2. Design for Excellence (DFX)
Driving Product Optimization Through Early Stage Supplier Engagement
Brian Morrison, B.A.Sc., P. Eng.
Director, Value Engineering & Technology
Sept 21, 2016

3. SMTC Corporation Our Vision Our Values Established in 1985
Over 600,000 square feet of manufacturing capability
Facilities that covers a large global footprint
More than 40 manufacturing and assembly lines
Approximately 1,300 employees
Listed on NASDAQ since 2000 (SMTX)
Frost & Sullivan Awards Winners – Growth Leadership, Product Quality Leadership and Customer Value Leadership Awards
Our Vision
To simplify the lives of our customers by delivering extraordinary Customer Service, Responsiveness, Quality, Technology Solutions and Value, fueling their Success and Our growth
Our Values
Solution Oriented
Collaborative Partner
Professional integrity
Proactive
Innovative
Dependable
With over 25 years in the industry, our global vision to simplify the lives of our customers through quality and technological solutions allows our customers to fuel their success and growth. We provide solution oriented, innovative solutions as a collaborative partner to our customers. Our end to end solutions from early supplier engagement through to production can provide our customers with lower risk, higher margin and high quality products.

4. Medical Device Markets
Specialists in the Design and Manufacture of Complex Class I and II Medical Devices
We design and manufacture class I and II medical devices that require a mix of highly specialized technologies including:
Diagnostic devices
Imaging equipment
laboratory equipment
Patient Monitoring systems
Infusion Pumps
Dispensing Systems
Consumer Wellness Products.
Home Dialysis Systems

5. Agenda Typical Product Development What is DFX? (Why is it important?)
What is Value? (What is the trade off?)
Targeting Value
Ability to Impact Value
Early Supplier Involvement (ESI)
DFX Benefits through ESI
Best Practice
Design Review
How and When to Engage?
Architecture
Impact of Architecture Design Decisions
Design for Reliability
Design for Supply Chain
High Level Design
Impact of High Level Design Decisions
Design for Testability (DFT)
Physical Design
Impact of Physical Design Decisions
Design for Assembly (DFA)
Cost Analysis
Design for Fabrication (DFF)
Design for Testability (DFT)
Prototype
Mechanical Design
Design for Manufacturing (DFM)
Validation
Design for Reliability (DFR)
New Product Introduction
FMEA and Control Plan
Volume Production
Successful Ramp
PPAP
We will be discussing how DfX can identify and address risk throughout the entire Product Design Cycle from start to finish and how to best to engage and utilize your suppliers to support your design review process to provide the biggest impact on product value.

6. Typical Product Development
Requirements
Feasibility
Design Input/Specification
Design Phase
Verification/ Validation
Certification
What does the product need to do?
Can the technology support the need? Gaps, Risk, Unknowns.
What will the product be able to do?
What will the product look like, how will it function, how much will it cost?
Does the product perform as expected?
Does the product meet the regulatory requirements?
Review
Review
Review
Review
Review
A Typical Product will undergo the following phases; Requirements – What does the product need to do?, Feasibility – Is their technologies available to meet the product needs?, Design Specification – What will the product be able to do?, Design – What will the product look like, how will it function, how much will it cost?, Verification/validation – Does the product perform as expected?, Certification – Does the product meet regulatory requirements?
Constraints/ Issues = Time/Money

7. What is DfX?
DFX or Design for eXcellence is the application of Rules, Guidelines and Methodologies during the Product Development with the purpose of impacting it’s Value while meeting the Product Design Requirements.
What components should I use?
What is the life expectancy of the product?
What manufacturing methods should I utilize?
Is my design manufacturable?
How easy or hard is it to assemble?
How do I test my design?
What is my product strategy?
What is DfX exactly? What areas can DfX be applied? Application ranges from materials, fabrication, assembly, manufacturing, test and so on. Rules, guidelines and methodologies to ensure a product value is maximized can be applied to a multitude of aspects. We will be reviewing the most common DfX methodology for electronics.

8. Value PERFORMANCE COST What is Value? Function Lifetime Quality
Features
Reliability
Lifetime
Function
Performance can be a function, need, feature or aspect that is deemed critical to the product design.
Cost can include material, labor, test, logistics or any other aspect required to provide the required performance.
PERFORMANCE
Components
Design
Labor
Testing
PCB
COST
Value
Product Requirements can typically be assigned as either defining performance or cost. It is relationship between performance and cost which defines the overall product value. The secret to a high value product is to maximize the performance aspect while minimizing the associated cost.

9. Targeting Value Component Quality Manufacturing Testing
The x in Dfx represents an aspect of the product value to be targeted; these may include (but not limited to)
Components - Design for Supply Chain (DFSC)
Process of ensuring material sourcing, supply, compliancy and lifecycle requirements are met during design stage.
Components - Design for Reliability (DFR)
Process for ensuring reliability of a product or system during the design stage before physical prototype
Quality - Design for Fabrication (DFF)
Process of ensuring the manufacturability of the PCB fabrication design and related cost drivers are met.
Quality - Design for Assembly (DFA)
Process of ensuring the assembly of the PCB design and physical layout rules are met prior to prototype
Manufacturing - Design for Manufacturability (DFM)
Process of ensuring the manufacturability of a component or complete assembly to met supplier’s capability.
Testing- Design for Test (DFT)
Process of analyzing test access, coverage and schematics are designed for test
Component
Quality
Manufacturing
Testing
What is DfX exactly? What areas can DfX be applied? Application ranges from materials, fabrication, assembly, manufacturing, test and so on. Rules, guidelines and methodologies to ensure a product value is maximized can be applied to a multitude of aspects. We will be reviewing the most common DfX methodology for electronics.

