0. 集成电路设备发展的考量与思索
2014北京微电子国际研讨会
陈捷 Jay Chen 东电电子(上海)有限公司 总裁

1. 3 New waves expanding Semiconductor market
Semiconductor market trend Ｃ
Expanding applications
Social Networking, Big Data
Emerging countries
Geographical expansion
Automotive, Environment, EHS care, Education
Increasing semiconductor content ratio
　Expanding applications, which stems from mobile network society development.
　ネットワーク社会の進化で様々なアプリケーションの適用の拡大。
　Increasing semiconductor content ratio with performance improvement of applications.
　機器の高性能化､高機能化に伴う半導体搭載量の増加。
　Geological semiconductor market expansion.
　半導体搭載機器の消費地の地域的な拡大。
These 3 new waves will expand semiconductor market.
この3軸での拡大基調により､半導体市場成長は牽引されるであろう。

2. Hierarchy of The Semiconductor Industry
Electronics
IP & Fabless
IDM, Foundry & OSAT
Wafer Fab Equipment
WFE
US$1,493B
Semiconductor
US$316B
正是有了像微软；苹果；腾讯；华为，联想这样的软硬件终端产品和内容提供商的技术创新，应用创新及极强的制造能力，带动了整个产业链，和消费市场的持续发展。
而随着功能不断提升和成本不断降低，作为心脏的半导体行业也得以快速发展。早期半导体产业为垂直整合模式，由整合组件的制造商包办所有工作，主导产业的发展。但很快产品形态明晰的设备业、材料业最先从这些“全能企业”中分离出来，作为独立的行业发展起来，1987年专业晶圆代工服务模式兴起，这是导致半导体产业链转变的一个重要因素，随后产业链经过多次划分重组，陆续出现IC设计、设计服务等新的商业模式。
不论垂直整合还是分工协助，半导体行业中的设备和材料好比车子上的两个车轮推动着产业的进步，是支撑半导体行业的基石。
而TEL正式在生产设备方面，以先进的技术支持并引领着行业的发展。
IDM: Integrated Device Manufacturer
OSAT:Outsource Assembly and Test
US$27B

3. Device Technology Drive Equipment Development
Tech Trend
Device Technology Drive Equipment Development
Functional Diversification
More than Moore
Homogeneous
Heterogeneous
Wire-Bonding
Flip-Chip
ArF
3DI
2.5D
CMOS Scaling
Cu/ULK
Si Photonics
Advanced Packaging
(3DI / WLP)
Strained Si
ArF-Immersion
High-k Metal Gate
FinFET
450mm
SiGe / III-V
DP/MP
DSA
Carbon Tr. / CNT
EUV
More Moore
随着后摩尔定理时代的到来，行业呈现了多元发展的趋势, 除了传统的Patterning发展以外，也包括新材料新构架，450，以及先进封测等。
半导体产业过去50年用制程技术的进步来缩小线宽，用增加晶圆尺寸产生规模效益，制造管理技术的进步带来了良品率和生产力的提升。
2006年时行动装置出货量只占PC出货量的三分之一，但随着智能型手机销售在2010年后呈现爆炸性成长，2012年时行动装置出货量已是PC的2.3倍，随着各大系统厂在未来几年将再推出包括智能手表或智能眼镜等更多种类的行动装置，预估至2016年时行动装置的出货量将高达20亿支，是PC市场的5.7倍。行动装置对低功耗的要求特别高，但却要求更高的运算速度，提升晶体管效能的关键，已经由微缩（litho-scaling），扩展为材料与结构上的创新，如晶圆代工厂28纳米开始采用高介电金属闸极（HKMG）技术，16/14纳米将进入3D晶体管架构，而NAND Flash也已经先走上3D架构。面对巨量的消费类产品：低功耗；更短的终端产品更新周期；大量的数据交换更低的置换成本无疑需要从多方面加以突破
NIL, EBDW
New Material
New Structure
Patterning
Source :TEL based on ITRS
Diversified technology development is ongoing

