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Lower Power and Deep Submicron VLSI Design

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Presentation on theme: "Lower Power and Deep Submicron VLSI Design"— Presentation transcript:

1 Lower Power and Deep Submicron VLSI Design
저자: 조준동 성균관대학교 전기전자컴퓨터공학부

2 Lower Power Design Guide
성균관대학교 조 준 동 교수

3 Contents 1. Intoduction Trends for High-Level Lower Power Design
2. Power Management Clock/Cache/Memory Management 3. Architecture Level Design Architecture Trade offs, Transformation 4. RTL Level Design Retiming, Loop-Unrolling, Clock Selection, Scheduling, Resource Sharing, Register Allocation 5. partitioning 6. Logic Level Design 7. Circuit Level Design 8. Quarter Sub Micron Layout Design Lower Power Clock Designs 9. CAD tools 10. References

4 1. Introduction

5 Motivation Portable Mobile (=ubiquitous =nomadic)
Systems with limited for heat sinks Lowering power with fixed performance: DSPs in modems and cellular phones Reliability: Increasing power ! increasing electromigration, 40-year reliability guarantee (product life cycle of telecommunication industries) Adding fans to reduce power cause reliability to plummet. Higher power leads to higher packaging costs: 2-watt package can be four times greater than a 1-watt package Myriad Constraints: timing, power, testability, area, packaging, time-to-market. Ad-Hoc Design: Lack a systematic process leading to universal applicability.

6 Power!Power!Power!

7 Power Dissipation in VLSI’s
clock clock memory clock I/O clock logic MPU1 MPU1 ASSP1 memory ASSP2 memory memory logic I/O logic MPU1: low-end microprocessor for embedded use MPU2: high-end CPU with large amount of cache ASSP1: MPEG2 decoder ASSP2: ATM switch

8 Current Design Issues in Lower Power Problem
Energy-hungry Function by Network Server: Infopad (univ. of California, Berkeley), weight < 1 pound, 0.5W (reflective color display) + 0.5W (computation,communication, I/O support) = 1W (Alpha chip: 25W StrongARM: 215 MHz at 2.0V:0.3W) runtime 50 hours, target: 100MIPS/mW. Deep-sub micron ( ) with low voltage for portable full motion video terminal; 0:5m : 40 AA NiMH; 1m : 1 AA NiMH System-On-A-Chip to reduce external Interconnection Capacitances Power Management: shut down idle units Power Optimization Techniques in Software, Architecture,Logic/Circuit, Layout Phases to reduce operations, frequency, capacitance, switching activity with maintaining the same throughput.

9 Battery Trends

10 Road-Map in Semiconductor Device Integration

11 Road-Map in Semiconductor Device Complexity

12 Power Component Static: Leakage current(<< 1%) Dynamic:
Short Circuit power(10-30%): Short circuit ow during transitions, Switching (or capacitive) power(70-90%): Charging/discharging of capacitive loads during transitions

13 Vdd vs Delay use architecture optimization to compensate for slower operation, e.g., Parallel Processing and Pipelining for concurrent increasing and critical path reducing. Scale down device sizes to compensate for delay (Interconnects do not scale proportionately and can become dominant)

14 Good Design Methodologies

15 Synthesis and Optimization
Pareto point

16 2. Power Management

17 Power Consumption in Multimedia Systems
LCD: 54.1%, HDD 16.8%, CPU 10.7%, VGA/VRAM 9.6%, SysLogic 4.5%, DRAM 1.1%, Others: 3.2% 5-55 Mode: Display mode: CPU is in sleep-mode (55 minutes), LCD (VRAM + LCDC) CPU mode: Display is idle ( 5 minutes), Looking up - data retrival Handwrite recognition - biggest power (memory, system bus active)

18 Power Management SPM DPM
(Static Power Management): saving of the power dissipation in the steady mode. When the system (or subsystem) remains idle for a significant period time, then the entire chip (or subsystem) is shut-down. Identify power hungry modules and look for opportunities to reduce power If f is increased, one has to increase the transistor size or Vdd. DPM (Dynamic Power Management): stops the clock switching of a specific unit generated by clock generators. The clock regenerators produce two clocks, C1 and C2 . The logic: 0.3%, 10-20% of power savings.

19 Power Management(christian.piguet@csemne.ch)
use right supply and right frequency to each part of the system If one has to wait on the occurence of some input, only a small circuit could wait and wake-up the main circuit when the input occurs. Another technique is to reduce the basic frequency for tasks that can be executed slowly. PowerPC 603 is a 2-issue (2 instructions read at a time) with 5 parallel execution units. 4 modes: Full on mode for full speed Doze mode in which the execution units are not running Nap mode which also stops the bus clocking and the Sleep mode which stops the clock generator Sleep mode which stops the clock generator with or without the PLL (20-100mW). Superpipelined MIPS R4200 : 5-stage pipleline, MIPS R4400: 8 stage, 2 execution units, f/2 in reduce mode.