10. Ability to Impact Value
80% of Product’s Recurring Cost Established
ABILITY TO IMPACT
TIMELINE
TYPICAL PRODUCT DEVELOPMENT CYCLE
Architecture
High Level Design
Physical Design
Prototype
Validation
NPI
Volume
Component selection – Major (e.g. Processor)
Hardware / Software partitioning
Schematic Design
ASIC/FPGA Design
Component Selection
PCB Layout
DFM
DFT
Component Selection (e.g. passives)
Quick Turn Prototype
Early DFM/DFT Feedback
Device level testing
System integration testing
EMC testing
Agency submissions
Supply chain tweaking
Continuous process improvement
COSTED ACTIVITIES
DFR – Design For Reliability
DFSC – Design For Supply Chain
DFX ENGAGEMENT
DFT – Design For Test
DFA – Design for Assembly
DFF – Design for Fabrication
DFA – Design for Assembly
DFM – Design for Manufacturability
During the product development cycle, 80% of an electronic products recurring costs are established during the first 15% of the design cycle and cannot be significantly impacted later. Early DFx engagement and supplier involvement at key design phases and through NPI can significantly improve the overall products value. 2 10 10

11. Early Supplier Involvement
Early design interface and collaboration among designers, buyers, and suppliers incorporating DfX throughout the product development cycle significant improves the ability to impact to the design.
Identifying risks early enable customers to better manage their design
Resulting overall lower project costs and higher VALUE Products
DfX
Early Supplier Involvement as part of an integrated con-current product design offers fewer redesign iterations, improved component selection, improved quality and manufacturability and lower cost. Through engaging early in the design potential risks are identified when it is still possible to impact the design. Better management of risk results in a product that is higher value across the entire product lifetime. To learn more on the advantages of integrating DfX and early supplier engagement into your design process, please visit or connect one-on-one with a technical expert though

12. DFX Benefits through ESI
Material Impact
Reduced lead time, improved availability/lifecycle and material costs (DFSC)
High quality, reliable and robust performance for the life of the product (DFR)
Manufacturing Impact
Improved PCB yield, performance and cost (DFF)
Improved Assembly yield and reduced labour content (DFA)
Reduced opportunities for error and field failures (DFM)
Testing Impact
Improved Coverage, Reliability and Final yield, reduced RMA and field failures.  (DFT, DFR)
Reduced development engineering resource commitment, improved time to market (DFT)
Quality Impact
Improved Production Stability and Predictability (DFM)
First Pass Yield and Capacity
Continuous Improvement (DFM)
DFx performed early in the Product Design Cycle can be an effective tool to impact to drive value into the product. Engaging suppliers in appropriate design reviews can provide valuable insight into potential problems before they happen. Benefits include increasing overall performance and lowering total cost providing the highest value to your customers and should be considered Best Practice.

13. Best Practice Lack of Collaboration and Review of Requirements
Common Product Development Mistakes
Lack of Collaboration and Review of Requirements
Poor understanding of supplier capabilities/ limitations
Customer expectations (reliability, lifetime, use environment) are not incorporated into the new product development
Best Practice
Early supplier involvement in the product design cycle can provide customers with a product that is more cost effective, increased manufacturability and quality, has higher reliability and longer overall lifecycle.
Design reviews at key stages throughout the design cycle provides critical feedback to address potential issues to ensure a successful new product introduction and high quality, high yielding, reliable and manufacturable product.
Product Requirement
Architecture
High Level Design
Physical Layout
Prototype
Validation
Production
Commonly design decisions are made without the involvement of key stakeholder and can result in costly design decisions that are very difficult to change later in the product development cycle. Supplier involvement late in the design cycle limits the ability to impact, early supplier involvement can significantly improve the overall product development cycle and final product value.

14. Design Review
Design Reviews can happen at any stage of the product development and still provide value
The ability to impact is usually driven by the design phase where risk vs. benefit decisions must be made
The appropriate DFx tool will depend on the product requirements and what is deemed important to the overall product success.

15. Architecture Review What are the Key Activities?
High Level Design
Physical Design
Prototype
Validation
NPI
Volume
What are the Key Activities?
Selection of Critical Components
Defining Environment Requirements
Detailed Specifications
Hardware/ Software Requirements
Defining Key Functions/ Features
How can they be involved?
Design for Reliability (DFR)
Critical Component Selection
Desired Lifetime/ Environment
PCB Design Considerations
Design for Supply Chain (DFSC)
Predicted Lifecycle and Sourcing
Process Compatibility
Strategic Supplier Alignment
Who should be involved?
Design Engineer
Major Component Suppliers
Manufacturer
Supply Chain/ Procurement
Architecture is an important activity which defines the key performance attributes of your design, early supplier engagement to provide valuable input on predicted performance and reliability can make a significant impact to the overall product cost and associated risk.

16. Impact of Architecture Design Decisions
High Level Design
Physical Design
Prototype
Validation
NPI
Volume
Although very early in the design cycle, key component suppliers should be providing their component level dFMEA, reliability and design suitability input.
Reliability and Lifetime decisions made now will be very difficult to change later in the design cycle. A through design review should be made.
Sourcing and strategic alignment of the supply chain and a predicted EOL should be reviewed.
Specifying a custom single sourced processor slated to go EOL can limit component availability, time to market and potentially require a complete redesign.
Major component and requirements decisions essentially define the high level failure modes and critical attributes of the design. Scrutiny of those decisions using DfX can avoid costly mistakes over the lifetime of the product. Early product decline, poor performance, failure modes and committed risk decisions are all made here.

