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Global Expert Technologies

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Presentation on theme: "Global Expert Technologies"— Presentation transcript:

1 Global Expert Technologies

2 Contents Company Overview Commitments to Quality
Manufacturing Facility Technical Capabilities

3 Contents Company Overview Commitments to Quality
Manufacturing Facility Technical Capabilities

4 Global Expert Technologies
HK-based company with PCB manufacturing in Huizhou Low to Medium volume production Specialised on Technically-challenging Products Diversified Customer base and Business segments Stringent management in Quality and Environmental control

5 Company Milestone HK-GD Cleaner Production Partner (Manufacturing) Certified to IATF16949 2015 Automatic testing machine AVI 2002 Trading, Drilling & film plotting Obtained UL 2014 Biochemical system upgraded PCB ERP system 2013 UL Canada certification 2003 Huizhou plant Phase 1 completed 2012 Phase 4 expansion (inner layer) completed 2004 Accredited ISO 9001 & TL 9000 Obtained ISO 14001 We started in 2002 doing only drilling and film plotting. In 2003, We have our own PCB line, and got the ISO 9001 and TL 9000 cert together with ISO14001 next year. We expanded our factory again in 2007, and moved to a new building. Because of this, we are able to plan our production line better for smoother process flow. We also changed all the machines to new ones, automated fully the plating processes. And in 2008, we passed the ISO/TS16949. From the milestone, you can see we are very focused on quality system and environmental control. 2010 Phase 3 expansion completed Roll out quick turn service 2007 Huizhou plant Phase 2 expansion completed 2008 Certified to ISO/TS16949 5

6 Corporate Culture Our Philosophy Having Quality People and Providing Quality Products Our Mission To satisfy our customer’s needs, provide highly professional service and deliver product excellence Our Environmental Commitments To produce environmental friendly products and apply comprehensive environmental protection strategies throughout the manufacturing process

7 The company organization structure
俊杰是一家港资企业,专门生产PCB。 我们生产模式可以支持多型化要求,目前有一个客户有2000个版号。 我们的客户群非常广泛,其中很多都是从事EMS和OEM。 我们的PCB用于许多产品, 如GPS,电信系统,测量仪器等。 7

8 Account Management – One-Stop Solution
Enquiry/Quotation Order Placement Technical communication Contract Review Customer Account Manager Production Delivery Follow-up Services Quality Improvement 8

9 Product Breakdown Product Segment Layer Count
Like many PCB house, the main products are double side and 4-layer boards. These account for more than 60% of our product mix. 6 to 8 layer have about 30%. We can build up to 26 layer boards. Our products are used in various industries; Telecom is our biggest business segments, followed by Automotive and Industrial. Layer Count Product Segment Data : End 2014 9

10 Sales Revenue Growth USD ‘000 CAGR=15% $26,330 $20,200 2014 2008 2009
$16,600 2011 $21,000 2010 $18,500 2012 $19,800 2013 $23,364 $30,280 2015 We started with USD10M sales in 2005. Sales doubled that in 2007 due to our expansion. (We see a drop of 20% in 2009 as many of our customers are from Europe and America; but China market is still growing) (We expect sales will go up 30% this year) Overall, we achieved a growth of 23% on average every year.

11 Global Business ….. Customers from more than 50 countries
West Europe China East Europe Asia America South Africa Argentina Turkey Ukraine IRAN Malaysia We gain high reputation from our customers from more than 50 countries and regions. 11

12 Contents Company Overview Commitments to Quality
Manufacturing Facility Technical Capabilities

13 Quality Certificates Accredited
13

14 Environmental Protection
GET is a Green PCB Enterprise Awarded “Exemplary Enterprise in Huizhou” in 2008 Set up Biochemical Waste Water Treatment plant in 2014 The emission indexes are in conformity with provisions of laws, regulations of the Country and the standard requirements.

15 Contents Company Overview Commitments to Quality
Manufacturing Facility Technical Capabilities

16 Huizhou Manufacturing Facility
Total Floor Area : 16,600 m2 Work Force : 350 Annual Capacity : ,000 m2

17 1. Engineering (CAD/CAM) 4. CNC Drilling
5. Automatic Panel Plating Line 7. Automatic ENIG Plating Line 6. Stripping, Etching and Tin Stripping 8. Dry Film Imaging 10. Flying-probe Test 9. Dry Film Development 11. E-Test 12. Final QC 2. Mass Lamination 3. Automatic Optical Inspection 17

18 New Facilities in 2015 更新设备 持续发展 提升效率 满足客户 Updating new facilities for
AVI 更新设备 持续发展 Updating new facilities for sustainable development 自动测试机(3台)) New Mass Lamination Machine 提升效率 满足客户 improving work efficiency for meeting customers’ requirements. New Fly Probe Testing Machine

19 Contents Company Overview Commitments to Quality
Manufacturing Facility Technical Capabilities

20 Process and Product Capabilities
FINISHING LAMINATES BOARD THICKNESS Rigid PCB Multi-layer ≤26 layers Double Sided Heavy Copper PCB (6oz finished) Hot Air Leveling /HASL (lead free) Immersion Gold,Immersion Silver Gold Fingers Carbon Ink, OSP FR-4, Roger, High TG FR-4, Halogen Free FR-4, 0.2~5.0mm (8 – 200 mil) MIN FINISHED HOLE SIZE SOLDER MASK INK OUTLINE PROFILE MAX. PANEL SIZE Laser Drill:0.10mm(4mil) Tolerance:0.01mm Mechanical Drilling: MIN:0.15mm Tolerance: ± 0.05mm (PTH) ±0.03mm (NPTH) Aspect rate: 1:8 LPI Soldermask Peelable Soldermask Punching, Routing, Punch And Push Back 476mm X 620mm (18.7”X24”)

21 Technology research process
Aspect ratio 1:12.2 Part platting hard gold without conductive line; plugging hole with resin for thin board(board thickness:0.3mm/hole diameter :0.4mm) GET have a dedicated R&D team focusing on PCB manufacturing process. Silk screen line width 4.5mil(min) 3/3OZ(Base) line width/space 9/9mil(min); Common code impedance board Carbon ink on the carbon fingers is 12mil bigger than the copper PAD 1/3OZ(Base)Line width/space control as per 12% (5/3.5mil) TOP:1OZ(Base) BOT:3OZ(Base) The first drilling NPTH Max.:7.0mm, slot hole: 5X10mm Part of BGA with OSP, other SMT ENIG in one board Another thing we do differently in GET is ; We have a dedicated R&D team focusing on PCB manufacturing process. In 2005, we have done blind & buried vias, and half-moon holes. Lead-free in 2006, 0.4mm thick board in 2007 And we did some HDI board & micro vias board in 2008. In 2009, we can do plugged via-holes with resin, TG150 board and Halogen-free boards. We will continue to improve our process. If you have any technical challenge, let us know and see if we can help. Aspect ratio 1:10 Quick Turn Service Plugged via-holes with resin NPG TG150 PCB 2009 2010 2011 2012 2013 2014

22 Thank you!


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