1. EuCARD
Status: September 2010

2. Activities of AIT
Manufacturing of Cu-Dia composite plates with 150 mm x 150 mm using direct heated hot pressing method for further characterisation
Machining of samples for mechanical testing, CTE measurement and thermal diffusivity by water jet cutting
Thermal Diffusivity Analysis at room temperature (total 40 samples)
Testing of mechanical properties at high temperature (done at University of Vienna)
Design and manufacturing of graphite die for direct bonding experiment of SiC on copper-diamond composite (in progress)
First evaluation of Mo-diamond composites (in progress)

3. Manufacturing of Cu-diamond composite
Manufacturing of Cu-diamond plates with 60 vol.%
Water jet cutting of samples for:
Thermal Diffusivity
CTE
Mechanical Testing
Measurement of mechanical properties at high temperature
Samples have been forwarded to CERN for further distribution of samples
Measurement of RT thermal diffusivity of 40 samples: /- 18 mm²/s
Measurement of CTE on 5 samples: CTE ~6 ppm/K at 100°C.
150 mm x 150 mm

4. Resonant Beam Technique
Resonant Beam Technique, European Standard EN 15335:2007 Advanced technical ceramics - ceramic composites - elastic properties by resonant beam method up to 2000 °C and
Fine ceramics (advanced ceramics, advanced technical ceramics) – test method for elastic moduli of monolithic ceramics at room temperature by sonic resonance, International Standard ISO 17561:2002.
Sample Size: 45x4x3 mm3

5. Set-up for Resonant Beam Test

6. Mechanical Properties
Mechanical RT
Temperature E
Error G
RHP_334-02
M-1 26
238 8
230
114
M-2 25
214 6
212
104
M-3
205 7
198
96,4
Mean-Value
219
213
105

7. Young´s Modulus and Shear Modulus

8. First experiments with Mo-Diamond
First experiments with Mo-Diamond composites did not result in promising results (poor densification; high required consolidation temperature cause degradation of diamonds – even when using rapid consolidation
First experiments with Mo-Cu-Diamond, but full densification was not achieved up to now (<90%). This resulted in low thermal conductivities (<100 W/mK).

9. Next steps
Further experiments with Mo-Cu-Diamond => increasing of Cu content
Direct bonding of SiC during hot pressing of metal-diamond material