1. IPC/JEDEC INDUSTRY MAPPING
Agenda Item 6.2
4th JIC meeting Regensburg, Germany June 17, 2003

2. Minimum IPC Standards Tool Kit

3. IPC STANDARDS MAP

4. IPC STANDARDS MAP (cont.)

5. ASSEMBLY J-STD-001 IPC-HDBK-001 IPC-9261 IPC-7912
Soldering Electrical and Electronic Assemblies
IPC-HDBK-001
Handbook & Guide to Supplement J-STD-001
IPC-9261
In-Process DPMO and Estimated Yield for PWAs
IPC-7912
Calculation of DPMO & Manufacturing Indices for Printed
Board Assemblies

6. ACCEPTANCE IPC-DRM-40 IPC-A-610 IPC-9191 IPC-DRM-SMT
Through-Hole Solder Joint Evaluation Desk Reference Manual
IPC-A-610
Acceptability of Electronic Assemblies
IPC-9191
General Guidelines for Implementation of Statistical Process Control (SPC)
IPC-DRM-SMT
Surface Mount Solder Joint Evaluation Desk Reference Manual

7. SOLDERABILITY IPC-WP-001 J-STD-002 J-STD-003 IPC-WP-005 IPC-TR-461
Soldering Capability White Paper Report
J-STD-002
Solderability Tests for Component Leads, Terminations, Lugs, Terminals and Wires
J-STD-003
Solderability Tests for Printed Boards
IPC-WP-005
PWB Surface Finishes
IPC-TR-461
Solderability Evaluation of Thick & Thin Fused Coatings
IPC-TR-462
Solderability Evaluation of Printed Boards with Protective Coatings Over Long-Term Storage

8. SOLDERABILITY (cont.) IPC-TR-464
Accelerated Aging for Solderability Evaluations
IPC-TR-465-1
Round Robin Test on Steam Ager Temperature Control Stability
IPC-TR-465-2
The Effect of Steam Aging Time and Temperature on Solderability Test Results
IPC-TR-465-3
Evaluation of Steam Aging on Alternative Finishes, Phase 11A
IPC-TR-466
Wetting Balance Standard Weight Comparison Test

9. ADVANCED
IPC-TR-001
An Introduction to Tape Automated Bonding Fine Pitch Technology
IPC-WP-003
Chip Mounting Technology
J-STD-012
Implementation of Flip Chip and Chip Scale Technology
J-STD-013
Implementation of Ball Grid Array & Other High Density Technology
J-STD-026
Semiconductor Design Standard for Flip Chip Applications
J-STD-028
Performance Standard for Construction of Flip Chip and Chip Scale Bumps
IPC-SM-784
Guidelines for Chip-on-Board Technology Implementation
IPC-MC-790
Guidelines for Multichip Module Technology Utilization

10. WIRE HARNESS IPC-WHMA-A-620
Requirements & Acceptance for Cable & Wire Harness Assemblies

11. OPTOELECTRONICS
IPC-0040
Optoelectronic Assembly and Packaging Technology

12. ASSEMBLY SUPPORT SMC-WP-002 IPC-DRM-18 IPC-DW-426 IPC-TR-581
Solderability Tests for Component Leads, Terminations, Lugs, Terminals and Wires
IPC-DRM-18
Component Identification Desk Reference Manual
IPC-DW-426
Specification for Assembly of Discrete Wiring
IPC-TR-581
IPC Phase III Controlled Atmosphere Soldering Study
IPC-TA-722
Technology Assessment Handbook on Soldering
IPC-TA-723
Technology Assessment Handbook on Surface Mounting
IPC-CM-770
Component Mounting Guidelines for Printed Boards

13. ASSEMBLY SUPPORT(cont.)
IPC-SM-780
Component Packaging and Interconnecting with Emphasis on Surface Mounting
IPC-SM-785
Guidelines for Accelerated Reliability Testing of Surface Mount Attachments
IPC-S-816
SMT Process Guideline & Checklist
IPC-AJ-820
Assembly & Joining Handbook
IPC-TP-1115
Selection and Implementation Strategy for A Low-Residue No-Clean Process
IPC-1720
Assembly Qualification Profile

