1. Intel® Atom™ Processor E6xx Series Hardware Introduction
For 2012 Intel Cup ESDC
Intel Confidential

2. Legal Disclaimer
INFORMATION IN THIS DOCUMENT IS PROVIDED IN CONNECTION WITH INTEL PRODUCTS. NO LICENSE, EXPRESS OR IMPLIED, BY ESTOPPEL OR OTHERWISE, TO ANY INTELLECTUAL PROPERTY RIGHTS IS GRANTED BY THIS DOCUMENT. EXCEPT AS PROVIDED IN INTEL'S TERMS AND CONDITIONS OF SALE FOR SUCH PRODUCTS, INTEL ASSUMES NO LIABILITY WHATSOEVER AND INTEL DISCLAIMS ANY EXPRESS OR IMPLIED WARRANTY, RELATING TO SALE AND/OR USE OF INTEL PRODUCTS INCLUDING LIABILITY OR WARRANTIES RELATING TO FITNESS FOR A PARTICULAR PURPOSE, MERCHANTABILITY, OR INFRINGEMENT OF ANY PATENT, COPYRIGHT OR OTHER INTELLECTUAL PROPERTY RIGHT. UNLESS OTHERWISE AGREED IN WRITING BY INTEL, THE INTEL PRODUCTS ARE NOT DESIGNED NOR INTENDED FOR ANY APPLICATION IN WHICH THE FAILURE OF THE INTEL PRODUCT COULD CREATE A SITUATION WHERE PERSONAL INJURY OR DEATH MAY OCCUR. Intel may make changes to specifications and product descriptions at any time, without notice. Designers must not rely on the absence or characteristics of any features or instructions marked "reserved" or "undefined." Intel reserves these for future definition and shall have no responsibility whatsoever for conflicts or incompatibilities arising from future changes to them. The information here is subject to change without notice. Do not finalize a design with this information. The products described in this document may contain design defects or errors known as errata which may cause the product to deviate from published specifications. Current characterized errata are available on request. Contact your local Intel sales office or your distributor to obtain the latest specifications and before placing your product order. BunnyPeople, Celeron, Celeron Inside, Centrino, Centrino Inside, Core Inside, FlashFile, i960, InstantIP, Intel, Intel logo, Intel386, Intel486, IntelDX2, IntelDX4, IntelSX2, Intel Atom, Intel Atom Inside, Intel Core, Intel Inside, Intel Inside logo, Intel NetBurst, Intel NetMerge, Intel NetStructure, Intel SingleDriver, Intel SpeedStep, Intel StrataFlash, Intel Viiv, Intel vPro, Intel XScale, Itanium, Itanium Inside, MCS, MMX, Oplus, PDCharm, Pentium, Pentium Inside, skoool, Sound Mark, The Journey Inside, Viiv Inside, vPro Inside, VTune, Xeon, and Xeon Inside are trademarks of Intel Corporation in the U.S. and other countries. Intel Corporation may have patents or pending patent applications, trademarks, copyrights, or other intellectual property rights that relate to the presented subject matter. The furnishing of documents and other materials and information does not provide any license, express or implied, by estoppel or otherwise, to any such patents, trademarks, copyrights, or other intellectual property rights. 64-bit computing on Intel architecture requires a computer system with a processor, chipset, BIOS, operating system, device drivers and applications enabled for Intel® 64 architecture. Performance will vary depending on your hardware and software configurations. Consult with your system vendor for more information Intel® Virtualization Technology requires a computer system with an enabled Intel® processor, BIOS, virtual machine monitor (VMM) and, for some uses, certain computer system software enabled for it. Functionality, performance or other benefits will vary depending on hardware and software configurations and may require a BIOS update. Software applications may not be compatible with all operating systems. Please check with your application vendor. Intel® Hyper-Threading Technology requires a computer system with a processor supporting HT Technology and an HT Technology-enabled chipset, BIOS and operating system. Performance will vary depending on the specific hardware and software you use. For more information including details on which processors support HT Technology, see here . Contact your local Intel sales office or your distributor to obtain the latest specifications and before placing your product order. Microsoft, Windows, and the Windows logo are trademarks, or registered trademarks of Microsoft Corporation in the United States and/or other countries. Copies of documents which have an order number and are referenced in this document, or other Intel literature may be obtained by calling or by visiting Intel's website at Copyright © 2008, Intel Corporation. All rights reserved.

