1. 積體電路元件與製程
半導體物理
半導體元件 PN junction
CMOS 製程

2. Map of Nano CMOS CMOS Processes MEMS Processes
How to determine the structure
Semiconductor Physics
Nano CMOS

3. CMOS 製程
Categories of silicon technology

4. CMOS

5. Intel Pentium III

6. Design and Layout Typical monolithic VCO core
circuit in MOS and bipolar
D Flip-Flop

7. CMOS processes CMOS Processes Oxidation Diffusion Ion implantation
Deposition
Etching.

8. Silicon Wafer Manufacturing
Semiconductor manufacturing begins with production of the wafer, i.e.,a thin, round slice of a semiconductor material varying in size from 3 to 8 inches, and now also extending to 12 inches in diameter. The finishedwafer is approximately 12~15 mil thick.
The materials are primarily silicon;however, gallium arsenide, silicon carbide, germanium and others undergo similar processes. In our process, purified polycrystalline silicon created from sand, one of the most abundant materials available on our planet, is heated to a molten liquid. A small piece of solid silicon (seed) is placed on top of the molten liquid. As the seed is slowly with drawn (by mechanical means) from the melt, the liquid quickly cools to form a single crystal ingot.

9. Thermal Oxidation
Wafers are pre-cleaned using high-purity deionized water and various
low-particulate chemicals, a must for high-yield production. The silicon wafers are heated to approximately 1000 C and exposed to ultra-pure
oxygen in the oxidation furnace. Under carefully controlled conditions,
we form a silicon dioxide insulator film of uniform thickness on the
surface of the wafer.

10. Silicon dioxide growth at the surface of a silicon wafer.

11. Etching
Degree of anisotropy

12. Photolithography
Masking is used to protect one area of the wafer while working on another. This process is referred to as photolithography. A photo resist, light-sensitive film is spin coated onto the wafer, giving it characteristics similar to a photographic film. A (micro) aligner aligns the wafer to a
glass mask and then projects an intense ultraviolet light through the mask, exposing the photo resist with the mask pattern, thereby transferring the image from the mask into the light-sensitive film.

13. Photolithography

14. Pattern Transfer

15. Thermal Oxidation II.

16. CMOS Processes I.

17. CMOS Processes II.

18. CMOS Processes III.

19. CMOS Processes IV.

20. Assembly