17. Design for Reliability
DFR is designed to identify design elements which for reasons of lifecycle, availability, process compatibility may impact the overall product requirements.
Is the Component Appropriate to support my Environment?
Sensitivity of the circuit to component performance
Number of components within the circuit
Output from FMEA (Failure Mode Effects Analysis)
Historical experience/ Industry data
Component technology
Tin Whiskers
Ceramic Capacitor (Cyclic Voltage)
Resistors (High Resistance - SIR)
Thick Film Resistors (Sulfide Corrosion)
Electrolytic Capacitors
Connectors
Wear Out – Memory, Relay/Switches/ LED
Is my components rated for long term reliability? What will my field failure rate be?
Temperature/ Humidity/ Electrical Load/ Vibration/ Mechanical Stress/ Shock/ Power Cycling
Is my component material selections appropriate for my design?
Surface Finish - OSP, ENIG, HASL, Immersion Silver
Stack up, Laminate (Tg/Td), Blind/Buried Vias, Microfill/ Plating
Land Pattern Design, Spacing, Voltage Bias
ICT Stress
DFR is designed to identify and provide guidelines based on historical known reliability data and physics of failures to provide insight on appropriate component selections, design decisions to ensure design decisions support the product requirements. A low cost processor may meet some aspects of the product requirements but may have a low reliability and result in a very high cost in the field. The optimal component is a trade off between cost and reliability while meeting the product need, applying DFR guidelines to critical components can have a significant impact to the total cost.

18. Design for Supply Chain (DFSC)
DFSC is designed to identify components which for reasons of lifecycle, availability, process compatibility or validity are a risk to the supply chain..
Is the BOM Clean?
Review AML data for completeness (orderable) and preferred supply.
Ensure MPN match with part description
Hazardous Substance Content
Manufacturing Process Compatibility
Is the BOM Stable?
Form-Fit-Function (FFF) replacement reviews
Predicted Lifecycle and YTEOL Forecasts
Change Notices and Counterfeit Alerts
Is my Supply Chain Optimized?
AML Expansion and Preferred supplier selection
Supply Chain Optimization
EOL and Alternate Qualification
Cost Reduction
DFSC is designed to look at the robust and sustainability of the supply chain to meet the product requirements. Leveraging sources of critical supply insight including industry trends, attributes, product information and predicted lifecycles to critical components can identify potential risk and issues in the supply chain before they are designed in.

19. BOM Health Check
What is the current supply chain risk and status of the product? A Health assessment identifies current risk.
Health Analysis
Provides an overall health of the BOM supply chain based on current and predicted lifecycle, available sources and compliancy.
AML
Total AML:
Total Active AML:
Risk:
Discontinued w/o Alts: 142
Discontinued with Alts: 498
EOL: 26
Single Sourced 1860
RoHS Non-Compliant 87
Calculated Health Score:
out of a possible 1000
A BOM Health Check can provide valuable information on the sustainability of the product and quickly identify risk associated with EOL/Discontinued components, single sourced components (supply chain risk) and regulatory and process issues early in the design cycle.

20. BOM Analysis Upcoming Product Risks Identified
Does my component selections introduce any future risks? Performing a BOM Analysis provides insight by predicting upcoming risk and opportunities to address single sourced, upcoming EOL/Discontinued, Non-compliant and address material cost drivers.
Upcoming Product Risks Identified
Discontinued AML: 498 w/ alt, 143 w/o alt.
EOL AML: 26
Non-compliant: 86
Single Sourced AML
Potential Actions
Evaluate FFF replacement recommendations or develop strategy to address Discontinued/EOL components.
Qualify RoHS equivalent orderable part numbers or provide alternates to address compliancy issues
Align strategic FFF AML Alternates to provide multiple sources to single sourced components.
Identify opportunities for cost reduction through FFF AML Alternate on existing AML.
Provide PCN support to proactively notify and address risk.
A BOM Analysis provides further insight into the predicted lifecycle of the BOM and alternate source availability to address these risks. Engaging component engineering and procurement resources, most risk areas which can be proactively addressed through value add activities and critical components risk can be quickly evaluated to validate design decisions.

21. DFSC Value
AML Expansion
Project A
Scope of the Project
Targeting cost reduction, 40 parts were identified as FFF alternates to existing approved AML with a potential for 20% reduction in material costs.
Cost avoidance of $38K was identified through alternate sourcing due to obsolesce
Value Engineering Services Implemented
Cost Savings
Component Engineering
$126K
AML Expansion
Project B
Scope of the Project
Target cost reduction and in-plant store VMI for Power Supply for a potential 8% reduction in cost. Full functional part evaluation in system and test reports provided to support qualification
Value Engineering Services Implemented
Cost Savings
Component Engineering
$87K
Early supplier engagement at the architecture design phase provided customers with the insight to identify early product obsolesce and avoid costly respin and project delays. Through strategic alignment of the supply chain and leveraging our component engineering resource we were able to both address product risk, improve the overall product supply chain and provide increased value through cost reduction.

22. High Level Design What are the Key Activities?
Architecture
High Level Design
Physical Design
Prototype
Validation
NPI
Volume
What are the Key Activities?
Schematic Design
ASIC/ FBGA Design
Cont’d Component Selection
Hardware/ Software Requirements
Defining Key Functions/ Features
Test and Performance Definition
How can they be involved?
Design for Testability
Schematic Review
Test Strategy Review
Design for Supply Chain (DFSC)
Predicted Lifecycle and Sourcing
Process Compatibility
Strategic Supplier Alignment
Who should be involved?
Electrical Engineers
Supply Chain/ Procurement
Software Engineers
Test Development Partners
Manufacturer
Once the architecture and critical functions are defined, high level hardware schematic and software requirements can be defined and further component selection decisions made. Test access and design for test considerations are critical to ensure the appropriate access and considerations for JTAG, Boundary Scan and appropriate design rules are applied to ensure product validation and risk is minimized.

23. Impact of High Level Design Decisions
Architecture
High Level Design
Physical Design
Prototype
Validation
NPI
Volume
Firm component selections and peripherals are selected at this point and similarly a supply chain risk assessment should be performed
Commonly manufacturers will have preferred suppliers and in some cases non-preferred suppliers based on historical experience.
Detailed schematics are usually available or in development and ensuring appropriate design for test considerations (JTAG, boundary scan, etc.) and test strategy assessments should be considered.
How can they be involved?
Design for Testability
Schematic Review
Test Strategy Review
Design for Supply Chain (DFSC)
Predicted Lifecycle and Sourcing
Process Compatibility
Strategic Supplier Alignment
Once the architecture and critical functions are defined, high level hardware schematic and software requirements can be defined and further component selection decisions made. Test access and design for test considerations are critical to ensure the appropriate access and considerations for JTAG, Boundary Scan and appropriate design rules are applied to ensure product validation and risk is minimized.