3. New Platform Partitioning – Intel® Atom™ E6XX Processor
Core
FSB
Memory Controller
Graphics
& Video
Audio
LPC
USB
PCIe*
SDIO
PATA
Display Controller
2008 Architecture
2010 Architecture
Intel® Atom™ E6XX
INTEGRATION
Processor
Core
FSB
IMPROVED FEATURE SET
Video
Encode
Video
Encode
Graphics
& Video
PCIe
PCIe
IOH
USB
SDIO
SATA
PCIe
GbE
OPEN STANDARDS
Graphics
& Video
Memory Controller
FLEXIBLE
DON’T GO INTO INDIVIDUAL BLOCKS OF THE MENLOW PLATFORM
=========================================
We have integrated all major processing blocks in CPU which helps lower latency and allows these blocks to run faster
Improved graphics performance and added video encode
Older architectures required the designers to be familiar with Intel proprietary standards such as FSB, DMI, the E6XX architecture is designed with open standards in mind, if you’re familiar with PCIe, you’re good to go.
We provide you with a variety of IOHs to complement E6XX as well as your choice of any PCIe device.
Display Controller
FLEXIBILITY
Audio
LPC
PCIe = PCI Express* Technology

4. Key Features: Intel Atom™ E6XX
Power Optimization
Efficient Footprint
Bill of Materials & TCO
Meet Demand for more Capabilities
Meet Demand for Faster Delivery
High Reliability and Long Life +
E6XX is power optimized from the ground up similar to the rest of the Atom family.
The integration technology that allows for it’s small footprint also eases the design process reducing the items on bill of materials as well as the total cost of ownership.
The PCIe flexibility offered by E6XX allows for more custom & capable products while the variety of its’ SKUs open the door for salability allowing for faster time to market delivery.
E6XX is offers extended temperature support on some of its’ SKUs and of course all parts are tested for reliability and supported for long life

5. Queens Bay Platform Architecture (Intel® Atom™ Processor E6xx (P)(T) Series & Intel® Platform Controller Hub EG20T (P)(T))
Tunnel Creek Processor
45nm technology; Single Core
22x22 mm; TDP 2~3W
0.6, 1.0, 1.3 GHz CPU
Addressable memory: 1GB
Integrated 2D/3D 333MHz (0.6/1.0 GHz CPU) / 400MHz (1.3GHz CPU)
OpenGL ES2.0, OpenVG 1.0, DirectX9.L
Integrated Memory Controller
Integrated HD Video Decoder & Encoder
Encode format: MPEG4, H.263, H.264
Decode format: MPEG2, MPEG4, VC1, WMV9, H.264
IO’s
SPI, SMBUS1.0, 14-pin GPIO, LPC, 1x LVDS, 1x SDVO, Intel® HD Audio
Top Cliff IO Hub
4x UART
2x SD/MMC/SDIO
6x USB 2.0 Hosts, 1x USB Client
1x GbE
2x SATA II
1x CAN, 1x I2C, 1x SPI, 12x GPIO
Intel® High Def. Audio
1x LVDS
DDR2
(mem. Down)
E6xx
1x SDVO
SMBus1.0
Serial
SPI
GPIO
SIO
LPC
PS2 x1 x1 x1 x1
2 SATA II
2x SD/SDIO/MMC
6x USB
HOST
EG20T
1x USB Client
4x UART
IEEE1588 rev2
1x GbE
1x CAN
1x I2C
1x SPI
8x GPIO
Topcliff** is used as an example of an IOH that can be paired with Tunnel Creek