4. New Platform Platform Trend Wafer Size Single Wafer Cluster Tool
Batch
6 inch
8 inch
Cluster Tool
12 inch
18 inch
12 inch

5. 450mm is a cost project (with Big Development)
Platform Trend
450mm Motivation
Ref. TEL, 2012
Ref. Nikon, 2013
450mm is a cost project (with Big Development)

6. 450mm transition will come around 2020
Platform Trend
Wafer Demand Forecast
Source: IC knowledge Strategic Industry Model(1200), SPE Marketing
450mm transition will come around 2020

7. Regional expansion and New Targets of Electronic Equipment markets
BusinessTrend
Regional expansion and New Targets of Electronic Equipment markets
Service in China
Sales in China
Manufacture in China
R&D in China
Head office in China
South America
South East Asia
Middle East Asia
Africa 4B
people
BRICs
East Europe
North America
West Europe
East Asia
Furthermore, entering the 21st century, (we are living in an era where) electronic devices have become widespread in the developing countries often labeled as BRICs, as well as third world countries. This (demand) will cause the further development and expansion of the Semiconductor Industry.
さらに21世紀に入って、BRICsで代表される新興国、そして所謂後進国と言われる地域においても電子機器が普及する時代が到来し、半導体産業は益々発展・拡大する状況になって来ました。
However, even though the number of consumers in these markets is large, their income level is low and thus there is demand for low-cost electronics. This is not solely the responsibility of the electronics manufacturers, but the whole value chain’s. Therefore also the semiconductor chip (manufacturers) as well as semiconductor equipment manufacturers must strengthen their cost competitiveness.
但し、新たな市場を構成する新購買層は人数は多いが所得が低いので、低価格機器が求められます。故に、電子機器メーカーだけにかかわらず、半導体メーカー、そして製造装置メーカーも同様にコスト競争力が強く問われることになります。
1.5B people
Consumer
0.8B people

8. The Industry Consolidates- Equipment
BusinessTrend
The Industry Consolidates- Equipment 8”
0.18μm~0.13μm
12”
28nm~20nm
108 companies
69 companies
Top 6
Front-end
Equipment
Companies
Others
50%
75%
Source: SEMI, 2014

9. The Industry Consolidates- Capital Spending
BusinessTrend
The Industry Consolidates- Capital Spending
Y2014(F) Capital Spending Leaders’ Shares of Total WW
Semiconductor Industry Spending ($63.4B)
68%
Top 5 = 68%
81%
86%
Top 10 = 81%
92%
Top 15 = 86%
Top 25 = 92%
Y2005 Share
Top 5 = 40%
Top 10 = 55%
Top 15 = 67%
Top 25 = 82%
Source: IC Insights, Jan 2014

10. The Industry Consolidates- IDMs
BusinessTrend
The Industry Consolidates- IDMs
TOP 5 IDMs in Y2001:32.6%
Share of worldwide installed capacity
(without discretes)
TOP 5 IDMs in Y2013:52.0%
Share of worldwide installed capacity
(without discretes)
Total Revenue: $154B
Total Revenue: $315B
Source: Gartner, IHS, 2014

11. Energy Saving Activities in 300mm Equipment
Green Trend
Energy Saving Activities in 300mm Equipment
Elec.
Plasma Etch System/ TactrasTM VigusTM
Key initiative : Saving energy consumption of chiller, pump and heater
2006 Energy-Saving Activity N2
Thermal Processing System/ TELINDY PLUSTM
Key initiative: Ensuring the use of proper amount of nitrogen
EXH
Coater/Developers/ CLEAN TRACKTM LITHIUS ProTM V-i
Key initiative: Reducing the amount of exhaust of rotating cup
modules and saving energy in temperature/humidity control
2008 Innovative Challenge 23 (IC23)
2009 EHS-TRM
Elec.
Single Wafer Plasma Treatment System/ Triase+TM SPAi
Key initiative: Eliminating temperature control unit by using plant-
sourced cooling water directly
Source : TEL Taiwan EHS Seminar, 2014