24. Design for Testability (DFT)
Is my product testable?
Design can be reviewed at the schematic level to identify electrical characteristics of the design that may have a negative impact on in-circuit test coverage or cost.
Have I made included the appropriate test design rules?
Design rule and guidelines checks applied through advanced schematic modelling software can identify costly design errors at high level design.
What will current test strategy cost?
Advanced reporting provide comprehensive reports that highlight estimated production yield, test coverage by component, cycle times and validate early dFMEA assumptions.
Is there an opportunity to optimize my test strategy?
Adjustments to the schematic at this high level design to address access and design considerations including JTAG, Boundary Scan and related requirements can significantly reduce the overall cost and complexity of the test strategy.
Concurrent engineering is possible at the schematic level prior to physical layout through schematic capture software and model definitions, design check rules and simulation tools. Fault detection, DFT violations and test access requirement provides valuable early coverage analysis allowing designers to modify the design to maximize access and coverage including incorporating more advanced test methods such as JTAG, boundary scan to lower overall product validation costs.

25. Physical Design What are the Key Activities? How can they be involved?
Architecture
High Level Design
Physical Design
Prototype
Validation
NPI
Volume
What are the Key Activities?
PCB Layout and Routing
PCB Stackup and Fabrication
Final Component Selection
Passives
Hardware
Design File Generation (Gerber, Fab, Placement)
How can they be involved?
Design for Assembly (DFA)
Physical Layout
Assembly and Manufacturer
Design for Fabrication (DFF)
Stack up and Impedance
PCB Fabrication Design Rules
Design for Testability (DFT)
Nodal Analysis
Test Strategy Development
Who should be involved?
PCB Designers
Manufacturers
PCB Fabrication
Test Development Partners
The majority of the design is now fixed and decisions made at this phase will define the majority of assembly, PCB and test strategy requirements. This is a critical design phase and commonly suppliers are engaged too late after the final routing and PCB is complete. Performing early supplier design reviews of the layout, stackup and net access can have a significant impact on the assembly cost of the product.

26. Impact of Physical Design Decisions
A common mistake is to involve your suppliers too late in the process, decisions make here can cause additional respin requirements and cost.
Too late to impact change
Target
Engagement
Typical Engagement
When is the optimal engagement during PCB design? Engaging the supplier after the final routing is complete and the PCB is ready for release is a common practice and typically issues identified at this stage cannot be addressed without significant impact to project schedules and/or drive additional re-spins and cost. The target engagement is just after initial placement where suppliers can provide input on placement, routing, land pattern which can be addressed con-currently with layout activities.

27. Design for Assembly (DFA)
Design for Assembly targets opportunities in the physical layout of the assembly to identify areas for improvement and potential areas of concern to drive assembly cost out early in the design cycle.
Is my design appropriate for assembly? for the component?
Rules and Guidelines are based on your manufacturers capabilities and component requirements.
Is my layout appropriate to support my quality requirements?
Design rules must be configured for your product requirements. i.e. Class 2 or 3, Reliability (Safety critical)
Have the appropriate design rules been implemented?
Advanced software and combined with years of assembly experience DFA checks can be performed to provide results on;
Component Analysis
Pad stack Analysis
Pin to Pad Analysis
Test Point Analysis
Solder Paste Analysis
Design for Assembly can provide valuable and comprehensive feedback on component placement, land pattern design, routing clearances, test point design/placement, stack up and assembly issues. Advanced software are capable of performing hundreds of design rule checks very quickly by simulating a virtual prototype using component representations and IPC design rules. Reviewing your design requirements with your supplier is critical to ensure the appropriate design rules are applied during this review.

28. Design Assessment
Tools such as Valor vNPI and Trilogy combined with supplier design rules and capabilities can provide designers will a complete and comprehensive risk assessment of their design
Collaborating with the manufacturer is critical during this phase and a common mistake is to simply rely on the DRC (Design Rule Checks) into their native design tool during design. Criticality of design violations must be reviewed based on risk and requires the expertise of your manufacturer to assess the risk and impact for your design. The supplier is the manufacturing expert and are in the best position to provide this type of feedback.
Example DFA Output outlining Critical (Major), Hot (Yield improvement), Warm (Minor), Cool (No immediate concern) and Ignore (acceptable)

29. Cost Analysis
Design for Assembly Reports are an important tool to provide insight into possible Product failures but do I need to fix them all? How do I know which correction drives the highest value for my product?
Utilizing Six Sigma, estimated annualized cost avoidances can be assign to prioritize design change decisions.
Quality and Reliability Concern.
2 OFE, 130 Locations – 260 Opportunities
Probability of Occurrence 50%
Expected Yield Detractor 2.5%
Rework Cost $2.80
Potential Failure Cost $4,021.01
Ref Des U37, U38, distance between pad too close (0.0059”). Prone to solder bridge. Recommend decreasing pad from mil to 11 mils.
Quality and Reliability Concern.
28 OFE, 14 Location – 392 Opportunities
Probability of Occurrence 40%
Expected Yield Detractor 0.72%
Rework Cost $0.42
Potential Failure Cost $727.50
Ref R1050, C239, RN96, FB2, etc., masked trace between toe print is too thin, may break and cause insufficient solder. Minimum recommended clearance between exposed via and toeprint is 5mil.
Ref Des U48, U103, land pattern is not optimal, heel distance is too big. Too much heel may cause solder bridge under component, not visible to visual inspection. Recommended to decrease by 25 mil on heel side.
Quality and Reliability Concern.
50 OFE, 2 Location – 100 Opportunities
Probability of Occurrence 50%
Expected Yield Detractor 0.23%
Rework Cost $0.70
Potential Failure Cost $386.63
Design changes are always a trade-off and cost, reliability and criticality to assembly must be taken into account to prioritize which design changes are a must have an which design violations represent an acceptable risk to the product requirements. Utilizing Six Sigma and prediction of opportunities for error/ DPMO yield calculations it is possible to estimate yield impact, rework costs and potential product failure impact.