14. ASSEMBLY SUPPORT(cont.)
IPC-7095
Design and Assembly Process Implementation for BGA's
IPC-7525
Stencil Design Guidelines
IPC-7530
Guidelines for Temperature Profiling for Mass Soldering (Reflow & Wave) Processes
IPC-7711
Rework of Electronic Assemblies
IPC-7721
Repair and Modification of Printed Boards and Electronic Assemblies
IPC-9701
Performance Test Methods and Qualification Requirements for Surface Mount Solder Attachments
IPC-9851
Equipment Interface Specification

15. ASSEMBLY MATERIALS FLUX/SOLDER J-STD-004 J-STD-005 J-STD-006
Requirements for Soldering Fluxes
J-STD-005
Requirements for Soldering Pastes
J-STD-006
Requirements for Electronic Grade Solder Alloys and Fluxed and Non-Fluxed Solid Solders
IPC-TP-1043
IPC Cleaning and Cleanliness Test Program Phase 3 Water Soluble Fluxes Part 1
IPC-TP-1044
IPC Cleaning and Cleanliness Test Program Phase 3 Water Soluble Fluxes Part 2

16. ASSEMBLY MATERIALS (cont.)
ADHESIVES
IPC-SM-817
General Requirements for Dielectric Surface Mounting Adhesives
IPC-CA-821
General Requirements for Thermally Conductive Adhesives
IPC-3406
Guidelines for Electrically Conductive Surface Mount Adhesives
IPC-3408
General Requirements for Anisotropically Conductive Adhesives Films

17. ASSEMBLY MATERIALS (cont.)
COAT/MASK
IPC-CC-830
Qualification and Performance of Electrical Insulating Compound for Printed Wiring Assemblies
IPC-HDBK-830
Guidelines for Design, Selection and Application of Conformal Coatings
IPC-SM-840
Qualification and Performance of Permanent Solder Mask

18. PCB / ACCEPTANCE IPC-DW-425A IPC-QE-605 IPC-TF-870 IPC-MC-960 IPC-1710
Design and End Product Requirements for Discrete Wiring Boards
IPC-QE-605
Printed Board Quality Evaluation Handbook
IPC-TF-870
Qualification and Performance of Polymer Thick Film Printed Boards
IPC-MC-960
Qualification and Performance Specification for Mass Lamination Panels for Multilayer Printed Boards
IPC-1710
OEM Standard for Printed Board Manufacturers' Qualification Profile (MQP)

19. PCB / ACCEPTANCE (cont.)
IPC-6011
Generic Performance Specification for Printed Boards
IPC-6012
Qualification and Performance Specification for Rigid Printed Boards
IPC-6013
Qualification & Performance Specification for Flexible Printed Boards
IPC-6015
Qualification & Performance Specification for Organic Multichip Module Mounting and Interconnecting Structures
IPC-6016
Qualification & Performance Specification for High Density Interconnect (HDI) Layers or Boards
IPC-6018
Microwave End Product Board Inspection and Test

20. PCB / ACCEPTANCE (cont.)
IPC/JPCA-6202
Performance Guide Manual for Single- and Double-Sided Flexible Printed Wiring Boards
IPC/JPCA-6801
Terms & Definitions, Test Methods, and Design Examples for Build-Up/High Density Interconnect (HDI) Printed Wiring Boards
IPC-9191
General Guidelines for Implementation of Statistical Process Control (SPC)
IPC-9252
Guidelines and Requirements for Electrical Testing of Unpopulated Printed Boards
IPC-A-600
Acceptability of Printed Boards

21. COMPONENTS
J-STD-020
Moisture/Reflow Sensitivity Classification for Nonhermetic Solid State Surface Mount Devices
J-STD-032
Performance Standard for Ball Grid Array Balls
J-STD-033
Handling, Packing, Shipping and Use of Moisture/Reflow Sensitive Surface Mount Devices
J-STD-035
Acoustic Microscopy for Non-Hermetic Encapsulated Electronic Components

