1. ROCHESTER INSTITUTE OF TECHNOLOGY MICROELECTRONIC ENGINEERING
Surface MEMS Fabrication Blog
Dr. Lynn Fuller, Adam Wardas
Webpage:
Microelectronic Engineering
Rochester Institute of Technology
82 Lomb Memorial Drive
Rochester, NY
Tel (585)
Department webpage:
MEMS_Fabrication_Blog_Template.ppt

2. INTRODUCTION
This document is a blog addressing the fabrication and testing of the MEMS wafers that were made as part of the MCEE770 MEMS Fabrication class. The students in the class provided individual design layouts that were merged into a single project chip design used to create the reticles for this project. Other documents provide details addressing the design, layout and fabrication for this project.
Change the title
Change Today’s Goal
Provide Some Details, Pictures (include student in pictures)
Authors at the bottom (all participating in lab)
Date work done
Can be a couple of pages
to Dr. Fuller

3. ZERO ETCH AND PHOTORESIST STRIP
Today’s Goal: Steps 1-5; Coat the wafers with photoresist, expose with ASML stepper, develop and plasma etch ASML alignment marks on ten wafers.
Etch Silicon using Drytek Quad 482 Etcher –
Cleaning of chamber 3 for 5 min. in O2 plasma
Etching the device wafer for 2 min. in CF4, CHF3 and O2 plasma
Resistivity capture of wafer
Inspection of alignment marks on wafer
Removal of Photoresist using GaSonics - (recipe FF)
Microscope images of alignment marks before and after P.R. removal
Before P.R. removal
After P.R. removal
Drytek Quad
GaSonics PR Asher
October 14, 2016
Authors: Amoia, Anderson, Halpern, Moore