1. Detailed Design Review: P18001

2. Agenda Team Vision Bill of Materials Sensor Selection
Risk Management - High Risk Items
Budgeting
Drawings - Proposed Design
Electrical Diagrams and Test Results
Bluetooth Chip Selection and Test Results
PCB Scheduling and Draft Schematic
Power Consumption Simulation
Planned Manufacturing Processes
Bill of Materials
Plans for next phase

3. Team Vision What we intended to do: What we accomplished:
Determine final design and parameters for MSD2
Begin ordering parts for prototype build
Complete testing on alternative sensors
Construct engineering and electrical drawings/schematics
Review Customer Requirements, Engineering Requirements, and Risk Management Chart to check for any updates
What we accomplished:
Final goal design and parameters
Parts were ordered for prototype build
Decided on Bluetooth chip
Testing was conducted on Force Sensitive Resistors and Bluetooth chip
Conducted a Power Analysis
PCB schedule was drafted
Budget/BOM was updated and finalized for MSD2
Preliminary schedule was drafted for MSD2
Natasha

4. Sensor Selection
Piezoelectric
FSR
Replace with FSR
Chris

5. Risk Management - High Risk Items
Full document in pre-read
Corey
Updated high risk items outlined in red. There are others updated in handout, but they’re mostly items that lowered in importance.
R20 - We recognized that a high risk would be if the strain gauge cannot withstand the strain that will be put on it. This would cause the strain gauge to not work, therefore we will carefully select a strain gauge that can withstand the necessary amount of strain.
R21 - The next high risk is that the length of the string might not be adjusted correctly, therefore it doesn’t actuate relays. This risk can be minimized by carefully designing the length of the strings and how they are attached.
R22 - Another possible risk is that the strings restrict finger movement and this risk can minimized by properly designing and then testing the strings to ensure there are no restrictions.
R27 - The next risk is that the strain gauge delaminates from the material due to the adhesive not being strong enough or flexible enough. This risk can be minimized by doing some research and finding what adhesive will fit our needs.

6. Budgeting
Chris

7. Drawings - Proposed Design of Electrical Subsystem
2D Overall Subsystem Design
3D Overall Subsystem Design
Zach?

8. Zach?

9. Zach?

10. Drawings - Proposed Design, finger loops
Mini watch bands to adjust to a range of finger circumference sizes
zach?

11. Zach?

12. Zach?

13. Drawings - Proposed Design
Thorough Sketch of Hand Strap to secure controller
Silicone base of the Hand Strap
zach?

14. Bluetooth Chip Selection and Testing
Using the RN-42 chip inside the blueSMiRF evaluation board for testing
Objectives:
Turn on bluetooth modules
Enter command mode on both modules
Determine feasibility of using each command
Pair modules with each other and send data
Research and verify data rate and connection strength
Tre?

15. Test Bench
Tre?

16. Bluetooth Chip Testing Results
Turned on!
Command mode was enterable using UART communication
Name of the device was changed using the COMMANDMODE protocol, shown at right
Modules were paired with each-other (physical feedback mechanism was observed, with synced flashing LED)
Sending a ‘0xC’ across the isolation barrier resulted in the LED turning on as programmed, 1000 trials, zero parity used, no errors detected
Stayed connected while in use and in idle for a period of 3 hours
Tre?

17. PCB Scheduling Preliminary Schematic: 12/05/2017 Complete
12/12/2017: Final Schematic 12/12/2017
Draft Layout 12/19/2017
Completed Layout 12/27/2017
Ordered through OSH 12/28/2017
Tre?

18. Preliminary Schematic (from last time)
Chris

19. Preliminary Schematic for Prototyping
Chris

20. Preliminary Schematic for Prototyping
Chris

21. Power Analysis
Chris

22. Power Analysis RGB LED: 10mA when on, ~pA when off
Teensy: 35 mA nominally
Bluetooth: 12.2 mA nominally
ADXL: 140 uA
Chris

23. Power Analysis Results
For a >12 hour use case, we will want somewhere near 780 mAh in our battery
780 mAh is a standard size, and comes in several different package sizes, including many that will fit our design constraints
Chris

24. Manufacturing Processes
Zach?

25. BOM
Chris

26. Plans for Next Phase Carry out Test Plans Review Test Plan results
Determine final design based on test results
Update Risk Analysis
Finalize BOM and Order
Construct Electrical Layout of Components
Construct Hardware Components
Assemble all components into Whole
Test product
Review Test Results
Repeat Highlighted Bullets
Adrita: The main focus for next semester is to build, integrate components, test, rebuild, reintegrate, retest, and so on.