22. COMPONENTS (cont.) IPC-9501 IPC-9502 IPC-9503 IPC-9504
PWB Assembly Process Simulation for Evaluation of Electronic Components
IPC-9502
PWB Assembly Soldering Process Guideline for Electronic Components
IPC-9503
Moisture Sensitivity Classification for Non-IC Components
IPC-9504
Assembly Process Simulation for Evaluation of Non-IC Components (Preconditioning Non-IC Components)

23. CLEANING/ CLEANLINESS
IPC-SC-60
Post Solder Solvent Cleaning Handbook
IPC-SA-61
Post Solder Semi-Aqueous Cleaning Handbook
IPC-AC-62
Aqueous Post Solder Cleaning Handbook
IPC-CH-65
Guidelines for Cleaning of Printed Boards & Assemblies
IPC-TR-468
Factors Affecting Insulation Resistance Performance of Printed Boards
IPC-TR-476
Electrochemical Migration: Electrically Induced Failures in Printed Wiring Assemblies

24. CLEANING/ CLEANLINESS (cont.)
IPC-TR-580
Cleaning and Cleanliness Test Program Phase 1 Test Results
IPC-TR-581
IPC Phase III Controlled Atmosphere Soldering Study
IPC-TR-582
Cleaning & Cleanliness Test Program for: Phase 3-Low Solids Fluxes & Pastes Processed in Ambient Air
IPC-TR-583
An In-Depth Look At Ionic Cleanliness Testing
IPC-SM-839
Pre & Post Solder Mask Application Cleaning Guidelines
IPC-9201
Surface Insulation Resistance Handbook

25. LAMINATE FLEX IPC-FC-234 IPC-4202 IPC-4203 IPC-4204 IPC-4552
PSA Assembly Guidelines for Single- & Double-Sided Flexible Printed Circuits
IPC-4202
Flexible Base Dielectrics for Use in Flexible Printed Circuitry
IPC-4203
Adhesive Coated Dielectric Films for Use as Cover Sheets for Flexible Printed Circuitry and Flexible Adhesive Bonding Films
IPC-4204
Flexible Metal-Clad Dielectrics for Use in Fabrication of Flexible Printed Circuitry
IPC-4552
Specification for Electroless Nickel/Immersion Gold (ENIG) Plating for Printed Circuit Boards

26. LAMINATE (cont.) RIGID IPC-4101 IPC-4103 IPC-1730 HDI IPC-DD-135
Specifications for Base Materials for Rigid and Multilayer Printed Boards
IPC-4103
Specification for Base Materials for High Speed/High Frequency Applications
IPC-1730
Laminator Qualification Profile
HDI
IPC-DD-135
Qualification Testing for Deposited Organic Interlayer Dielectric Materials for Multichip Modules
IPC-4104
Specification for High Density Interconnect (HDI) and Microvia Materials
IPC-SM-840
Qualification and Performance of Permanent Solder Mask

27. LAMINATE (cont.) IPC-CF-148 IPC-CF-152 IPC-1731 IPC-4562 FOIL
Resin Coated Metal for Printed Boards
IPC-CF-152
Composite Metallic Materials Specification for Printed Wiring Boards
IPC-1731
Strategic Raw Materials Supplier Qualification Profile
IPC-4562
Metal Foil for Printed Wiring Applications

28. FABRICATION IPC-DR-570 IPC-DR-572 IPC-OI-645 IPC-TA-724 IPC-PE-740
General Specification for 1/8 inch Diameter Shank Carbide Drills for Printed Boards
IPC-DR-572
Drilling Guidelines for Printed Boards
IPC-OI-645
Standard for Visual Optical Inspection Aids
IPC-TA-724
Technology Assessment Series on Clean Rooms
IPC-PE-740
Troubleshooting for Printed Board Manufacture and Assembly

