1. EFW DFB Systems Assurance
Trent Taylor
LASP

2. DFB LASP QA Organization
LASP Engineering Director
Configuration
Management
LASP Flight Assurance
Manager
Quality Assurance
Engineer
Quality Assurance
Build Configuration
Verification
Safety
Inspections
Personnel
Safety
PMPCB, FRB, MRB
Flight Hardware
Safety
Documentation
and Records
ESD Control
Training and
Certification
Contamination
Control
Support Flight H/W
& S/W Testing
Lab Inspections

3. DFB PA Requirements and Safety
Performance Assurance Matrix Status
No open issues
No waiver/deviation requests to date
System Safety
LASP provided initial safety input with CDRL MA-006 for PDR.
There are no safety compliance issues with the EFW DFBs.
LASP will provide any further safety input upon request.

4. DFB Suppliers and GIDEP
LASP procures all flight parts and materials through vendors on LASP’s approved vendor list.
LASP procures EEE parts directly from the manufacturer or through authorized distributors.
LASP requires full traceability on all flight procurements.
Program requirements are flowed through procurement documentation. Where necessary, procurement documentation may include source control documents (SCDs) and engineering documentation.
LASP’s DFB contains no custom or non-standard EEE parts.
LASP’s DFB procurements required no additions to the LASP approved vendor list.
GIDEP Status
LASP has responded to APL GIDEP evaluation requests meeting all delivery dates.
There are no current GIDEP “hits” – no parts on the DFB are impacted by any Alert or Advisory.

5. Radiation Engineering Approval Screening/Qual Approval
DFB EEE Parts
Parts
All EEE parts are procured to program requirements with no additional screening required with the exception of the following:
JANTXV cavity devices (3 part types): GSFC will PIND test these parts.
AD648/883B (OpAmp): GSFC will screen and qualify to EEE-INST-002 Level 2. No additional radiation testing is required.
OP262GS (dual Op Amp - Plastic COTS). Parts were radiation tested by APL. GSFC will screen and qualify to EEE-INST-001 requirements.
VTF TBX (Resistor Network – COTS): GSFC will screen and qualify to EEE-INST-002 Level 2.
Parts
CE Approval
Radiation Engineering Approval
Screening/Qual Approval
PMPCB Approval
TOTAL
EEE Parts 63
Detectors
ASICs
Hybrids 2

6. DFB Materials & Processes
Materials and Processes
MIL is up-to-date
Regular meetings with PMPCB
Will add PWB data when ordered (will be per required IPC specs)
Limited Life Items
DFB has no limited life items
M&P Category
Submitted
Approved
Pending
Non-Metallic Materials 13 12 1
Metallic Materials 2
Fasteners 5 4
Processes

7. DFB Configuration Management
LASP uses Agile software for Configuration Management
Documents submitted, reviewed, and approved electronically
All documents and records are searchable
As-built records and as-run test procedures archived
Follow LASP’s Document & Record Control Procedure
Assembly Travelers (ATs) generated and archived in the system
Flight Drawing/Document Status
Drawings
Release Date
Documents
Schematic
9/18/09
DFB Spec
Released Rev D
Layout
FPGA Spec
Draft 10/01/09, Prelim 12/01/09,
Final 02/01/10
Fab, Assembly Instructions
10/01/09
Test Plan
Prelim 10/01/09, Final 12/01/09
Test Results
1st Qtr ‘10

8. DFB Contamination & ESD Control
Contamination Control
All assembly performed at laminar flow-benches
Class 10,000 cleanrooms available
Packaging and shipping provisions to maintain low contamination exposure during transport
ESD Control
QA owns and implements the ESD control program
LASP’s ESD Control Procedure meets ANSI/ESD S20.20 requirements
All applicable personnel trained and certified by LASP’s NASA-trained Level B instructor
Training certifications required for lab entry

9. DFB Inspections
Mandatory Inspection Points and photo documentation specified in Fabrication & Assembly Instructions (FAIs) within ATs
Plans to be worked out with APL for their MIPs
Audit Assembly Traveler data package at each inspection point
Check sign-offs, traceability, document revisions, etc.
Verify acceptable lab temperature and humidity
PWAs
Inspect solder workmanship to NASA-STD and .3
Parts placement and orientation – per engineering drawings and FAIs
Polymerics
Inspect per NASA-STD , FAIs, drawings, and in-house standards
Check mix records, durometer hardness of cure samples
Cables, Harnesses, Wiring
Inspect crimps, solder and other workmanship to NASA standards
Dimensions, shield terminations, shrink sleeve, etc. to FAIs, drawings, etc.
Other Inspections
Incoming/Receiving; Kitting; Pre-cap; Calibration of Equipment; Acceptance
and Environmental Test Set-up; Flight Connector Safe-to-Mate

10. DFB Non-Conformance Reporting
Non-conformances addressed per LASP’s Anomaly Reporting Plan
Reporting Methods
- Fabrication and Assembly Discrepancy Report (FADR)
For rework-type non-conformances identified during fabrication/assembly
- Non-Conformance Report (NCR)
Level 1 NCR- for minor discrepancies
Level 2 NCR- for test failures or any other anomaly that the Integrated Project
Development Team (IPDT) determines to warrant Level 2.
- Dispositions include: scrap, rework, return to supplier, refer to MRB
Processing of Level 2 NCRs is consistent with standard Failure Review
Board (FRB) practices.
- Material Review Board (MRB) report
Dispositions include: scrap, rework, return to supplier, repair by standard or
non-standard procedures, use as-is, request for waiver

11. DFB Material Review Board (MRB) Process
The LASP MRB will be chaired by the Project Manager or designee, and will at a minimum include QA and cognizant lead engineer(s) for MRB actions resulting in Class 2 changes.
JHU/APL participation is required when MRB recommendation is to use as-is, repair, or causes a Class I change.
A Class 1 change is defined as one that may, or will, result in a product that:
Does not meet established functional or performance specifications
Does not meet established physical envelope and/or ICDs
Does not meet the established electrical ICDs
Significantly and adversely affects cost and/or schedule
Requires repairs other than approved standard repairs
Will not meet structural, thermal, EMI/EMC, and/or ionizing radiation requirements
Class 2 changes are those that do not fall within the parameters of a Class 1 change.
Any condition requiring MRB action will be documented as a non-conformance.

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