6. Break Away with Intel® Atom™ Processors: Chapter 3
Intel® Atom™ Processor E6xx Series Platform
Break Away with Intel® Atom™ Processors: Chapter 3

7. Intel® Atom™ Processor E6xx Series (SOC)
0.6GHz to 1.6GHz
45 nm High K Process
L1: 24K Data, 32K Instruction; L2: 512KB
Enhanced Intel SpeedStep® Technology
Intel® Hyper-Threading Technology and Intel® Virtualization Technology (Intel® VT) for IA-32, enabled
CPU
Core
Memory
Controller
2D/3D
Graphics
Integrated Graphics
Up to 400MHz
Supports OpenGL* ES2.0, OpenVG* 1.1
Memory Support
DDR2 800 MT/s
8 devices, up to 2GB
32-bit, Single Channel
Memory down only
Intel® High Definition Audio
Display
Controller
Dual Display
24-bit single channel LVDS and SDVO
Hardware
Video
Engine
Legacy
Controller
Video Engine
H/W accelerated video encode & decode
Encode format: MPEG4, H.264
Decode format: MPEG2, MPEG4, VC1, WMV9, H.264
PCI Express* Technology (PCIe*)
Four x1 lanes (4 ports)
Interface to IOH or any other
PCIe* devices
PCIe*
Break Away with Intel® Atom™ Processors: Chapter 3

8. Intel® Atom™ Processor E6xx Series SKUs
Commercial Temperature
Industrial
Temperature
Core Frequency (GHz)
Graphics Frequency (MHz)
Video Encode
Thermal Design Power (W)
1.6
400
Yes
4.5*
1.3
3.6
1.0
320
0.6 No
3.3*
Intel® Atom™ Processor E680
Intel® Atom™ Processor E680T
Intel® Atom™ Processor E660
Intel® Atom™ Processor E660T
Intel® Atom™ Processor E640
Intel® Atom™ Processor E640T
Intel® Atom™ Processor E620
Intel® Atom™ Processor E620T
*pre-silicon estimates
Find and compare Intel® product information at:
Break Away with Intel® Atom™ Processors: Chapter 3 8

9. Value Props Around Every Corner If you only remember one thing per platform…
Intel® Atom 400&500 Series
Scales Fanless to Dual Core w/ Intel® Emb Flex Design
Integrated Graphics and Memory Controller
Intel® Atom™ E6XX
Flexibility using Open PCIe
Video encode
Extended Temp
Intel® Atom™ E6XX + FPGA
Configurable FPGA
Single Package Solution
BOM Consolidation
Oaktrail (Lincroft)
Lowest kit TDP on ECG roadmap (<3.75W)
Battery Gadget Platform
Full HD Playback
DDR3

10. Intel® Atom™ E6XX-based Platform Unleashing Innovation for Optimization
Discrete
PCIe*
Device
Target segment
Segment requiring standard, minimal I/O’s e.g. IP Camera
USB
Discrete
PCIe
Device
GbE
Discrete
PCIe
Device
PCI
E6XX
Target Segment
Customer with existing proprietary ASICs e.g. Print Imaging, PLC
Proprietary
ASIC
Processor
Core
Graphics
& Video
Display Controller
Memory Controller
Audio
SPI/LPC
FPGA
Target Segment
Segments with diverse I/O requirements e.g. Industrial Automation
PCI Express 4 x1
Various IO Hubs
Vs competition - TNC giving you flexibility and performance
TI & Nvidia -- have point parts that compete with us – but they can’t provide chips for a range of devices..
Performance density, sw investment protection (goodness of IA)
Interconnect Fabric
Other
Clocks/ Timing
I/F
Audio
PCIe x2
Power
Mgmt.
Storage
I/Fs
Video
HS Serial I/Fs
Power / VR
Low Spd Serial I/Fs
Network
Interfaces
Parallel I/F
Accel.
I/O Hub
(IOH)
Target Segment
High volume segments with uniform I/O e.g. IVI, Media Phone, Premise Service Gateway