29. REINFORCEMENT IPC-4412 IPC-SG-141 IPC-A-142 IPC-QF-143 IPC-1731
Specification for Finished Fabric Woven from "E" Glass for Printed Boards
IPC-SG-141
Specification for Finished Fabric Woven from "S" Glass for Printed Boards
IPC-A-142
Specification for Finished Fabric Woven from Aramid for Printed Boards
IPC-QF-143
Specification for Finished Fabric Woven from Quartz (Pure Fused Silica) for Printed Boards
IPC-1731
Strategic Raw Materials Supplier Qualification Profile

30. REINFORCEMENT (cont.) IPC-4110 IPC-4121 IPC-4130 IPC-4411
Specification and Characterization Methods for Nonwoven Cellulose Based Paper for Printed Boards
IPC-4121
Guidelines for Selecting Core Construction for Multilayer Printed Wiring Board Applications
IPC-4130
Specification & Characterization Methods for Nonwoven "E" Glass Mat
IPC-4411
Specification and Characterization Methods for Non-Woven Para-Aramid Reinforcement

31. ASSEMBLY IPC-D-279 IPC-D-326 IPC-C-406 IPC-C-408 IPC-SM-782
Design Guidelines for Reliable Surface Mount Technology Printed Board Assemblies
IPC-D-326
Information Requirements for Manufacturing Electronic Assemblies
IPC-C-406
Design & Application Guidelines for Surface Mount Applications Connectors
IPC-C-408
Design & Application Guidelines for the Use of Solderless Surface Mount Connectors
IPC-SM-782
Surface Mount Design & Land Pattern Standard

32. INTERFACES IPC-D-310 IPC-A-311 IPC-D-350 IPC-D-351 IPC-D-356 IPC-D-390
Guidelines for Phototool Generation and Measurement Techniques
IPC-A-311
Process Controls for Phototool Generation and Use
IPC-D-350
Printed Board Description in Digital Form
IPC-D-351
Printed Board Drawings in Digital Form
IPC-D-356
Bare Substrate Electrical Test Data Format
IPC-D-390
Automated Design Guidelines

33. INTERFACES IPC-2511 IPC-2531 IPC-2541 IPC-2571
Generic Requirements for Implementation of Product Mfg. Description Data & Transfer Methodology
IPC-2531
Standard Recipe File Format Specification
IPC-2541
Generic Requirements for Electronics Manufacturing Shop Floor Equipment Communication (CAMX)
IPC-2571
Generic Requirements for Electronics Mfg. Supply Chain Communication - Product Data eXchange (PDX)

34. PCB SMC-WP-004 IPC-2252 IPC-D-317 IPC-D-859 IPC-1902 IPC-2141
Design for Success
IPC-2252
Design Guide for RF/Microwave Circuit Boards
IPC-D-317
Design Guidelines for Electronic Packaging Utilizing High Speed Techniques
IPC-D-859
Design Standard for Thick Film Multilayer Hybrid Circuits
IPC-1902
Grid Systems for Printed Circuits
IPC-2141
Controlled Impedance Circuit Boards & High Speed Logic Design

35. PCB (cont.) IPC-2221 IPC-2222 IPC-2223 IPC-2224 IPC-2225 IPC-2315
Generic Standard on Printed Board Design
IPC-2222
Sectional Standard on Rigid Organic Printed Boards
IPC-2223
Sectional Design Standard for Flexible Printed Boards
IPC-2224
Sectional Standard of Design of PWB for PC Cards
IPC-2225
Sectional Design Standard for Organic Multichip Modules (MCM-L) and MCM-L Assemblies
IPC-2315
Design Guide for High Density Interconnects & Microvias
IPC-2615
Printed Board Dimensions and Tolerances

36. JEDEC: IEC PAS ACTIVITY
EIA/JESD22-B102C
47/1446/PAS IEC Ed. 1:
Solderability test method
JESD22-B106-B
47/1447/PAS: IEC , Ed. 1:
Resistance to soldering temperature for through-hole mounted devices
EIA/JESD-22-B107-A
47/1448/PAS: IEC 62175, Ed. 1:
Marking Permanency
47/1629/MCR: Published as part of IEC , Ed. 1
EIA/JESD22-B116
47/1449/PAS: IEC 62176, Ed. 1:
Wire bond shear test method
47/1482A/RVD Withdrawal of 47/1449/PAS

