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Overview Motivation (Kevin) Thermal issues (Kevin)

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Presentation on theme: "Overview Motivation (Kevin) Thermal issues (Kevin)"— Presentation transcript:

1 Overview Motivation (Kevin) Thermal issues (Kevin)
Power modeling (David) Thermal management (David) Optimal DTM (Lev) Clustering (Antonio) Power distribution (David) What current chips do (Lev) HotSpot (Kevin)

2 Power and thermal management
What current chips do Power and thermal management

3 Controllers Inputs (power, temperature, etc.) Response time Tuning
Simplicity of implementation Performance, reliability Power management / thermal management

4 Controllers (cont’d) ? A non-trivial tradeoff Performance Reliability
Cost

5 * Other names and brands may be claimed as the property of others
Real processors: IBM* PowerPC* G3/G4 Cache throttling AMD* PowerNow!* Technology Transmeta* Longrun* technology Intel® SpeedStep® technology Enhanced Intel® SpeedStep technology * Other names and brands may be claimed as the property of others

6 PowerPC G3 Microprocessor
On-chip temperature sensor (junction temperature) Based on differential voltage change across 2 diodes of different sizes Implemented in PowerPC G3/G4 processors OS required for control Instruction Cache Throttling used to dynamically lower junction temperature From Micro-35 tutorial

7 Transmeta LongRun** LongRun power management Crusoe* processor***
Code Morphing* software (processor-internal) Performance demands are determined by sampling the idle time Crusoe* processor*** Voltage changes in steps of 25 mV Frequency changes in steps of 33 MHz *Other names and brands may be claimed as the property of others ** Source: *** Data dated 2001

8 Transmeta LongRun (cont’d)
Idle time  decrement V&f Activity  increment V&f (if possible) Performance mode  V&f adjustment Source:

9 Previous Intel microprocessors1
Thermal monitor mechanism A two-point mechanism using voltage scaling (for battery life) 1Information on Intel microprocessors is based on Efraim Rotem’s presentation in the TACS workshop 06/2004

10 Thermal monitor Based on clock throttling
Full operational mode: maximal frequency Minimal operation mode: clocks are stalled for a part of the duty cycle Activation options: By OS (e.g., ACPI) By a special hardware

11 Static voltage scaling (for battery life)
Performance mode Maximal frequency & Vcc AC outlet or set by user Power saving mode Low frequency & Vcc Upon request or while the user changed the usage mode

12 The Intel Pentium® M Processor
Targets the mobile market Improved power efficiency Advanced ACPI interface Enhanced SpeedStep architecture

13 DVS in the Pentium M Processor
Changes both voltage and frequency at the runtime Efficiently switches between different DVS control points

14 Thermal sensors Two thermal sensors
Maximal temperature reached  throttling Critical shutdown point reached  shutdown

15 Operation modes Software control mechanism (e.g., ACPI) Self throttle
Track the junction temperature Initiate the appropriate policy Self throttle Digital temperature detector initiates one of the power control cycles Used as a fail-safe mechanism since it is much faster than the software

16 Enhanced Intel SpeedStep technology
Implements DVS Upon a thermal trigger or SW request, CPU halts execution and locks PLL at a new frequency (a few msec) Once finished, the Vcc starts changing to the new value (order of 1mV/msec) Transition up is done in the reverse order

17 DVS cycle

18 DVS transitions Frequency transition is fast enough to allow non-interrupted application execution DVS transitions can be utilized for energy and thermal control during the normal operation flow The target frequency and voltage are programmable by BIOS or OS Support for multiple voltage/ frequency points

19 Adaptive policy (for battery life)
Uninterrupted power state transition User selectable policy Increases frequency on demand, and decreases power and frequency while idle for a long time

20 Info More specific information on Pentium M will be available at Efraim Rotem’s presentation in the TACS workshop 06/2004

21 ACPI and OSPM1 ACPI = Advanced Configuration and Power Interface (an open industry specification) OSPM = Operating System-directed configuration and Power Management Cooling decisions are based on the application load and the thermal heuristics of the system 1Source: The ACPI specification 2.0, see

22 Cooling policies Active cooling – a direct action by OSPM (e.g., turning on a fan) Passive cooling – reducing the power consumption (e.g., throttling) Critical trip points – shutdown

23 Example of SW-based clock throttling
DP[%] = _TC1 * (Tn – Tn-1) + _TC2 * (Tn –Tt) Tn – current temperature Tt – target temperature Pn = Pn-1 + HW[-DP] Pn is in % The coefficients are set by the OEM


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