11. Intel® Atom™ E6XX-based Platform for General Embedded Purposes
Additional Third-party IOHs for specific segment needs:
OKI Semiconductor
ML7213 primarily for IVI
ML7223 for telecom terminals, e.g. media phones
STMicroelectronics
ConneXt STA2X11 for IVI
Reaktek
RTL8954C for CSGs & medical
Third-party PMIC / CLKGEN helps to simplify designs:
Dialog Semiconductor
DA6011 (1 chip)
ROHM Co., Ltd
BD9590MWV & BU7335MWV (2 chips)
OKI Semiconductor (See ROHM blurb below)
STMicroelectronics - unveiled details of its IOH specifically designed to work with Atom E6XX in high-end automotive IVI systems. This platform meets this key condition by simplifying the system design, enabling the use of open, off-the shelf software, and reducing development costs and time-to-market.
Realtek IOH takes advantage of the open PCI Express standard for processor to chipset interfaces by providing a customized Communication oriented solution, leveraging the advantages of Atom E6XX in Application and Media processing while complementing Atom E6XX with potential of offloading Layer 3 packet forwarding to the IOH. Combination of the Realtek IOH and the Atom E6XX will mean a new dimension for residential gateway solutions where a single box solution for both Media and Network centric applications is now possible. Also, combination of the Realtek IOH and the Atom E6XX will mean that new medical appliances will be scalable to include more features, such as real time audio and visual communications with patients at a remote site and high definition video and instant data delivery from the point of diagnostic to the point of care.
Dialog Semiconductor announces one of the industry’s first single-chip companion IC to optimize the power efficiency of embedded applications using Atom™ E6XX series
ROHM - ROHM, along with its affiliated company, OKI Semiconductor, recently announced the launch of dedicated LSIs  designed to support Atom™ E6XX series. This chipset consists of a power management LSI (PMIC), a clock generator LSI (CGIC), and a platform controller hub LSI (PCH). A reference board which contributes to the reduction of customer’s development is also available

12. Intel® Atom™ Processor E6xx Series Graphics/Video Overview
Intel® Atom™ Processor E6xx Series uses the same low-power graphics core as Intel® System Controller Hub US15W
2x Target 400 MHz
Intel Atom Processor E6xx Series uses the same video decode core as Intel System Controller Hub US15W
Freq is 267 MHz, permits HD/SD
Added Video Encode core for Intel® Atom™ processor E640, E640T, E660, E660T, E680, E680T
Freq is 267 MHz, permits 720P 30fps, H.264 BP and MPEG-4 encode
Intel® Embedded Media and Graphics Driver (Intel® EMGD)
New Embedded graphics driver created by Intel with a new architecture
Only for customer platforms based on the newest next generation Intel® Atom™ processor for embedded applications – Intel Atom processor E6xx series and as Intel System Controller Hub US15W/WP/WPT embedded chipsets
7-year longevity cycle
DDR2
Memory
Intel® Atom™ Processor E6xx Series
Graphics
DDR2
Video Decoder
Video Encoder
512K
L2 cache
Display
CPU core
LVDS
cDVO
Tunnel Creek was the code name of the E6xx series chipset which is a low-power SoC for embedded device in-vehicle infotainment (IVI), media phones, etc.
It is a combination of Lincroft + audio + PCIe + legacy I/O. It is marketed as one of the Intel® Atom™ processors, optimized for embedded use.
It is manufactured on 45 nm technology P1266 technology.
Key points:
- 2X clock frequency on higher end SKUs than US15w 400 vs 200MHz
Adds video encoder (720p 30fps for H.264 Base Profile and MPEG-4 Main profile)
EMGD is the new EMBEDDED focused graphics driver architecture for E6xx and US15w
LVDS
Display
SDVO
*Other names and brands may be claimed as the property of others. 12