30. Design for Fabrication (DFF)
DFF is intended to identify opportunities to address PCB manufacturability, material, and stackup that can drive out cost, improve fabrication yields and risk.
What stackup do I need for my impedance requirements?
Reviews typically include determining workable stackups, including impedance trace width.
Is my PCB features within the capability of my fab house?
Most supplier utilize automated DFX tools such as Valor to apply their internal Design Rule Checks (DRC) and will provide comprehensive DFM reports for Design Reviews.
Design for Fabrication looks at the other aspect of the PCB and is focused on manufacturability requirements based on the PCB fabricators requirements and capabilities. Ensuring the PCB design is appropriately matched to the PCB fabricators capabilities is critical to success. Laminate selection, minimum feature, surface finish availability, etc. will vary from supplier to supplier.

31. Design for Fabrication (DFF)
What spacing, drill size, soldermask clearance should I be using?
Suppliers will typically provide their DFM guidelines upon request.
Incorporating these rules into your native Design Package can help drive value further up the Product Development Cycle.
Early supplier engagement with the PCB supplier to align DFM limitations and capabilities with your product requirements can help avoid potential delays related to design mismatches on capabilities, design changes or worst case alternate supplier selection. Understanding and integrating design requirements from your suppliers into your design rules can help expedite design release.

32. Fabrication Panel Design
Panel Design is left to my fab house, I haven’t had an issue before?
Panel Design is a Primary Cost Driver for PCB based on master panel utilization
Pushing ownership to the fabricator or manufacturer will have it’s PROS and CONS.
It is important that both the fabricator AND the manufacturer needs are taken into consideration and collaborative ownership of panel design should be carefully considered.
Typically manufacturers will require the PCB to be supplied in panel form to accommodate equipment requirements, ease of handling and throughput. It is common practice for designer to provide the PCB as 1 up and rely on the fabricator or the manufacturer to design the panel, however the interests of each party will be different and in a lot of cases do not align. Panel design has a direct impact on material costs and assembly costs, it is important that the panel designer has both parties interests in mind.

33. DFF Value
PCB Cost
Project A
Scope of the Project
Optimized panel design to meet automated equipment requirements based on EAU increased the master panel utilization from 52% to 72% yielding 20% more panels than the existing design and providing high throughput and lower cost per unit.
Value Engineering Services Implemented
Cost Savings
PCB Panel Design
$20K
PCB Material Specification
Project B
Scope of the Project
Relax Tg constraints for 10 layer board and realize savings by switch from S (Tg 170) to IT158 (Tg 150) with existing supplier
Value Engineering Services Implemented
Cost Savings
Design for Fabrication
$34K
Early supplier engagement helped to align both the design and the material specification to the product requirements. Through panel optimization, the unit cost was addressed while lowering the piece price by optimizing throughput on capital equipment. Aligning the technology and stack up of the board with appropriate laminate selection resulted in further cost reductions without impacting quality providing high value for our customers.

34. Design for Testability (DFT)
Do I have the necessary access to support my coverage needs?
Routing provides the first physical view of the PCB and actual test points, size and location for access.
Are my test points appropriate for my test strategy?
Properly sized test pads for probe access can be analyzed by assigning test point and generating nail rules and keep outs to the design
What is my product coverage? What is not tested? Is my test plan still valid?
Component level coverage for Placement, Functionality, Solderability and Value are provided. Addressing test gaps now can significantly simplify the test strategy, cost and complexity.
Completion of the physical layout provides the manufacturer and test developer the first opportunity to evaluate test point placement and access. A full DFT and nodal analysis provides detailed net access, test point location/design and placement required to revise simulated test coverage with actual. Coverage risks due to access, test point placement/ location and parallel components/ value masking issues are addressed.

35. Test Strategy Overview
What Test Strategies are available for my product?
Electrical Testing (Value/Polarity) Cost: $$ Coverage: Medium
Does the component the right value? Are there shorts?
Typically involve opens, shorts, impedance and net verification. Powered tests are available to provide some additional coverage options.
Strategies include Manufacturing Defect Analyzer (MDA) Flying Probe,
Structural Testing (Placement/Polarity) Cost: $ Coverage: Low-Medium
Is my component there? Is it soldered?
Typically detects presence, absence, orientation/polarity and solder joint integrity.
Strategies include Visual Inspection, X-Ray (2D or 3D) and Automated Optical Inspection (AOI)
Functional Testing (Functionality) Cost: $$$ Coverage: High
Does my product function as expected? Am I getting the right output?
Typically involve expected input and output simulation of the end application and exercising of core circuitry to validate final functionality
Strategies include In-Circuit Test (ICT) and Functional Test (FT)
Reliability Testing (Validation)
Is my product reliable?
Typically involve cycling power / temperature over a statistically determined period to identify pre-mature electrical or structural failure that may effect long term reliability
Strategies include Run-in, Burn-in and Environmental Stress Screening (ESS)
Selecting an appropriate test strategy based on the design to provide the best combination of coverage and cost can be complex problem given the various test options available. Coverage can be categorized into 4 primary areas; electrical (is it the right value and polarity? Typically involving in-circuit or flying probe tests), structural (is it soldered, placed, correct? Typically involving AOI or AXI), Functional (is the product providing the expected output? Typically involving more advanced custom functional), Reliability (is the product robust? Typically involving Run-in, Burn-in or stress screening). Selecting the right combination of electrical, structural, functional and reliability test can provide high coverage and lower cost.