37. JEDEC: IEC PAS ACTIVITY
JESD22-A110B-B
47/1450/PAS: IEC 62177, Ed. 1:
Highly-accelerated temperature and humidity stress test (HAST)
47/1627/MCR Published as part of IEC , Ed. 1
JESD22-A104-A
47/1451/PAS: IEC 62178, Ed. 1:
Temperature cycling
EIA/JESD22-A114-A
47/1452/PAS: IEC 62179, Ed. 1:
Electrostatic discharge (ESD) sensitivity testing human body model (HBM)
EIA/JESD22-A115-A
47/1453/PAS: IEC 62180, Ed. 1:
Electrostatic discharge (ESD) sensitivity testing machine model (MM)

38. JEDEC: IEC PAS ACTIVITY
JESD78
47/1454/PAS: IEC 62181, Ed. 1:
IC latch-up test
JESD22-A113-B
47/1455/PAS: IEC 62182, Ed. 1:
Preconditioning of nonhermetic surface mount devices prior to reliability testing
JESD22-A107-A
47/1456/PAS: IEC 62183, Ed. 1:
Salt atmosphere
47/1633/MCR: Published as part of IEC , Ed. 1
JESD22-B105-B
47/1457/PAS: IEC 62184, Ed. 1:
Lead integrity

39. JEDEC: IEC PAS ACTIVITY
JESD22-A106-A
47/1458/PAS: IEC 62185, Ed. 1:
Thermal shock
47/1631/MCR: Published as part of IEC , Ed. 1
JESD22-B104-A
47/1459/PAS: IEC 62186, Ed. 1:
Mechanical shock
47/1630/MCR: Published as part of IEC Ed. 1
JESD22-B103-A
47/1460/PAS: IEC 62187, Ed. 1:
A vibration, variable frequency
47/1632/MCR: Published as part of IEC , Ed. 1
JESD22-A101-B
47/1461/PAS: IEC 62161, Ed.1:
Test method A101-B – Steady state temperature humidity bias life test
47/1680/MCR: Published as IEC , Ed. 1

40. JEDEC: IEC PAS ACTIVITY
JESD22-C101
47/1462/PAS: IEC , Ed. 1:
Test method C101 – Electrostatic Discharge (ESD) Sensitivity Testing – Charged device model (CDM)
JESD22-B101
47/1463/PAS: IEC 62163, Ed. 1:
Test method B101 – External Visual
47/1626/MCR: Published as part of IEC , Ed. 1
JEP118
47/1464/PAS: IEC 62164, Ed. 1:
Guidelines for GaAs MMIC and FET life testing
JEP110
47/1465/PAS: IEC 62165, Ed. 1:
Guidelines for the measurement of thermal resistance of GaAs FETs
EIA/JESD46-A
47/1466/PAS: IEC 62166, Ed. 1:
Guidelines for user notification of product/process changes by semiconductor suppliers

41. JEDEC: IEC PAS ACTIVITY
EIA/JESD48
47/1467/PAS: IEC 62167, Ed. 1:
Product discontinuance
JEP 113-B
47/1468/PAS: IEC 62168, Ed. 1:
Symbols and labels for moisture-sensitive devices
IPC/JEDEC J-STD-033
47/1469/PAS: IEC 62169, Ed. 1:
Standard for handling, packing, shipping and use of moisture/reflow sensitive surface mount devices
EIA/JESD59
47/1470/PAS: IEC 62170, Ed. 1:
Bond wire modeling standard
JEP114
47/1471/PAS: IEC 62171, Ed. 1:
Guidelines for particle impact noise detection (PIND) testing, operator training and certification
47/1681/MCR: Published as , Ed. 1

