
Power output
>10µW continuous mean power delivery
Up to 2.5V mean voltage
Quality standards & requirements
20-25 years durability
Comply with ISO60601 standards on active implantable medical devices
Biocompatibility
Electrical safety
Key developments -Vibrational piezoelectric energy harvester MUST be :
Highly reliable
No damageable
Long lifetime >25years
Highly efficient
high power density
Works in every position
Great Integrability
Miniaturization
Compatible with MEMS & CMOS process
“Implantable vibrational low Frequency energy harvester”, VERMON
“Conformal piezoelectric energy harvesting from motions of the heart, lung, and diaphragm” C. Dagdeviren, 2014

20. SHM Applications..
Vibrational piezoelectric energy harvester MUST have :
High reliability
No damageable: Embedded in structures if possible &
Forget: Long lifetime >30years
Harsh environment (-40/+50°C)
Efficiency
high power density or multiple harvester hosting architectures : Stackable PEH
Works in every position (multi- axis approach)
Cost : below battery costs
FAA Technical center, William J. Hugues

21. Embedded Autonomous Sensing
General specifications
Aircraft vibration source
Harvesting frequency range from 10 to 50Hz
1 mm max displacement
1G max available acceleration
Goals : save maintenance costs
10b$ a year for all airlines companies
35% could be saved with autonomous sensors
Geometrical specs
Flat enough to be embedded into composite sandwiches between foams and skins
Compatible with internal composite stress/strain
Flaws detection and localization
Passive acoustic or LRU sensors for guided wave processing
Other inertial sensors
Autonomous acoustic sensor nodes