36. Test Strategy Analysis
What yield can I expect based on my test strategy?
Test Strategy Analysis provides an overview of current coverage proposed test strategy, expected yield assumptions, coverage gaps and expected RMA.
Does my test strategy make sense for my volumes?
Generate Return on Investment based on EAU and lifecycle to design/optimize Test Plan.
DFT test coverage reports based on physical layout or actual coverage reports from existing test platforms can then be inputted to identify remaining coverage gaps which can serve as an input to develop functional test development requirements. Sufficient design information is available to finalize test strategy and equipment requirements, finding the optimal and most cost effective test strategy for your product to minimize cost and optimize coverage is critical. Understanding what test strategies are available and their capabilities and limitations is important to minimize product risk and optimize cost.

37. DFT Value
Test Strategy Recommendation
Project A
Scope of the Project
Review existing test strategy and coverage to determine optimal test strategy to provide highest first pass yield, lowest coverage gaps, RMA and overall cost of quality.
Value Engineering Services Implemented
Potential Savings
Design for Test– Recommend AOI and ICT (FCT only required if full analog frequency testing required) over existing AOI and 5DX testing (no electrical). Reduce coverage gaps from 0.24% to 0.04% and expected RMA from 11.38% to 3.94%. ROI 0.20 years.
ICT Development – Quote includes all aspects of ICT development, including future maintenance and production support.
$89K - $18K = $61K
Early supplier engagement can help customers help identify design coverage constraints, develop the optimal test combination to provide the highest coverage and lowest product risk. Commonly designers can over specify test requirements resulting in redundant coverage over a number of different tests, by applying DFX test redundancy can be identified and alternate test methods or enhancement of existing test strategies can reduce the overall test costs and at the same time improve coverage.

38. Prototype Critical Component Suppliers Manufacturer Test Engineering
Architecture
High Level Design
Physical Design
Prototype
Validation
NPI
Volume
What are the Key Activities?
Quick Turn Prototyping
Distribution Procurement
Local Suppliers (may or may not be same suppliers as production)
Usually structural and/or fixtureless electrical testing
Proof of Concept or early Alpha/Beta builds
Initial FMEA and Control Plan Development
How can they be involved?
Who should be involved?
Design for Manufacturability (DFM)
Equipment Requirements
Tooling Considerations
Process Considerations
Labor Requirements
Critical Component Suppliers
Manufacturer
Test Engineering
Quality
It is the moment of truth, the prototype provides the first opportunity to validate the design in a manufacturing environment. Despite your best efforts DFx requirements can vary from supplier to supplier and what may work for one supplier may not work for another. Ideally to minimize risk it is always best to select a supplier that can support both your prototype and production requirements. In cases where this is not possible, involving the proto house in a early DFM analysis can help to de-risk potential build issues.

39. Impact of Prototype Design Decisions
Architecture
High Level Design
Physical Design
Prototype
Validation
NPI
Volume
Selection of quick turn vendors and 3D print for mechanicals validation may be appropriate for proof of concept and early alpha builds but are typically not reflective of the final production assembly.
A common mistake is using early alpha builds for validation testing where failures related to the proto build supplier quality or material selection may not prove to be valid or drive incorrect decisions.
Selecting the right proto house can provide valuable feedback and uncover design errors that would have been otherwise difficult to detect.
Key design decisions on critical component sourcing can determine the quality of the product. Ideally sourcing with the intended production manufacturer can reduce risk and improve time to market
It is the moment of truth, the prototype provides the first opportunity to validate the design in a manufacturing environment. Despite your best efforts DFx requirements can vary from supplier to supplier and what may work for one supplier may not work for another. Ideally to minimize risk it is always best to select a supplier that can support both your prototype and production requirements. In cases where this is not possible, involving the proto house in a early DFM analysis can help to de-risk potential build issues.

40. Design for Manufacturing and Assembly
Is my product design optimized for cost?
Particular decisions around assembly, adhesive and processes can determine the end cost.
DFMA analysis focuses on each element of the design with simplification in mind with the aim to reduce the number of elements to the minimum number.
Minimize Operations
Minimize Weight
Simplify Assembly
Tooling Complexity
Reduced Tooling Costs
Reduced Labor Cost
Minimal Equipment Needs
Optimize Piece Price

41. Design for Manufacturing (DFM)
What are the manufacturing tolerances and impact on my assembly?
Different vendors will have different manufacturing tolerances, performing a stackup tolerance of your final assembly can identify critical dimensions and sources of variation. Ensure you understand both your proto and production house capabilities.
Managing variation through a well developed Control plans reduce scrap, rework and improve overall quality and cost.
First off validation of manufacturing tolerances and capabilities from key component suppliers (Metal, Plastic, PCB) to ensure they are in tolerance and their combined stack up meet the overall critical dimensions to ensure function of final unit. Control plans to address component variance is critical to limit potential failure modes at the final product level.

42. Validation What are the Key Activities? How can they be involved?
Architecture
High Level Design
Physical Design
Prototype
Validation
NPI
Volume
What are the Key Activities?
Functional Testing
Design Verification Testing (DVT)
Highly Accelerated Life Test (HALT)
Highly Accelerated Stress Screen (HASS)
Who should be involved?
How can they be involved?
Reliability Engineering
Test Engineering
Quality
Design for Reliability (DFR)
HASS/HALT Failure Mode Inputs
Design Validation can be an iterative process resulting in numerous design cycles to address product failures identified during this design phase. Alignment of product requirements and FMEA with validation requirements and reliability testing is critical. Defining appropriate target requirements, acceptance criteria and limits are critical to a successful validation plan. Setting needs beyond the product requirements can drive unnecessary design loops.