20 TI Two DSPs: TMS320C541, TMS320C542 reduce power and chip count and system cost for wireless communication applications C54X DSPs, 2.7V, 5V, Low-Power Enhanced Architecture DSP (LEAD) family: Three different power down modes, these devices are well-suited for wireless communications products such as digital cellular phones, personal digital assistants, and wireless modem,low power on voice coding and decoding The TMS320LC548 features: 15-ns (66 MIPS) or 20-ns (50 MIPS) instruction cycle times 3.0- and 3.3-V operation 32K 16-bit words of RAM and 2K 16-bit words of boot ROM on-chip Integrated Viterbi accelerator that reduces Viterbi butterfly update in four instruction cycles for GSM channel decoding Powerful single-cycle instructions (dual operand, parallel instructions, conditional instructions) Low-power standby modes

21 Power Estimation Techniques
Circuit Simulation (SPICE): a set of input vectors, accurate, memory and time constraints Monte Carlo: randomly generated input patterns, normal distributed power per time interval T using a simulator switch level simulation (IRSIM): defined as no. of rising and falling transitions over total number of inputs Powermill (transistor level): steady-state transitions, hazards and glitches, transient short circuit current and leakage current; measures current density and voltage drop in the power net and identifies reliability problem caused by EM failures, ground bounce and excessive voltage drops. DesignPower (Synopsys): simulation-based analysis is within 8-15% of SPICE in terms of percentage difference (Probability-based analysis is within 15-20% of SPICE).

22 Cache/Memory Management
Clock and memory consumes between 15% to 45% of the total power in digital computers As block size increases, the energy required to service miss increases due to increased memory access external-memory access (530 mA) vs. on-chip access(300mA): Replacing excessive accesses to background memory by foreground memory Cache vertical partitioning (buffering): multi-level variable-size caches Caches are powerdown when idle. Cache horizontal partitioning (subarray access): several segments can be powered individually. Only the cache sub-bank where the requested data is located consumes power in each cache access. Using distributed memory instead of a single centralized memory Locality of reference to eliminate expensive data transfer across high capacitance busses Cache misses consume more energy (directed-mapping or k-associated mapping?), page faults consume more energy

23 Power Management Block Power Management (Sleep, standby mode) Scheme by Enabling Clock Clock Power Management Scheme by adding Clock Generation block

24 3. Architectural Level Design

25 Architectural-level Synthesis
Translate HDL models into sequencing graphs. Behavioral-level optimization: Optimize abstract models independently from the implementation parameters. Architectural synthesis and optimization: Create macroscopic structure: data-path and control-unit. Consider area and delay information Hardware compilation: Compile HDL model into sequencing graph. Optimize sequencing graph. Generate gate-level interconnection for a cell library. of the implementation.

26 Power Measure of P

27 System-Level Solutions
Spatial locality: an algorithm can be partitioned into natural clusters based on connectivity Temporal locality: average lifetimes of variables (less temporal storage, probability of future accesses referenced in the recent past). Precompute physical capacitance of Interconnect and switching activity (number of bus accesses) Architecture-Driven Voltage Scaling: Choose more parallel architecture Supply Voltage Scaling : Lowering V dd reduces energy, but increase delays

28 Software Power Issues Upto 40% of the on-chip power is dissipated on the buses ! System Software : OS, BIOS, Compilers Software can affect energy consumption at various levels Inter-Instruction Effects Energy cost of instruction varies depending on previous instruction For example, XORBX 1; ADDAX DX; Iest = (319:2+313:6)=2 = 316:4mA Iobs =323:2mA The difference defined as circuit state overhead Need to specify overhead as a function of pairs of instructions Due to pipeline stalls, cache misses Instruction reordering to improve cache hit ratio

29 Avoiding Wastful Computation
Preservation of data correlation Distributed computing / locality of reference Application-specific processing Demand-driven operation Bus-Inverted Coding Transformation for memory size reduction Consider arrays A and C are already available in memory When A is consumed another array B is generated; when C is consumed a scalar value D is produced. Memory Size can be reduced by executing the j loop before the i loop so that C is consumed before B is generated and the same memory space can be used for both arrays.

30 Avoiding Wastful Computation

31 Architecture Lower Power Design
Optimum Supply Voltage Architecture through Hardware Duplication (Trading Area for Lower Power) and/or Pipelining complex and fewer instruction requires less encoding, but larger decode logic! Use small complex instruction with smaller instruction length (e.g., Hitachi SH: 16-bit fixed-length, arithmetic instruction uses only two operands, NEC V800: variable-length instruction decoding overhead ) Superscalar: CPI < 1: parallel instruction execution. VLIW architecture.

32 Variable Supply Voltage Block Diagram
Computational work varies with time. An approach to reduce the energy consumption of such systems beyond shut down involves the dynamic adjustment of supply voltage based on computational workload. The basic idea is to lower power supply when the a fixed supply for some fraction of time. The supply voltage and clock rate are increased during high workload period.

33 Power Reduction using Variable Supply
Circuits with a fixed supply voltage work at a fixed speed and idle if the data sample requires less than the maximum amount of computation. Power is reduced in a linear fashion since the energy per operation is fixed. If the work load for a given sample period is less than peak, then the delay of the processing element can be increased by a factor of 1/workload without loss in throughput, allowing the processor to operate at a lower supply voltage. Thus, energy per operation varies.

34 Data Driven Signal Processing
The basic idea of averaging two samples are buffered and their work loads are averaged. The averaged workload is then used as the effective workload to drive the power supply. Using a pingpong buffering scheme, data samples In +2, In +3 are being buffered while In, In +1 are being processed.

35 Architecture of Microcoded Instruction Set Processor

36 Power and Area 1.5V and 10MHz clock rate: instruction and data memory accesses account for 47% of the total power consumption.


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