12. Energy Saving Activities in 300mm Equipment
Green Trend
Energy Saving Activities in 300mm Equipment
Water
Auto Wet Station/ EXPEDIUSTM- i
Key initiative: Reducing pure water consumption in standby mode N2
2006 Energy-Saving Activity
Single Wafer Cleaning System/ CELLESTATM- i
Key initiative: Ensuring the use of proper amount of nitrogen
Elec.
Gas Chemical Etch System/ Certas WINGTM
Key initiative: Improving productivity with two-wafer
2008 Innovative Challenge 23 (IC23)
2009 EHS-TRM
Air
Wafer Prober/ Precio nanoTM
Key initiative: Reducing the amount of dry air supply with dew point
monitoring
Source : TEL Taiwan EHS Seminar, 2014

13. Energy Saving in Taiwa Factory
Green Trend
Energy Saving in Taiwa Factory
The size of 54 American football fields

14. Energy Saving in Taiwa Factory
Green Trend
Energy Saving in Taiwa Factory
Base Isolation System
Water Storage Facility
Emergency Stock
Emergency Power Supply
Base Isolation System
A combined seismically isolated structure, which consists of oil damper and two base-isolated equipment; elastic sliding support and laminated rubber bearing, which protects human life and products against falling down or damage to make it possible to restart manufacturing early.
Water Storage Facility
Clean drinking water for 2,000 persons for 1.5days and utility use for 9 days can be reserved.
Emergency Stock
Emergency Supplies Warehouse holds foods and drinking water for 1,000 persons for 3 days.
Emergency Power Supply
72-hour electricity backup for essential facilities such as computer server rooms, gas detectors and others

15. Energy Saving in Taiwa Factory
Green Trend
Energy Saving in Taiwa Factory

16. Energy Saving form Corporate Perspective
Green Trend
Energy Saving form Corporate Perspective
Achieved
100
2007
2008
2009
2010
2011
2012
2013
2014 90
30% Reduction 80
50% Reduction 70 60 50 40
Base
Middle Target
Target
Fiscal Year
Source: SEMICON China 2014

17. Eco-Industry: WFE Supplier and IC Maker
Partnership Trend
Eco-Industry: WFE Supplier and IC Maker
~ Old Days
End Product (Electronics)
IC Design
IC Manufacturing
IC Development
Device Integration
Failure Analysis
Module Process
Process Development
Maintenance
Hardware Production
Current ~
End Product (Electronics)
IC Design
IC Manufacturing
IC Development
Device Integration
Failure Analysis
Module Process
Process Development
Tool Maintenance
Hardware Production IC
Maker IC
Maker
Overlap Region : Collaboration Area
WFE Supplier
WFE Supplier
WFE supplier’s duty is increasing, call for collaboration

18. TEL Worldwide R&D Sites
Partnership Trend
TEL Worldwide R&D Sites
imec (Belgium)
G450C
Tohoku University (Japan)
TEL Technology Center, America
SEMATECH (US)
Albany NanoTech (US)
CEA-Leti (France)
Japan
Leading-edge Process
Development Center
Technology Development Center
TEL Technology Center, Sendai
imec
STT-MRAM
DSA
EUV…
CNSE/SUNY
III-V FET
EIDEC
Tohoku Univ.
450 mm
G450C
TEL R&D base
Consortium
Preparing for the future technology : w/w collaboration

19. Partnership Trend
Biz Model Transition : Vertical Integration to Horizontal Specialization
Source: T. Higashi, IME 2014

20. 天时地利人和 中国正扮演世界IC业界的主角
考量与思索
◆集成电路市场三大发展方向
-社交网络普及，设备高性能化，消费区域扩大
◆集成电路产业五大变化趋势
-技术趋势：后摩尔定律时代的多元发展
-平台趋势：450/Single Wafer/Cluster Tool
-商务趋势：中国时代，产业集聚
-绿色趋势：生产环节，使用环节
-平台趋势：合作共生，协同发展
天时地利人和
中国正扮演世界IC业界的主角

21. 谢谢聆听