43. Impact of Validation Design Decisions
Architecture
High Level Design
Physical Design
Prototype
Validation
NPI
Volume
Validation testing should be performed on production representative products as much as possible for maximum value.
Component and assembly operating and maximum conditions must be well understood and align with the design requirements to ensure the test conditions are set appropriately.
Having a well established risk management plan include test coverage and gaps will help ensure failures are well understood and help drive proper root cause and corrective action.
Design Validation can be an iterative process resulting in numerous design cycles to address product failures identified during this design phase. Alignment of product requirements and FMEA with validation requirements and reliability testing is critical. Defining appropriate target requirements, acceptance criteria and limits are critical to a successful validation plan. Setting needs beyond the product requirements can drive unnecessary design loops.

44. Design for Reliability (DFR)
Does my product perform as expected? How do I ensure the product will be reliable in the intended environment?
A properly designed accelerated life test plan is intended to exercise the design within and outside their indeed specifications with the objective to test the limits of the design.
A poorly designed test plan can induce defects which are not reflective of the end use environment and drive unnecessary cost/design cycles.
Test Plans may include
Design Verification Test
Utilizes relatively low stresses and requires many cycles
Design Vibration, Drop and Impact
Design Highly Accelerated Life Test (HALT)
Purpose to determine the operating and destructive limits of a design.
Verify designs, component selections and manufacturing processes
Design Highly Accelerated Stress Screen (HASS)
Test methods specifically designed on finding defects in products
A traditional DFR “test-in reliability” approach is valuable to identify “weak links” provides closed loop validation in conjunction with DfX methodology to further improve value.
A traditional Design for Reliability approach is to “test-in reliability” by running the design through various accelerated stress tests to identify “weak links” or potential risks and develop control plans to either contain or design out the failures. DFR can provide valuable FMEA input and can be an effective product validation tool when designed appropriately. Testing a product beyond it’s expected lifetime or customer expectations can drive up costs and vice versa underestimating lifetime requirements can cause costly failures in the field.

45. New Product Introduction (NPI)
Architecture
High Level Design
Physical Design
Prototype
Validation
NPI
Volume
What are the Key Activities?
Final Design Release
Volume Production Supplier Awards
Critical Component and Control Plan in Place
Introduction of Production Tooling/Process
Master Validation Process Plan
IQ, OQ, PQ Development
How can they be involved?
Design for Manufacturability (DFM)
First Article Reports
Process Development (pFMEA)
Yield and Detractor Analysis
Problematic Design Improvements
Design for Testability (DFT)
Coverage Gap Strategy
Who should be involved?
Critical Component Suppliers
Manufacturers/ Procurement
Test Engineering
Quality
New Product Introduction is typically a very structured collaboration between the design owner and the manufacturer and its success is highly dependent on the effective transfer of knowledge, requirements and equipment. Introduction of new suppliers or changing of manufacturers can introduce significant risk and additional failure modes resulting in design release delays. Selecting a supplier that can provide end-to-end solutions from design to production can provide lower risk and more seamless NPI transition.

46. Impact of NPI Design Decisions
Architecture
High Level Design
Physical Design
Prototype
Validation
NPI
Volume
Effective transfer of knowledge between the design owner and manufacturer is key. Having a structured transfer plan will ensure success.
Selection of the right partner is critical to success and introduction of new suppliers introduces risk to the design.
Where possible supplier to supplier collaboration and alignment of DfX and manufacturing requirements can help identify gaps early in NPI.
NPI feedback and design review checkpoints can be an effective tool to address cost drivers during transfer.
New Product Introduction is typically a very structured collaboration between the design owner and the manufacturer and its success is highly dependent on the effective transfer of knowledge, requirements and equipment. Introduction of new suppliers or changing of manufacturers can introduce significant risk and additional failure modes resulting in design release delays. Selecting a supplier that can provide end-to-end solutions from design to production can provide lower risk and more seamless NPI transition.

47. Design for Manufacturing (DFM)
Focus areas should include…
Operation Steps and Cycle Time
Automation – Panel Design, Supply Compatibility
Tooling – Stencils, Pallets, Other
Process – SMD, Reflow, Wave, Mechanical
Misc. Process – Conformal Coating, Cabling, System Program Parts
Test Yield and Detractors
Quality – First Pass Yield, Top 5 detractors
Was there issues during the build?
A detailed post build report from your NPI provider provide invaluable insight into the manufacturability and assembly of your product.
First article reports as part of a good DfX program should be mandated across all suppliers where practical.
A structured DfX engagement with suppliers and understanding their individual product contribution and potential failure modes can provide a very comprehensive FMEA and low risk product launch. Mandating early supplier involvement/ input and a formal DfX review program provide the foundation of a complete and comprehensive FMEA development.

48. Volume Production What are the Key Activities?
Architecture
High Level Design
Physical Design
Prototype
Validation
NPI
Volume
What are the Key Activities?
Full Production Ramp/ Sustaining
Stable Process and Test
Duplication of existing Process/ Test Equipment (Capacity/ Throughput)
Continuous Improvement
Value Engineering
How can they be involved?
Design for Supply Chain (DFSC)
EOL and PCN Management
Cost Reduction
Design for Testability (DFT)
Test Improvements/ Reductions
Design for Manufacturing (DFM)
Process Improvements
Who should be involved?
Critical Component Suppliers
Manufacturers
Test Engineering
Process Engineering
Quality Engineering
As the product ramps into production, even small variations identified earlier in NPI process can quickly become problematic as the volumes ramp. Minimizing variation utilizing Lean Six Sigma tools can help identify and address production variation and drive down failures. Failures linked to design can serve to define new product requirements to further improve the design. Value Engineering can offer additional opportunities to extend product lifetime and further improvements.

