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UCSB Hybrid Bonding & Testing

Published byCaroline Hill Modified over 5 years ago

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Presentation on theme: "UCSB Hybrid Bonding & Testing"— Presentation transcript:

1 UCSB Hybrid Bonding & Testing
On behalf of the UCSB bonding and testing group April 2004

2 Hybrid Bonding & Testing Personnel
Wirer Bonding Technicians: Julie Stoner Kirsten Affolder Hybrid Testers: Lance Simms Derek Barge Andrea Allen These are the key people in hybrid bonding and testing. They also are involved to greater and lesser degrees in other areas of module production.

3 Wirebonding Equipment
K&S 8090 wirebonder K&S 8060 wirebonder NEW!! Dedicated to hybrid bonding at UCSB Almost Fully Commissioned 4 of 6 bonding programs written Stereo TOB and Stereo TEC missing Dage 3000 pulltester

4 Hybrid Bonding Times Pure bonding time for a hybrid < 4min
Additional time (set up, database entry, pull testing): ~ 8min for a hybrid Bonding time for ~500 hybrids during production: 8.0 hours for 28 hybrids (one technician on K&S 8060 or 8090) This is above the expected rate per day at full production. Total processing time can be reduced by using a support technician

5 Bond Quality CMS wirebonding spec: pull strength > 6g
Extensive pull testing was done to determine a set of standard bonding parameters for each bonding surface We pull test 10 bonds on a test area on each PA Average pull strength: 10.0 g, std. Deviation: 0.6g

6 Hybrid Test Results 505 hybrids bonded and tested so far
30 TEC R6 2 TEC R5 phi 5 TOB Stereo 159 TOB 6 chip 309 TOB 4 chip phi Bad channels (opens) introduced during bonding: 0.022% Majority of these were bonds lifting off AL strip of PA Overall bonding quality has been excellent. Total failure rate of 3.4% 4 (0.8%) Broken Hybrids 2 broken ceramics 1 smashed set of wirebonds during repairs 1 smashed wirebonds on arrival 7 (1.4%) (PLL Failure) Should be usable. Still need software to force initialization in cold. 6 (1.2%) have more than 4 AL pad lift offs Bond parameters found to lower rate of problem, but may be PA batch dependent Picture of AL lift off

7 Hybrid Database Usage Bonding Testing
Standard bonding database interface used Number of missing bonds and pull strengths (if applicable) entered Testing Test automatically generates and uploads xml file Pedestal, noise, bad channel list (opens, shorts noisy), and environmental variables inserted into database Data used to determine expected faults in module testing

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