1. LHCC Comprehensive Review 26/6/06 D.J.A. Cockerill - RAL 1 Status of the CMS ECAL Endcaps LHCC Comprehensive Review, June 2006 D Cockerill EE  EE large mechanics  VPTs and Supercrystal assembly  Electronics  Trigger  The “Dee4” project ES  ES mechanics  Micromodules and readout EE and ES Planning Conclusions

2. LHCC Comprehensive Review 26/6/06 D.J.A. Cockerill - RAL 2 The CMS ECAL Endcaps – EE/ES Tapered crystals Off-Pointing ~ 3 o from vertex Crystal Endcaps: 4 Dees (2 per endcap) 14648 Crystals Total mass 22.9 t Preshower 2Xo, 1Xo Pb, 2mm Si strips, 2 x 2 orthogonal layers

3. LHCC Comprehensive Review 26/6/06 D.J.A. Cockerill - RAL 3 EndCap EE All large mechanical pieces are at CERN Dry assembly of env. screen produced in Russia

4. LHCC Comprehensive Review 26/6/06 D.J.A. Cockerill - RAL 4 EE: VPT production & gluing, Supercrystals EE VPT to crystal gluing 2800 VPTs shipped from UK to CERN All tested upon receipt by Russia - INR Up to 50 EE crystals/VPTs glued each week 110 of current EE crystal stock (~350 xtals) done First “Russian” SC completed in June 2006 built using CRISTAL database

5. LHCC Comprehensive Review 26/6/06 D.J.A. Cockerill - RAL 5 EE electronics Preliminary results, ~ 3900 e- per channel Cross talk < 0.1% Meets EE requirements SC HV cards 105 pre-production cards completed All R & C components for EE delivered Motherboards 2 prototypes on Dee4 600 cards by end 2006 EE VFE cards RC feedback on MGPA tuned for EE Input diode for VPT spark protection 30 prototypes produced in Feb 06 250 cards now under test 3130 cards by end July 06 FE cards 80 pre-production cards tested 800 cards produced by Sep 2006

6. LHCC Comprehensive Review 26/6/06 D.J.A. Cockerill - RAL 6 EE trigger Pseudostrip (5 crystal) allocations EE+ towards I.P Consequent trigger towers (TCC level) EE+ towards I.P

7. LHCC Comprehensive Review 26/6/06 D.J.A. Cockerill - RAL 7 EE : preparing for the assembly Ensuring correct cabling of the channels Trigger map (H.Heath) LED cabling tester from UVa

8. LHCC Comprehensive Review 26/6/06 D.J.A. Cockerill - RAL 8 EE data and trigger readout The fibre readout fan-out boxes (two layers) serving the EE DCCs and TCCs in the control room 900 readout fibres to correctly route per Dee

9. LHCC Comprehensive Review 26/6/06 D.J.A. Cockerill - RAL 9 “Dee4” project “Dee4” First large scale test of integration philosophy 20 SCs mounted on BP Dee4 by end 2006 Trigger mapping at motherboard 10 cooling blocks, main manifold “Dee4” to testbeam in May 2007 EE assembly has started “Dee4” will provide crucial assembly and test beam insights Dee1 assembly from September 2006

10. LHCC Comprehensive Review 26/6/06 D.J.A. Cockerill - RAL 10 (Preshower) ES: Engineering Windows ready with Paraffin : first elements to be installed before beam pipe closure First brazing of cooling screen Blanks for outer drums/patch panels

11. LHCC Comprehensive Review 26/6/06 D.J.A. Cockerill - RAL 11 ES: Silicon micro-modules Si sensors available All ceramics supports and Al tiles produced Small mod to allow for backplane bonding (follow. ES and Tracker experience) All ASICS available Problem with hybrids production First large series of PCBs not good ! Immediate action: change PCB manufacturing company Will probably eat a large part of schedule contingency

12. LHCC Comprehensive Review 26/6/06 D.J.A. Cockerill - RAL 12 ES: On and Off detector digital electronics Successful test of Mother boards pre-series including 12 boards token ring and test of several ladders →Production launched ESR for ES-DCC last May OptoRx: proto ok. Final version in a few weeks VME board end of Summer (collab. with TOTEM) MB tester (NTU) OptoRx

13. LHCC Comprehensive Review 26/6/06 D.J.A. Cockerill - RAL 13 EE Planning Dee 1End Sep 2007 Dee 2End Dec 2007 Dee 3Mid Mar 2008 Dee 4Mid Apr 2008 CMS window for Dee1 end Sep 07 EE+ mid Jan 08 EE- mid Mar 08

14. LHCC Comprehensive Review 26/6/06 D.J.A. Cockerill - RAL 14 EE planning Crucial to introduce as much parallel assembly and integration as possible Quality control at each crucial step Suggestion to carry out all SC mounting and Dee assembly in bldg 867 This offers many very attractive features - all major activities under one roof - proximity of expert teams - realisation of the EE trigger, from motherboard level to fibre readout level - multiple DAQ test systems, needed for EE QA, available locally - cooling capacity for one entire Dee - LV power Crystal Palace Advance preparation of all large mechanics - Dees into OPAL frames - dry assembly tests of Environmental screens - BP cooling installation - Mounting laser monitoring system

15. LHCC Comprehensive Review 26/6/06 D.J.A. Cockerill - RAL 15 ES planning Good progress with engineering/mechanics Bare micromodule production has started Problem with hybrid PCB production: change of producer necessary; will try to minimize impact on overall ES schedule Delay on system motherboards but production should start soon and should be faster than originally envisaged Important progress in DAQ (software and ES-DCC) and good advances in offline/physics software “Ready for Installation” dates so far unaffected by delays. Some contingency now exists due to revised V35 schedule but will probably be “eaten” by hybrid delay ES+ Dee1 assembly finished15.3.07 ES+ Dee2 assembly finished30.6.07 ES- Dee1 assembly finished30.8.07 ES- Dee2 assembly finished30.11.07 ES- RFI31.8.07 ES+ RFI31.12.07

16. LHCC Comprehensive Review 26/6/06 D.J.A. Cockerill - RAL 16 EE - Conclusions EE and ES assembly has started Much progress with the EE large mechanics, VPTs, SC assembly, electronics, and trigger and data mapping “Dee4” will provide crucial assembly and test beam insights Dee1 assembly from September 2006 Good progress with ES engineering/mechanics Bare micromodule production has started We are on the learning curve for EE and ES assembly

17. LHCC Comprehensive Review 26/6/06 D.J.A. Cockerill - RAL 17 Additional info follows, next slide