13. Break Away with Intel® Atom™ Processors: Chapters 4 & 7
Video and Graphic feature
Intel® Atom™ Processor E6xx Series Provides:
Ultra Low Power Integrated 3D Graphics Core
Full HD HW Video Encode/Decode Engine, support in dedicated hardware H.264, MPEG1/2/4, VC1/WMV9 High Definition decode.
Offloads one of the most demanding tasks off of Intel Atom processor core.
Intel recommends developers to choose a media player that takes advantage of H/W accelerated video decode
Break Away with Intel® Atom™ Processors: Chapters 4 & 7

14. Intel® Atom™ Processor Based Platform Graphics Features
Benefit
Hardware-Based Video Acceleration
Supports full hardware acceleration of the following video compression standards:
H.264 Baseline profile L3, Main profile L4.1, High profile L4.1
MPEG2 Main profile high level
MPEG4 Simple profile L3, Advanced simple profile L5
VC1 all profiles up to L3
WMV9 Simple profile Medium level
WMV9 Main profile High level
Eliminates the need for SW codecs, thus offloading the CPU
Support for 32 bit floating point operations
High image quality
UMA Memory architecture
Reduced board space and cost
Display Support
Dual Display Pipe with rotation support
LVDS + SDVO for display output
Supports Extended Desktop or Clone Mode
Robust display controller offers flexibility
Based on Intel® Atom™ processor and the Intel® System Controller Hub
Break Away with Intel® Atom™ Processors: Chapters 4, 5, 7

15. Intel® Atom™ Processor E6XX Series Graphics Accelerator
Deferred Pixel Shading
Key Features
Flexible Programmable Architecture
Shader based technology
3D Graphics
2D and advanced 2D Graphics
Video decode support
Image processing
Deferred Pixel Shading
High Performance
Low Power
Industry standard tool support
Comprehensive OS/API support
All 3 Surfaces Filled
Only Visible Surface Filled
Deferred Pixel Shading
Conventional 3D
Intel® Atom™ Processor E6xx Series

16. Tiling Benefits - Highest Image Quality
Internal True Color Processing-32bit Floating points
The Intel® Atom™ processor E6xx series graphics core uses its on-chip tile buffer to process pixels at arbitrary pixel precisions up to 32 floating point even though the external frame buffer can be as low as 16-bit
Blending using 16bpp Distinct visible artefacts
Blending using 32bpp Internal True Color More accurate visual results

17. Break Away with Intel® Atom™ Processors: Chapter 2 & 5
LVDS
Differential interface used for local flat panels
Supports 18-bit or 24-bit color is supported
Max pixel clock of 80MHz
Panel timings must be supported by vBIOS
EMGD tool exists to modify timings if not already supported by default vBIOS
Break Away with Intel® Atom™ Processors: Chapter 2 & 5 17

18. Break Away with Intel® Atom™ Processors: Chapter 2 & 5
SDVO
Single SDVO channel
Use for any external display
HDMI/DVI, Analog TV, VGA/CRT, LVDS
Up to 160 MHz pixel clock supported
Equates to 85Hz
Interface can physically go faster
Includes (reduced blanking)
Break Away with Intel® Atom™ Processors: Chapter 2 & 5 18

19. TDP should be used for Thermal Design
What is TDP
TDP - Thermal Design Power
Simply stated, “TDP is Intel’s Recommended design point for thermal solution power dissipation”
This specification is intended to aid system designers in adequately developing cooling thermal solutions at a component and system level
TDP is NOT an exact estimation of a system’s power delivery requirements NOR is it an accurate prediction of the actual power that will be consumed by a customer’s application
TDP should be used for Thermal Design
Intel TDP offers an optimal end-user power design point without unwarranted conservatism while accounting for a full range of possible end user applications