42. JEDEC: IEC PAS ACTIVITY
JESD22-A102-B
47/1472/PAS: IEC 62172, Ed. 1:
Accelerated moisture resistance – Unbiased autoclave
JESD22-A108-A
47/1474/PAS: IEC 62189, Ed. 1:
Bias Life
J-STD-020A (IPC/JEDEC)
47/1475/PAS: IEC 62190, Ed. 1:
Moisture/reflow sensitivity classification for nonhermetic solid state surface mount devices
47/1592/MCR: Publication Withdrawn – Topic is now covered by IEC 60749, Amendment 2, Ed. 2 ( ) and IEC 60749, Ed. 2.2 ( ).
J-STD-035
47/1476/PAS: IEC 62191, Ed. 1:
Acoustic microscopy for nonhermetic encapsulated electronic components
47/1593/MCR: Publication Withdrawn – Topic is now covered by IEC 60749, Amendment 2, Ed. 2 ( ) and by IEC 60749, Ed. 2.2 ( )

43. JEDEC: IEC PAS ACTIVITY
JEP119
47/1506/PAS: IEC 62201, Ed. 1:
A procedure for executing sweat
EIA/JEP122
47/1507/PAS: IEC 62202, Ed. 1:
Failure mechanisms and models for silicon semiconductor devices
EIA/JEP128
47/1508/PAS: IEC 62203, Ed. 1:
Guide for standard probe pad sizes and layouts for wafer-level electrical testing
EIA/JESD33-A
47/1509/PAS: IEC 62204, Ed. 1:
Measuring and using the temperature coefficient of resistance to determine the temperature of a metallization line
JESD-A103-A
47/1513/PAS: IEC Ed. 1:
High temperature storage life
47/1628/MCR: Published as part of IEC , Ed. 1

44. JEDEC: IEC PAS ACTIVITY
EIA/JESD22-A105-B
47/1514/PAS: IEC 62206, Ed. 1:
Test Method A105-B – Power and temperature cycling
JESD22-A109
47/1515/PAS: IEC 62207, Ed. 1:
Test Method A109 – Hermeticity
47/1594/MCR: Publication Withdrawn – Topic is now covered by IEC 60749, Amendment 2, Ed. 2 ( ) and by IEC 60749, Ed. 2.2 ( )
JESD22-A120
47/1595/PAS: IEC 62307
Test Method for the Measurement of Moisture Diffusivity and Water Solubility in organic Materials Used in Integrated Circuits
JESD22-A118
47/1635/PAS: IEC PAS 62336:
Accelerated Moisture Resistance – Unbiased HAST

45. IPC: IEC PAS ACTIVITY IPC-EIA/J-STD-012 IPC-EIA/J-STD-013 IPC-2511
Flip chip and chip scale technology implementation
IPC-EIA/J-STD-013
IEC/PAS 62085
Implementation of ball grid array and other high density technology
IPC-2511
IEC/PAS 62119
Generic requirements for implementation of product manufacturing description data and transfer methodology
IPC-6202
IEC/PAS Ed. 1.0
Performance guide Manual for single- and double-sided flexible printed wiring boards
IPC-4130
IEC/PAS 62212
Specification and characterization methods for nonwoven "E" glass mat

46. IPC: IEC PAS ACTIVITY IPC-4411 IPC-6011 IPC-1710 IPC-1720
Specification and characterization methods for nonwoven para-aramid reinforcement
IPC-6011
IEC/PAS 62214
Generic performance specification for printed boards
IPC-1710
IEC/PAS Ed. 1.0
Manufacturers qualification profile (MQP)
IPC-1720
IEC/PAS Ed. 1.0
Assembly qualification profile (AQP)

47. IPC: IEC PAS ACTIVITY IPC-1730 IPC-6013 (with amendment)
IEC/PAS Ed. 1.0
Laminator qualification profile
IPC-6013 (with amendment)
IEC/PAS /ED, 1,9
Qualification and performance specification for flexible printed boards
IPC-6012 (with amendment)
IEC/PAS 62250
Qualification and performance specification for rigid printed boards