49. Impact of Volume Production Decisions
What are the key DfX considerations to ensure a successful product ramp to volume?
1) Product Design for Manufacturability (DFM Gaps addressed)
Even small design related defects will be exaggerated at high volume and should be re-reviewed. Cost may quickly justify a design change at high volume that did not make sense at lower volumes
Focus on ability for full automation, minimal touchup/repair and repeatability of manufacturing.
2) Product Design for Testability (DFT Coverage Gaps addressed)
Re-visit the test strategy to ensure it still makes sense as the volumes ramp.
Test coverage needs to address both structural and electrical coverage and implemented early enough in the process to impact change to the process to correct (minimize offline liability). .

50. Impact of Volume Production Decisions
What key Attributes of a volume supplier should be reviewed?
3) Product/ Process Stability and Repeatability - Tooling
Manual processes, complexity of operations and special requirements add risk and instability to the manufacturing process.
Tooling, Training and error-proofing as part of a control plan should be proven to provide a robust process.
4) Capability - Equipment, Repair, Processes, Troubleshoot
Aspects of the design and technology must be a matched with capability of the receiving site. Special requirements increase the skill level of resources/equipment.
Aspects of the DFM and DFT can be used to address these areas to eliminate or minimize capability mismatches.
5) First Pass Yield and Capacity
Low yields or design related fallout will result in increased labor, offline and lower output effecting capacity.
Defects caught further in the process require higher skill and labor content to address, critical operations should must have controls to ensure a high yielding product.

51. Design for Manufacturing
Is the production stable and high yielding?
Production Part Approval Process (or PPAP) is commonly used to validate production readiness.
Critical components and processes should be targeted. Failures linked to design can serve as a valuable tool to ensure a robust and repeatable supply chain.
Lean Six sigma tools can provide the means to provide a structured continuous improvement program.
As the product ramps into production, even small variations identified earlier in NPI process can quickly become problematic as the volumes ramp. Minimizing variation utilizing Lean Six Sigma tools can help identify and address production variation and drive down failures. Failures linked to design can serve to define new product requirements to further improve the design. Value Engineering can offer additional opportunities to extend product lifetime and further improvements.

52. Product Lifecycle
How do I manage the product lifecycle? What are my options if my components go EOL?
Design for Supply Chain predictive report can provide an idea as to the “weakest link” in your supply chain and provide a years till end of life (YTEOL) based on component maturity at the time of the report, however this is an ever changing landscape.
Product Change Notices (PCN) from your supply chain can provide notification of an upcoming risk to your product lifecycle (usually restricted to the current source only).
BOM PCN subscription services can ensure all sources are managed and should be requested from your supplier when available.
To ensure a robust supply chain and ensure a robust product lifecycle it is recommended to have minimum 3 sources for any given part number.
Alternate qualification can help prolong product lifecycle, where this is not possible implementing last time buys to provide sufficient time to support a redesign should be considered.

53. Final Words
Product Development is a journey with constant trade offs between requirements and costs to provide a high value product.
DfX provides a powerful tool when used to minimize design decisions from impacting requirements.
Collaboration is key to understand capabilities and limitation of the supply chain.
Early Supplier involvement throughout the development cycle help identify risk and to manage it for maximum value.

54. SMTC Corporation
Thank you

55. Gilbarco DFX Engagement Case Study Examples
Design for Supply Chain (DFSC)
Perform BOM and Lifecycle Analysis to identify EOL and discontinued early in the procurement cycle.
Supported last time buy and provided FFF alternates to support design
Performed AML Expansion to provide cost savings and supply chain flexibility
Design for Assembly (DFA)
Performed Stack up Tolerance and Interference Analysis to identify manufacturing and assembly issues.
Performed Valor virtual part and DFM analysis of all printed circuit boards to identify assembly and design related issues.
Design for Manufacturability (DFM)
Incorporated early supplier involvement and DFM with key Metal, PCB and Plastic Suppliers
Established manufacturing tolerances and capabilities into tolerance and stack up to provide critical dimensions to ensure function of final unit.
Design for Testability
Performed Board and System level schematic review
Utilizing Test Expert performed Nodal access and Coverage Reporting
Provided Test Strategy Analysis and Functional Recommendation
Design and Development
Combined Solidworks models and perform Analysis
Re-layout flex cable to optimize via positions and decrease connector footprint
Re-layout sensor board to move traces and address shorting issues
Develop custom automated lens focusing and system level test fixture.
Gilbarco

56. Engineering Work Plan 5 days 2 days 2 days 7 days SMTC Customer
Initial Design
DFX Engagement
Final DFX Review
Build Release
Quick-turn Mfg.
Build Delivery
Design Services Engagement
Technology Review
BOM Scrub
Lifecycle/ Risk Assessment
Strategic Supplier Alignment
BOM Scrub
Lifecycle/ Risk Assessment
Pre-Design for Assembly Review
Pre-Design for Manufacturability Review
AML Expansion
Design for Fabrication
Design for Assembly Review
Design for Manufacturability Review
Schematic, Nodal, Test Strategy Analysis
NRE Ordered
Stencils | Fixtures
SMT, AOI, AXI and FP pre-programming
Process Profile Development and Finalize Programming
Invite Customer onsite
SMT Top Side/Bottom Side + AOI/X-ray (1-2 days)
Testing / Flying Probe, FQA (1-2days)
System Level Integration
Bring-Up or Test
Provide Post Build DFX within hours of completed shipment
Gerber Files Released
Pre-Placement
Routing
PCB Fabrication
PCBA Production
Post Build Report
5 days
2 days
2 days
LEAD TIME
7 days
CYCLE TIME
Design Phase
Requested Design Support
Product Definition
High-Level Design
Areas for Development
Cross-Checking DFX
Costed BOM RFQ
Prototype Phase
Preliminary Design
Limited Routing
Request for Pre-DFA
Request for Pre-DFM
Prototype Phase
Final routed design
Pre-DFA/DFM findings reviewed/implemented
Request for DFF
Request for DFA
Request for DFT/FEA
Prototype Phase
Review and address critical DFx (as required)
Prototype Phase
Receive Prototypes
Request for Post-DFM/ Post Build Report